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ISS-003 - Intel(R) Server Specialist Certification - Dump Information

Vendor : Intel
Exam Code : ISS-003
Exam Name : Intel(R) Server Specialist Certification
Questions and Answers : 186 Q & A
Updated On : December 14, 2018
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ISS-003 Questions and Answers

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ISS-003 Intel(R) Server Specialist Certification

Study Guide Prepared by Killexams.com Intel Dumps Experts


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ISS-003 exam Dumps Source : Intel(R) Server Specialist Certification

Test Code : ISS-003
Test Name : Intel(R) Server Specialist Certification
Vendor Name : Intel
Q&A : 186 Real Questions

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Intel Intel(R) Server Specialist Certification

Micron's Breakup With Intel can also prove costly | killexams.com Real Questions and Pass4sure dumps

back in July, microprocessor enormous Intel (NASDAQ: INTC) and reminiscence specialist Micron (NASDAQ: MU) announced that they deliberate to part ways in the construction of future types of a reminiscence expertise called 3D XPoint. 3D XPoint points nonvolatile reminiscence, this is, memory that retains the tips this is written to it even when it would not have vigour. It guarantees superior efficiency and patience over greater ordinary NAND flash memory, albeit at a higher expense.

each organizations have indicated that they intend to proceed the building of future models of 3D XPoint, however they will be working absolutely one after the other now in preference to pooling their elements.

Intel 3D XPoint-based storage drives.© Intel Intel 3D XPoint-based mostly storage drives.

On Oct. 18, Micron also introduced that it would be exercising its name choice on Intel's stake of their reminiscence three way partnership, known as IM Flash technologies.

Intel had previously instructed buyers to expect that its memory enterprise, formally known as its nonvolatile reminiscence options community, or NSG for short, would be ecocnomic for the whole lot of 2018. youngsters, on the enterprise's Oct. 25 income call, Intel interim CEO and CFO Bob Swan up-to-date that outlook, pointing out that, "as a result of pursuing 3D XPoint building independently and a more difficult NAND pricing ambiance, we now are expecting NSG to be approximately breakeven for the complete 12 months." 

whereas or not it's straightforward to remember why falling NAND flash costs would preclude Intel's reminiscence profitability goals, the effect of the breakup with Micron on profitability might be a little less clear. Let's take a better seem to be. 

Going at it by myself capacity greater funds spent

Manufacturing memory chips -- whether they may be NAND flash, DRAM, or 3D XPoint -- is something it truly is extremely analysis-and-construction-intensive. As which you could see, Micron's investments in R&D, admittedly to aid a broader set of memory technologies than Intel should put money into, had been steadily on the upward push. 

MU Research and Development Expense (TTM)© YCharts MU analysis and development fee (TTM)

When Intel and Micron had been working together, the organizations shared the burden of deciding a way to build those chips, which most likely intended that the full cost of protecting the research and construction pipeline become divvied up between them. 

Now, each and every corporation goes to should tackle that full analysis and building burden. or not it's little wonder, then, that the profitability of Intel's reminiscence enterprise is set to come back below pressure because of this split.

The payoff should be huge, though

Intel has been fairly vocal about how essential 3D XPoint memory expertise is to its business over the future. now not best is it important for NSG -- which, besides its NAND flash products, sells storage drives in line with 3D XPoint -- nonetheless it's additionally something that matters to the business's colossal and quickly-starting to be facts core community (DCG).

one of the most key features of Intel's next-technology server processor, known as Cascade Lake, is that it's going to support memory modules in line with 3D XPoint, called Optane DC Persistent memory. during the business's third-quarter salary name, Swan referred to that Intel "shipped [its] first salary contraptions of Optane DC Persistent memory to Google, Microsoft, and Alibaba, and we're already receiving splendid feedback."

on the business's investor meeting lower back in February 2017, then-DCG chief Diane Bryant showed a slide indicating that by means of 2021, the served addressable market for Optane DC Persistent memory items would work out to roughly $8 billion. salary from Optane DC Persistent reminiscence falls under the DCG unit, in place of NSG.

Between the alternatives for 3D XPoint in the storage market as well its talents to substitute DRAM in some data core purposes, i would say that the chip tremendous's investments in 3D XPoint expertise have a very good shot to repay over the long term, despite the fact that it have to spend greater to improve the expertise following its cut up with Micron.

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AMD Takes high-performance Datacenter Computing to the subsequent Horizon | killexams.com Real Questions and Pass4sure dumps

— Launches World’s first 7nm high-performance GPU for computing device researching and AI; Demonstrates World’s First excessive-performance 7nm x86 CPU Powered through “Zen 2” Processor Core and leap forward Chiplet Design —

— Amazon internet capabilities declares immediate Availability of AMD EPYC processor-powered models of Its generic illustration households —

SAN FRANCISCO, Nov. 06, 2018 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) nowadays validated its complete commitment to datacenter computing innovation at its subsequent Horizon experience in San Francisco by using detailing its upcoming 7nm compute and portraits product portfolio designed to prolong the capabilities of the modern datacenter. all over the experience, AMD shared new specifics on its upcoming “Zen 2” processor core architecture, detailed its modern chiplet-based x86 CPU design, launched the 7nm AMD Radeon instinct™ MI60 pictures accelerator and offered the first public demonstration of its subsequent-technology 7nm EPYC™ server processor codenamed “Rome”. Amazon web features (AWS), the world’s most complete and extensively adopted cloud platform company, joined AMD on the experience to announce the provision of three of its regular example families on the Amazon Elastic Compute Cloud (EC2) powered with the aid of the AMD EPYC™ processor.

“The multi-12 months investments we've made in our datacenter hardware and application roadmaps are driving transforming into adoption of our CPUs and GPUs across cloud, enterprise and HPC valued clientele,” talked about Dr. Lisa Su, president and CEO, AMD. “we're smartly located to speed up our momentum as we introduce the industry’s broadest, strongest portfolio of datacenter CPUs and GPUs featuring industry-leading 7nm technique know-how over the coming quarters.”

AMD Compute structure Updates

AMD for the primary time precise its upcoming “Zen 2” excessive-performance x86 CPU processor core that is the outcome of a modern modular design methodology. This modular system design uses an superior edition of AMD Infinity cloth interconnect to link separate items of silicon (“chiplets”) within a single processor equipment. The multi-chip processor makes use of 7nm technique expertise for the “Zen 2” CPU cores that advantage from the advanced method technology, whereas leveraging a mature 14nm method know-how for the enter/output element of the chip. The outcomes is much better efficiency – extra CPU cores on the same vigour, and greater competitively priced manufacture than natural monolithic chip designs.

Combining this step forward design methodology with the advantages of TSMC’s leading-facet 7nm method know-how, “Zen 2” gives you huge performance, power consumption and density generational improvements that may support cut back datacenter working charges, carbon footprint and cooling necessities. other key generational advances over the award-profitable “Zen” core consist of:

-- An superior execution pipeline, feeding its compute engines greater efficiently. -- front-end advances – improved branch predictor, stronger instruction pre-fetching, re-optimized guideline cache and greater op cache. -- Floating aspect enhancements – doubled floating aspect width to 256-bit and load/save bandwidth, expanded dispatch/retire bandwidth and maintained excessive throughput for all modes. -- superior protection features – Hardware-improved Spectre mitigations, taking application migration and hardening it into the design, and increased flexibility of reminiscence encryption.

distinct 7nm-based AMD products are now in building, together with next-technology AMD EPYC CPUs and AMD Radeon instinct GPUs, both of which AMD certain and verified at the adventure. additionally, the enterprise shared that its observe-on 7nm+-based “Zen 3” and “Zen 4” x86 core architectures are on-song.

AMD EPYC Server CPU Updates

Reinforcing the growing momentum completed with its present-technology AMD EPYC processors, Matt Garman, vp of compute capabilities at AWS joined AMD on-stage at the adventure to announce the instant availability of the first AMD EPYC processor-primarily based circumstances on Amazon Elastic Compute Cloud (EC2). a part of AWS’s familiar illustration families, the brand new AMD EPYC processor-powered choices function business-main core density and reminiscence bandwidth. This outcomes in first rate efficiency-per-greenback for regularly occurring aim and memory-optimized workloads, driven with the aid of the core density of AMD EPYC processors that present M5a and T3a consumers a stability of compute, memory, and networking substances for web and utility servers, backend servers for business applications, and test/building environments with seamless application migration. For R5a shoppers, the reminiscence bandwidth abilities of AMD EPYC processors is highest quality for in-memory processing, information mining, and dynamic information processing.

AMD also disclosed new particulars and delivered performance previews of its subsequent-era EPYC processors codenamed “Rome”:

-- Processor enhancements together with as much as 64 “Zen 2” cores, increased guidance-per-cycle1 and leadership compute, I/O and reminiscence bandwidth2. -- Platform enhancements including the industry’s first PCIe 4.0-competent x86 server processor with double the bandwidth per channel3 to dramatically increase datacenter accelerator efficiency. -- Double the compute performance per socket4 and four times the floating point efficiency per socket5 in comparison to current AMD EPYC processors. -- Socket compatibility with nowadays’s AMD EPYC server platforms.

AMD verified the efficiency and platform merits of its next-generation EPYC processor with two demos throughout the experience:

-- A pre-construction single-socket next-generation AMD EPYC processor outperforming a commercially obtainable probably the greatest Intel dual processor Xeon server working the computationally-intensive, industry general “C-Ray” benchmark6. -- The business’s first x86 PCIe four.0-able platform demo, featuring a Radeon instinct MI60 processor to speed up image recognition.

“Rome” is sampling with clients now and is anticipated to be the world’s first high-performance x86 7nm CPU.

AMD Datacenter images Updates

AMD launched the world’s first 7nm GPUs and the business’s best hardware-virtualized GPUs – the AMD Radeon instinct MI60 and MI50 – which can be scheduled to ship to purchasers this quarter. These new pix playing cards are in line with the high-efficiency, flexible “Vega” structure and are certainly designed for desktop gaining knowledge of and synthetic intelligence (AI), supplying greater ranges of floating-element performance7, more advantageous efficiencies8 and new facets for datacenter deployments. A reside demonstration right through the adventure showed the flagship AMD Radeon intuition MI60 working real-time practicing, inference and photo classification.

in addition to new hardware announcements AMD also announced ROCm 2.0, a new version of its open application platform for accelerated computing that contains new math libraries, broader utility framework help, and optimized deep researching operations. ROCm 2.0 has additionally been upstreamed for Linux kernel distributions, extending ROCm access to millions of Linux developers and clients. Designed for scale, ROCm permits shoppers to deploy high-efficiency, power-efficient heterogeneous computing programs in an open ambiance.

displays from the adventure are available now on at www.amd.com/NextHorizon. A full replay might be attainable inside 12 hours and should stay available for about twelve months.

-- discuss with the subsequent Horizon event webpage for event materials -- become a fan of AMD on fb -- follow AMD on Twitter

For more than forty five years AMD has driven innovation in excessive-efficiency computing, photographs and visualization technologies ― the building blocks for gaming, immersive systems and the datacenter. lots of of hundreds of thousands of consumers, leading Fortune 500 companies and cutting-edge scientific research facilities around the world rely on AMD know-how daily to increase how they reside, work and play. AMD employees world wide are focused on building exceptional items that push the boundaries of what's feasible. For more assistance about how AMD is enabling nowadays and galvanizing day after today, consult with the AMD (NASDAQ: AMD) website, weblog, facebook and Twitter pages.

This press liberate consists of ahead-looking statements concerning advanced Micro devices, Inc. (AMD) including the aspects, functionality, availability, timing, deployment and expectations of AMD future items and technologies, together with “Zen 2,” “Zen three,” “Zen four,” “Rome,” AMD Radeon instinct™ MI60 and MI50 accelerators and the ROCm 2.0 open software platform; AMD driving growing to be adoption in its CPUs and GPUs across cloud, enterprise and HPC valued clientele; AMD being neatly positioned to accelerate its momentum throughout the introduction of AMD’s datacenter portfolio in the coming quarters; and anticipated merits from EPYC™ primarily based AWS R5, M5 and T3 situations, which might be made pursuant to the protected Harbor provisions of the private Securities Litigation Reform Act of 1995. ahead-searching statements are generally identified via words such as "would," "intends," "believes," "expects," "may," "will," "may still," "seeks," "intends," "plans," "seasoned forma," "estimates," "anticipates," or the bad of those words and phrases, different diversifications of these phrases and phrases or related terminology. traders are counseled that the ahead-looking statements in this doc are based on present beliefs, assumptions and expectations, talk simplest as of the date of this document and contain risks and uncertainties that might trigger specific consequences to differ materially from present expectations. Such statements are field to certain regular and unknown dangers and uncertainties, a lot of which might be complex to foretell and customarily beyond AMD's handle, that might trigger actual effects and other future events to differ materially from those expressed in, or implied or projected via, the ahead-searching information and statements. fabric factors that could cause precise effects to vary materially from present expectations consist of, with out limitation, right here: Intel service provider’s dominance of the microprocessor market and its aggressive company practices may additionally limit AMD’s means to compete quite simply; AMD has a wafer provide settlement with GF with responsibilities to purchase all of its microprocessor and APU product necessities, and a undeniable component of its GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with restrained exceptions. If GF is not able to fulfill AMD’s manufacturing requirements, its business may well be adversely impacted; AMD relies on third parties to manufacture its items, and if they are unable to do so on a timely foundation in ample quantities and the usage of aggressive technologies, AMD’s company could be materially adversely affected; failure to achieve anticipated manufacturing yields for AMD’s items might negatively have an impact on its monetary consequences; the success of AMD’s company is dependent upon its ability to introduce items on a timely foundation with facets and performance tiers that deliver price to its customers while helping and coinciding with gigantic trade transitions; if AMD can not generate enough salary and operating money move or gain exterior financing, it could possibly face a cash shortfall and be unable to make all of its planned investments in research and development or different strategic investments; the lack of a major consumer may also have a cloth opposed impact on AMD; AMD’s receipt of salary from its semi-custom SoC products is dependent upon its expertise being designed into third-birthday party items and the success of these products; AMD products can be subject to protection vulnerabilities that could have a material adversarial impact on AMD; information breaches and cyber-attacks might compromise AMD’s intellectual property or different delicate guidance, be expensive to remediate and cause massive harm to its company and popularity; AMD’s operating consequences are subject to quarterly and seasonal earnings patterns; world financial uncertainty may additionally adversely have an impact on AMD’s business and working outcomes; AMD can also not be capable of generate enough cash to provider its debt responsibilities or meet its working capital necessities; AMD has a huge quantity of indebtedness which may adversely affect its economic position and forestall it from enforcing its strategy or gratifying its contractual duties; the agreements governing AMD’s notes and the Secured Revolving Line of credit impose restrictions on AMD that can also adversely affect its means to operate its enterprise; the markets wherein AMD’s items are bought are tremendously competitive; AMD's issuance to West Coast Hitech L.P. (WCH) of warrants to buy seventy five million shares of its normal inventory, if and when exercised, will dilute the possession hobbies of its latest stockholders, and the conversion of the two.one hundred twenty five% Convertible Senior Notes due 2026 may also dilute the ownership pastime of its existing stockholders, or may additionally in any other case depress the fee of its normal stock; uncertainties involving the ordering and shipment of AMD’s products may materially adversely have an effect on it; the demand for AMD’s products depends in part available on the market situations within the industries into which they are bought. Fluctuations in demand for AMD’s items or a market decline in any of these industries might have a fabric hostile impact on its results of operations; AMD’s skill to design and introduce new products in a timely method is elegant upon third-birthday celebration highbrow property; AMD depends upon third-party companies for the design, manufacture and provide of motherboards, application and different laptop platform add-ons to help its business; if AMD loses Microsoft organisation’s aid for its products or other utility providers don't design and strengthen utility to run on AMD’s items, its capability to promote its items can be materially adversely affected; and AMD’s reliance on third-birthday celebration distributors and AIB partners subjects it to definite risks. traders are advised to evaluation in element the dangers and uncertainties in AMD's Securities and alternate commission filings, together with however no longer restrained to AMD's Quarterly document on form 10-Q for the quarter ended September 29, 2018.

AMD, the AMD Arrow brand, EPYC, Radeon and combos thereof, are emblems of advanced Micro gadgets, Inc. other names are for informational functions most effective and might be emblems of their respective house owners.

1 Estimated raise in directions per cycle (IPC) is in line with AMD inner trying out for “Zen 2” throughout microbenchmarks, measured at 4.53 IPC for DKERN +RSA compared to prior “Zen 1” generation CPU (measured at 3.5 IPC for DKERN + RSA) the use of combined floating aspect and integer benchmarks.

2 NAP-forty two – AMD EPYC™ 7601 processor helps up to eight channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667. NAP-forty three – AMD EPYC 7601 processor includes up to 32 CPU cores versus the Xeon Platinum 8180 processor with 28 CPU cores.

NAP-forty four – A single AMD EPYC™ 7601 processor presents up to 2TB/processor (x 2 = 4TB), versus a single Xeon Platinum 8180 processor at 768Gb/processor (x 2 = 1.54TB). NAP-fifty six – AMD EPYC™ processor supports up to 128 PCIe® Gen three I/O lanes (in both 1 and a pair of-socket configuration), versus the Intel® Xeon® SP sequence processor assisting a optimum of 48 lanes PCIe® Gen 3 per CPU, plus 20 lanes in the chipset (max of 68 lanes on 1 socket and 116 lanes on 2 socket).

in keeping with “Zen 2” design parameters versus “Zen1” and presently shipping products – core count raise from 32 to up to 64 per socket. memory bandwidth with up to 3200Gb/s memory pace throughout eight memory channels, I/O leadership extending to PCIeGen4.

3 Per Silicon Labs, company of the PCIe Gen 4 options. (site right here: https://www.silabs.com/neighborhood/blog.entry.html/2015/12/04/what—is—pcie—gen4a-oobp ). PCIe Gen4 is a brand new standardized data switch bus a good way to double the statistics switch cost per lane of the prior Gen3 revision from 8.0 GT/s (gigatransfers/2d) to 16.0 GT/s. This capacity that a single PCIe Gen4 interconnection will enable records rate transfers of as much as 2GB/s (gigabytes/second), and a full 16 slot PCIe Gen4 interconnection for pics cards and excessive-conclusion strong state drives will allow facts transfer costs of as much as 32GB/s.

4 checking out carried out by means of AMD Engineering as of October 2018 using AMD reference device with a pre-production “Rome” engineering sample, where “Rome” scored approximately 2x bigger in comparison to “Naples” device.

5 Estimated generational raise primarily based upon AMD inside design specifications for “Zen 2” in comparison to “Zen 1”. “Zen 2” has 2X the core density of “Zen 1”, and when expanded by 2X top FLOPs per core, on the same frequency, consequences in 4X the FLOPs in throughput.

6 Estimates based on AMD inner testing as of November 6, 2018 in AMD “Ethanol” reference equipment (Oct 2018?) AMD EPYC™-based gadget configuration with AMD “Rome” construction Chassis with an EthanolX building board that includes a single subsequent generation AMD EPYC (“Rome”) processor with a complete of XXXXX DIMMs at XXXXX; versus Intel -primarily based equipment configured with Supermicro’s SYS-1029U-TRTP; OS: Ubuntu 7.three.0-27ubuntu1~18.04; Linux: four.15.0-36-general; Compiler: GCC 7.three.0 with 2x Intel(R) Xeon(R) Platinum 8180M CPU, 24x32GB at 2666 MHz. The AMD “Rome” 1P server completes the C-Ray demo in ~ XXXXX sec and the Intel 8180M completes the benchmark in ~ XXXXX sec. Benchmark testing statistics redacted by means of AMD for confidentiality applications, full disclosure could be purchasable after launch.

7 As of Oct 22, 2018. The effects calculated on for Radeon intuition MI60 designed with Vega 7nm FinFET process expertise resulted in 29.5 TFLOPS half precision (FP16), 14.eight TFLOPS single precision (FP32) and seven.4 TFLOPS double precision (FP64) top theoretical floating-element performance. This efficiency boost is achieved with an more suitable transistor count number of 13.2 billion on a smaller die size of 331.46mm2 then old Gen MI25 GPU products with the identical 300W power envelope.

The consequences calculated for Radeon intuition MI50 designed with Vega 7nm FinFET system know-how resulted in 26.eight TFLOPS height half precision (FP16), 13.4 TFLOPS top single precision (FP32) and 6.7 TFLOPS peak double precision (FP64) floating-element performance. This performance increase is carried out with an more suitable transistor count of 13.2 billion on a smaller die measurement of 331.46mm2 than old Gen MI25 GPU products with the equal 300W vigor envelope.

The outcomes calculated for Radeon instinct MI25 GPU based on the “Vega10” structure resulted in 24.6 TFLOPS height half precision (FP16), 12.three TFLOPS top single precision (FP32) and 768 GFLOPS peak double precision (FP64) floating-factor efficiency. This performance is accomplished with a transistor count number of 12.5 billion on a die size of 494.8mm2 with 300W vigour envelope.

AMD TFLOPS calculations conducted with here equation for Radeon instinct MI25, MI50, and MI60 GPUs: FLOPS calculations are performed with the aid of taking the engine clock from the highest DPM state and multiplying it by using xx CUs per GPU. Then, multiplying that quantity by way of xx flow processors, which exist in each CU. Then, that quantity is increased with the aid of 2 FLOPS per clock for FP32 and 4 FLOPS per clock for FP16. To calculate FP64 TFLOPS fee for Vega 7nm products MI50 and MI60 a 1/2 fee is used and for “Vega10” structure primarily based MI25 a 1/sixteenth price is used.

GFLOPS per Watt ---------------------- MI25 MI50 MI60 ---- ----- ----- ----- FP16 0.082 0.089 0.098 ---- ----- ----- ----- FP32 0.041 0.045 0.049 ---- ----- ----- ----- FP64 0.003 0.022 0.025 ---- ----- ----- -----

AMD has no longer independently verified or confirmed external/third party effects/facts and bears no responsibility for any error or omissions therein.RIV-2

8 Radeon instinct™ MI60 contains 13.2 billion transistors on a equipment dimension of 331.46mm2, whereas the outdated generation Radeon intuition™ MI25 had 12.5 billion transistors on a package dimension of 494.8mm2 – a 58% development in variety of transistors per mm2.


Intel, Qualcomm Hit CES: As cell Chip combat Heats Up, Tech Giants Will Collide | killexams.com Real Questions and Pass4sure dumps

Editor’s notice: Steve Patterson’s observations and writing are in keeping with his two decades working in the primordial ooze of start-united states of americain Boston and the San Francisco Bay enviornment. observe him on Twitter @stevep2007.

at first of CES 2013, Qualcomm has an enviable dominant market place, owning half the mobile processor shipments and nearly all the LTE/4G baseband chipset shipments. nevertheless it has constrained brand consciousness compared to the Android smartphones it powers. To cement its dominance in the growing mobile market, Qualcomm needs to emerge as a purchaser manufacturer from the obscurity of being a element in smartphones bought below other agencies’ brands. otherwise, it is going to lose its price top class and valuable cause competing mobile processor manufacturers.

Intel, in contrast, has been rewarded with brand selection within the computing device and server market after decades of funding in innovative advertising that influenced patrons’ buy decisions according to laptop company’s alternative of Intel’s processor as opposed to the manufacturer’s brand. Intel, late to the cellular processor market, now should radically change its technologies into cell product shipments to counter stalled Wintel revenues. because the chart beneath from Kleiner Perkins companion Mary Meeker illustrates, Intel have to aggressively pursue the cellular market and compete with Qualcomm.

intels dilemma

Qualcomm CEO Paul Jacobs has begun 2013 with a transparent intention of strengthening Qualcomm’s company. After acting on the Charlie Rose display ultimate week, Jacobs will return to keynote CES 2013. Jacob’s theme, “Born cell,” is supposed to build company recognition for Qualcomm’s silicon chips. he's most likely hoping for a similar buyer branding consequences in consumer smartphone purchase selections that the Intel internal campaign delivered for Intel in buyer workstation purchase selections.

Intel, meanwhile, will use CES to start writing its cellular story. these days, after a yr of preparation, Intel introduced the Bay trail-T microprocessor and the Bay path-T capsules that manufacturers are constructing for both home windows 8 and Android. The Bay trail-T is a cut back to 22 nm and enhancement of the Atom Medfield chip presently in construction with a view to convey as plenty as twice the efficiency with extended battery life. The Bay path-T is a suitable Wintel microprocessor that will run home windows 8 and any windows app as smartly and Android and Android apps. here's an abilities over the ARM powered Microsoft floor that runs a Microsoft variant called windows RT that handiest runs windows purposes which have been re-coded and recompiled.

In February on the mobile World Congress in Barcelona, Intel is anticipated to replace its traders and companions on its Merrifield processor because of be launched later in 2013. Merrifield, first introduced in may additionally 2012 at Intel’s investor convention, is focused at smartphones, a decrease to 22 nm with efficiency improvements corresponding to the Bay trail-T. Intel has begun production of its LTE/4G baseband chip, based on Intel’s spokesman Jon Carville.

additionally anticipated within the first quarter in education of Intel’s mobile rally is the announcement of a successor to retiring CEO Paul Otellini who may be accountable for main Intel into the mobile period.

A Two-entrance warfare: constructing customer brand attention and the quickest, Lowest-power SoCs

Most observers define the cell gadget fight when it comes to the Apple, Android, and Samsung brands, but it surely is in reality a two-front war – the 2nd entrance being the competition to construct the greatest and built-in techniques-on-a-Chip. SoCs are such a major factor in deciding upon the ability of a mobile machine that main the cellular gadget industry is synonymous with leading SoC design. however there are many cell processor SoC competitors, there are handiest just a few, including Intel, NVidia, Qualcomm, Samsung, and upstart MediaTek, that may have an influence on this market, as a result of they have got microprocessor technology and either personal or have licensed LTE/4G baseband technology.

LTE/4G is delivered as a silicon element referred to as a baseband modem that pushes SoC designers to the limits of innovation to design and fabricate for low-vigor consumption purposes, akin to mobile devices. it is a indispensable improve to 3G that mobile users need to develop into completely untethered.

Intel has moved promptly to backfill its LTE/4G highbrow property and engineering design means. closing year Intel obtained Infineon wireless, a fabless semiconductor baseband modem company with LTE/4G patents and an extended heritage of delivering baseband modems to handset and base-station producers. With the acquisition, Intel received a product portfolio, design capacity, and patents that Hermann Eul, vp and familiar supervisor of the Intel cellular and Communications community, describes as a “profound portfolio of patent insurance plan.” through acquisition, Intel has joined Qualcomm and Samsung as the simplest baseband modem suppliers which have the patent portfolio and scale to coordinate LTE/4G construction through separate certifications and approvals required by using every cell provider.

In mid-2012 Intel doubled down on LTE/4G when it opened a new office in San Diego, Qualcomm’s home territory, with the express intent of recruiting from the enviornment’s deep pool of baseband ability to build a new modem design group for LTE/4G technologies. There are rumors that Intel might be making at least yet another LTE/4G investment in 2013. A second supply for LTE/4G baseband modems from Intel should be welcomed by way of smartphone producers as an alternative to Qualcomm’s close monopoly of LTE/4G modems and will relieve deliver constraints.

Intel has validated that it will probably build a aggressive smartphone SoC. The Intel Atom Medfield processor powers the Motorola Droid Razr i. It become verified by using The Verge against the Qualcomm Snapdragon S4 powered Droid Razr M this is built with almost an analogous design except for the cellular processor SoCs. The Intel-powered Razor i proven equal or more advantageous application compatibility and vigour effectivity. The Razr i’s efficiency and Intel’s seven design wins, including Lenovo, are superb.

but while Intel’s ability to deliver notable processor SoC designs is undeniable, Qualcomm’s dominant place shows that smartphone manufacturers desire suppliers that present each processor SoCs and baseband modems. supplying LTE/4G to smartphone producers within the first half of 2013 is a critical milestone for Intel.

Qualcomm poses gigantic challenges since it has already delivered its Snapdragon processor with an LTE/4G baseband modem built-in on a single chip. according to Qualcomm VP of advertising and marketing Tim McDonough, “Qualcomm is on its 2nd liberate of LTE/4G and sampling its third unencumber whereas competitors have yet to announce or carry a first unlock.”

Intel’s Response to Qualcomm’s Integrations of Processor and LTE/4G

Intel separates its production of LTE/4G and Atom processors. Eul believes it is simply too early within the evolution of Intel’s LTE/4G to combine it on a single chip with an Atom processor since the two applied sciences will iterate at diverse prices precipitated via diverse market events. We may additionally see Intel’s LTE/four modems integrated with a future Atom SoC when an additional shrink to 14 nm takes region sometime after 2014.

To close the hole, Intel will apply to smartphones and tablets the large systems-stage design ability that it honed when very nearly monopolizing the X86 laptop and server company. Intel will bring smartphone reference designs which will allow manufacturers to produce complete optimized smartphones the usage of Intel’s accessories.

Intel also bought provider certification and approval wisdom and relationships with its acquisition of Infineon. Eul’s method is to take both the components and reference designs throughout the prolonged and complex cellular service certification and acceptance technique and share the certifications with smartphone manufacturers to shorten the time to market for a brand new smartphone via as a minimum six months. in line with the context of Eul’s feedback, Intel may even use its tremendous give-chain relationships to bring an Intel-branded smartphone that cuts approval instances.

the new CEO have to Lead Intel Into The put up-workstation period

How a lot of Intel’s growth within the cell SoC market might be at Qualcomm’s fee is uncertain on account of Qualcomm’s potent market position and important design skill. Consolidation will also be expected as mobile processor SoC suppliers with out robust LTE/4G patent portfolios leave the cellular enterprise as exemplified by using Texas devices’ contemporary retargeting of its OMAP cellular chipset to car infotainment applications. Qualcomm may additionally think little pressure from Intel while the business segment consolidates. longer term here's an epic championship combat between two superb opponents, each and every with more than $10 billion in cash that spend 15 to twenty p.c of revenues on critical scientific R&D.

Intel’s failure to make the most the cell SoC market has regularly drawn criticism. but Intel has produced few early subscale successes. Willy Shih, a Professor of administration at the Harvard business faculty, has studied Intel and instructed us that almost all of Intel’s “New business Initiative” ventures failed when the new ventures could not scale to healthy the profitability or volumes of the core x86 microprocessor business. The cellular processor and communications company has the attributes that meet Intel’s expectations for boom and scale. but considering Intel has all of the design, highbrow property, and manufacturing ability to be successful in the cell market, the new CEO will should carve out Intel’s correct talent and state-of-the-art fabrication potential and dedicate it to successful cell market share, perhaps at some can charge to the core computer microprocessor business.

due to the fact an additional increase market of the magnitude that Intel must reignite increase is not apparent, the subsequent CEO will be chosen according to his potential to guide Intel into the publish-notebook era. And he could be capable of inform this story – in all probability at CES 2014.


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Siemon Introduces TERA® Category 8.2 Copper Cabling System | killexams.com real questions and Pass4sure dumps

WATERTOWN, Conn., Nov. 13, 2018 /PRNewswire/ -- Siemon, a leading global network infrastructure specialist, today announced the launch of its end-to-end TERA Category 8.2 copper cabling system, delivering transmission performance up to 2 GHz to support emerging high-speed 25 and 40 Gigabit (25/40GBASE-T) applications in data center switch-to-server applications.

Siemon's TERA Category 8.2 System includes cable, patch cords, connectors and pre-terminated cable assemblies. The system is founded on Siemon's TERA connector that was originally chosen as the ISO/IEC 11801 interface for category 7A/Class FA and that also now meets Category 8.2 compliance. Combining the TERA connector with category 8.2 S/FTP 2000 MHz cable and patch cords delivers a complete end-to-end system that exceeds ISO/IEC category 8.2/Class II specifications for 2-connector, 30-meter Class II channels in the data center.

"Siemon's fully shielded TERA connector has long been the highest-performing copper connector available, so it was no surprise that it easily achieved Category 8.2 compliance with plenty of margin, and we are now excited to introduce our complete end-to-end TERA Category 8.2 system," said Mike Boisseau, Siemon's business unit leader for copper systems. "Not only is the TERA connector far more robust than other twisted-pair copper connectors, but the Category 8.2 system provides enhanced insertion loss and crosstalk performance over RJ45-based Category 8 systems while offering the reach to support a broad range of switch-to-server architectures, preserving copper's place in the data center for years to come."

Siemon's end-to-end TERA Category 8.2 system can be easily certified using new TERA adapters recently released by Fluke Networks for their Versiv DSX-8000 CableAnalyzer, which demonstrates high levels of accuracy when compared to laboratory measurements. "We are pleased to support TERA Category 8.2 testing with the release of our new TERA adapter," said Harley Lang, RCDD, Fluke Networks' Director of Worldwide Marketing. "This is the latest example of the Versiv Cabling Certification System's continuing evolution to meet the needs of the cabling industry."

Siemon's TERA-to-RJ45 patch cords are ideal for 2-connector switch-to-server connections in middle-of-row (MoR) and end-of-row (EoR) configurations, while available Category 8-compatible RJ45-to-RJ45 patch cords enable direct attach switch-to-server connections in top-of-rack (ToR) configurations. The TERA outlet and plug are backwards compatible with Category 7A/Class FA cabling systems which allows for both flexibility and future-proof performance, making TERA ideal for data centers, healthcare imaging and financial applications.

For access to more visit: www.siemon.com/tera8.2

About Siemon

Established in 1903, Siemon is an industry leader specializing in the design and manufacture of high quality, high performance IT infrastructure solutions and services for Data Centers, LANs and Intelligent Buildings. Headquartered in Connecticut, USA, with global sales, technical and logistics expertise spanning 100 countries, Siemon offers the most comprehensive suites of copper and optical fiber cabling systems, cabinets, racks, cable management, data center power and cooling systems and Intelligent Infrastructure Management solutions. With more than 400 patents specific to structured cabling, Siemon Labs invests heavily in R&D and the development of Industry Standards, underlining the company's long-standing commitment to its customers and the industry. Through an ongoing commitment to waste and energy reduction, Siemon's environmental sustainability benchmarks are unparalleled in the industry, including 179% global carbon negativity and zero-landfill status.

Siemon Interconnect Solutions (SIS) is a Siemon business unit comprised of a team of dedicated technical sales professionals supported by Siemon Labs, mechanical, electrical and signal integrity engineers committed to solving industry and customer driven interconnect challenges. We provide custom network infrastructure solutions to: OEM's, Leading Manufacturers, Value-Added Resellers and System Integrators.


AMD Takes High-Performance Datacenter Computing to the Next Horizon | killexams.com real questions and Pass4sure dumps

— Launches World’s first 7nm High-performance GPU for Machine Learning and AI; Demonstrates World’s First High-performance 7nm x86 CPU Powered by “Zen 2” Processor Core and Breakthrough Chiplet Design —

— Amazon Web Services Announces Immediate Availability of AMD EPYC processor-powered Versions of Its Popular Instance Families —

SAN FRANCISCO, Nov. 06, 2018 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today demonstrated its total commitment to datacenter computing innovation at its Next Horizon event in San Francisco by detailing its upcoming 7nm compute and graphics product portfolio designed to extend the capabilities of the modern datacenter. During the event, AMD shared new specifics on its upcoming “Zen 2” processor core architecture, detailed its revolutionary chiplet-based x86 CPU design, launched the 7nm AMD Radeon Instinct™ MI60 graphics accelerator and provided the first public demonstration of its next-generation 7nm EPYC™ server processor codenamed “Rome”. Amazon Web Services (AWS), the world’s most comprehensive and broadly adopted cloud platform company, joined AMD at the event to announce the availability of three of its popular instance families on the Amazon Elastic Compute Cloud (EC2) powered by the AMD EPYC™ processor.

“The multi-year investments we have made in our datacenter hardware and software roadmaps are driving growing adoption of our CPUs and GPUs across cloud, enterprise and HPC customers,” said Dr. Lisa Su, president and CEO, AMD. “We are well positioned to accelerate our momentum as we introduce the industry’s broadest, most powerful portfolio of datacenter CPUs and GPUs featuring industry-leading 7nm process technology over the coming quarters.”

AMD Compute Architecture Updates

AMD for the first time detailed its upcoming “Zen 2” high-performance x86 CPU processor core that is the result of a revolutionary modular design methodology. This modular system design uses an enhanced version of AMD Infinity Fabric interconnect to link separate pieces of silicon (“chiplets”) within a single processor package. The multi-chip processor uses 7nm process technology for the “Zen 2” CPU cores that benefit from the advanced process technology, while leveraging a mature 14nm process technology for the input/output portion of the chip. The result is much higher performance – more CPU cores at the same power, and more cost-effective manufacture than traditional monolithic chip designs.

Combining this breakthrough design methodology with the benefits of TSMC’s leading-edge 7nm process technology, “Zen 2” delivers significant performance, power consumption and density generational improvements that can help reduce datacenter operating costs, carbon footprint and cooling requirements. Other key generational advances over the award-winning “Zen” core include:

-- An improved execution pipeline, feeding its compute engines more efficiently. -- Front-end advances – improved branch predictor, better instruction pre-fetching, re-optimized instruction cache and larger op cache. -- Floating point enhancements – doubled floating point width to 256-bit and load/store bandwidth, increased dispatch/retire bandwidth and maintained high throughput for all modes. -- Advanced security features – Hardware-enhanced Spectre mitigations, taking software migration and hardening it into the design, and increased flexibility of memory encryption.

Multiple 7nm-based AMD products are now in development, including next-generation AMD EPYC CPUs and AMD Radeon Instinct GPUs, both of which AMD detailed and demonstrated at the event. Additionally, the company shared that its follow-on 7nm+-based “Zen 3” and “Zen 4” x86 core architectures are on-track.

AMD EPYC Server CPU Updates

Reinforcing the growing momentum achieved with its current-generation AMD EPYC processors, Matt Garman, vice president of compute services at AWS joined AMD on-stage at the event to announce the immediate availability of the first AMD EPYC processor-based instances on Amazon Elastic Compute Cloud (EC2). Part of AWS’s popular instance families, the new AMD EPYC processor-powered offerings feature industry-leading core density and memory bandwidth. This results in exceptional performance-per-dollar for general purpose and memory-optimized workloads, driven by the core density of AMD EPYC processors that offer M5a and T3a customers a balance of compute, memory, and networking resources for web and application servers, backend servers for enterprise applications, and test/development environments with seamless application migration. For R5a customers, the memory bandwidth advantage of AMD EPYC processors is ideal for in-memory processing, data mining, and dynamic data processing.

AMD also disclosed new details and delivered performance previews of its next-generation EPYC processors codenamed “Rome”:

-- Processor enhancements including up to 64 “Zen 2” cores, increased instructions-per-cycle1 and leadership compute, I/O and memory bandwidth2. -- Platform enhancements including the industry’s first PCIe 4.0-capable x86 server processor with double the bandwidth per channel3 to dramatically improve datacenter accelerator performance. -- Double the compute performance per socket4 and four times the floating point performance per socket5 compared to current AMD EPYC processors. -- Socket compatibility with today’s AMD EPYC server platforms.

AMD demonstrated the performance and platform advantages of its next-generation EPYC processor with two demos during the event:

-- A pre-production single-socket next-generation AMD EPYC processor outperforming a commercially available top-of-the-line Intel dual processor Xeon server running the computationally-intensive, industry standard “C-Ray” benchmark6. -- The industry’s first x86 PCIe 4.0-capable platform demo, featuring a Radeon Instinct MI60 processor to accelerate image recognition.

“Rome” is sampling with customers now and is expected to be the world’s first high-performance x86 7nm CPU.

AMD Datacenter Graphics Updates

AMD launched the world’s first 7nm GPUs and the industry’s only hardware-virtualized GPUs – the AMD Radeon Instinct MI60 and MI50 – which are scheduled to ship to customers this quarter. These new graphics cards are based on the high-performance, flexible “Vega” architecture and are specifically designed for machine learning and artificial intelligence (AI), delivering higher levels of floating-point performance7, greater efficiencies8 and new features for datacenter deployments. A live demonstration during the event showed the flagship AMD Radeon Instinct MI60 running real-time training, inference and image classification.

In addition to new hardware announcements AMD also announced ROCm 2.0, a new version of its open software platform for accelerated computing that includes new math libraries, broader software framework support, and optimized deep learning operations. ROCm 2.0 has also been upstreamed for Linux kernel distributions, extending ROCm access to millions of Linux developers and users. Designed for scale, ROCm allows customers to deploy high-performance, energy-efficient heterogeneous computing systems in an open environment.

Presentations from the event are available now on at www.amd.com/NextHorizon. A full replay will be available within 12 hours and will remain available for approximately one year.

-- Visit the Next Horizon event webpage for event materials -- Become a fan of AMD on Facebook -- Follow AMD on Twitter

For more than 45 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, Facebook and Twitter pages.

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, availability, timing, deployment and expectations of AMD future products and technologies, including “Zen 2,” “Zen 3,” “Zen 4,” “Rome,” AMD Radeon Instinct™ MI60 and MI50 accelerators and the ROCm 2.0 open software platform; AMD driving growing adoption in its CPUs and GPUs across cloud, enterprise and HPC customers; AMD being well positioned to accelerate its momentum through the introduction of AMD’s datacenter portfolio in the coming quarters; and expected benefits from EPYC™ based AWS R5, M5 and T3 instances, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "intends," "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "pro forma," "estimates," "anticipates," or the negative of these words and phrases, other variations of these words and phrases or comparable terminology. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices may limit AMD’s ability to compete effectively; AMD has a wafer supply agreement with GF with obligations to purchase all of its microprocessor and APU product requirements, and a certain portion of its GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with limited exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, its business could be adversely impacted; AMD relies on third parties to manufacture its products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, AMD’s business could be materially adversely affected; failure to achieve expected manufacturing yields for AMD’s products could negatively impact its financial results; the success of AMD’s business is dependent upon its ability to introduce products on a timely basis with features and performance levels that provide value to its customers while supporting and coinciding with significant industry transitions; if AMD cannot generate sufficient revenue and operating cash flow or obtain external financing, it may face a cash shortfall and be unable to make all of its planned investments in research and development or other strategic investments; the loss of a significant customer may have a material adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC products is dependent upon its technology being designed into third-party products and the success of those products; AMD products may be subject to security vulnerabilities that could have a material adverse effect on AMD; data breaches and cyber-attacks could compromise AMD’s intellectual property or other sensitive information, be costly to remediate and cause significant damage to its business and reputation; AMD’s operating results are subject to quarterly and seasonal sales patterns; global economic uncertainty may adversely impact AMD’s business and operating results; AMD may not be able to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD has a large amount of indebtedness which could adversely affect its financial position and prevent it from implementing its strategy or fulfilling its contractual obligations; the agreements governing AMD’s notes and the Secured Revolving Line of Credit impose restrictions on AMD that may adversely affect its ability to operate its business; the markets in which AMD’s products are sold are highly competitive; AMD's issuance to West Coast Hitech L.P. (WCH) of warrants to purchase 75 million shares of its common stock, if and when exercised, will dilute the ownership interests of its existing stockholders, and the conversion of the 2.125% Convertible Senior Notes due 2026 may dilute the ownership interest of its existing stockholders, or may otherwise depress the price of its common stock; uncertainties involving the ordering and shipment of AMD’s products could materially adversely affect it; the demand for AMD’s products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for AMD’s products or a market decline in any of these industries could have a material adverse effect on its results of operations; AMD’s ability to design and introduce new products in a timely manner is dependent upon third-party intellectual property; AMD depends on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components to support its business; if AMD loses Microsoft Corporation’s support for its products or other software vendors do not design and develop software to run on AMD’s products, its ability to sell its products could be materially adversely affected; and AMD’s reliance on third-party distributors and AIB partners subjects it to certain risks. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended September 29, 2018.

AMD, the AMD Arrow logo, EPYC, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

1 Estimated increase in instructions per cycle (IPC) is based on AMD internal testing for “Zen 2” across microbenchmarks, measured at 4.53 IPC for DKERN +RSA compared to prior “Zen 1” generation CPU (measured at 3.5 IPC for DKERN + RSA) using combined floating point and integer benchmarks.

2 NAP-42 – AMD EPYC™ 7601 processor supports up to 8 channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667. NAP-43 – AMD EPYC 7601 processor includes up to 32 CPU cores versus the Xeon Platinum 8180 processor with 28 CPU cores.

NAP-44 – A single AMD EPYC™ 7601 processor offers up to 2TB/processor (x 2 = 4TB), versus a single Xeon Platinum 8180 processor at 768Gb/processor (x 2 = 1.54TB). NAP-56 – AMD EPYC™ processor supports up to 128 PCIe® Gen 3 I/O lanes (in both 1 and 2-socket configuration), versus the Intel® Xeon® SP Series processor supporting a maximum of 48 lanes PCIe® Gen 3 per CPU, plus 20 lanes in the chipset (max of 68 lanes on 1 socket and 116 lanes on 2 socket).

Based on “Zen 2” design parameters versus “Zen1” and currently shipping products – core count increase from 32 to up to 64 per socket. Memory bandwidth with up to 3200Gb/s memory speed across eight memory channels, I/O leadership extending to PCIeGen4.

3 Per Silicon Labs, provider of the PCIe Gen 4 solutions. (website here: https://www.silabs.com/community/blog.entry.html/2015/12/04/what—is—pcie—gen4a-oobp ). PCIe Gen4 is a new standardized data transfer bus that will double the data transfer rate per lane of the prior Gen3 revision from 8.0 GT/s (gigatransfers/second) to 16.0 GT/s. This means that a single PCIe Gen4 interconnection will allow data rate transfers of up to 2GB/s (gigabytes/second), and a full 16 slot PCIe Gen4 interconnection for graphics cards and high-end solid state drives will allow data transfer rates of up to 32GB/s.

4 Testing performed by AMD Engineering as of October 2018 using AMD reference system with a pre-production “Rome” engineering sample, where “Rome” scored approximately 2x higher compared to “Naples” System.

5 Estimated generational increase based upon AMD internal design specifications for “Zen 2” compared to “Zen 1”. “Zen 2” has 2X the core density of “Zen 1”, and when multiplied by 2X peak FLOPs per core, at the same frequency, results in 4X the FLOPs in throughput.

6 Estimates based on AMD internal testing as of November 6, 2018 in AMD “Ethanol” reference system (Oct 2018?) AMD EPYC™-based system configuration with AMD “Rome” Development Chassis with an EthanolX development board featuring a single next generation AMD EPYC (“Rome”) processor with a total of XXXXX DIMMs at XXXXX; versus Intel -based system configured with Supermicro’s SYS-1029U-TRTP; OS: Ubuntu 7.3.0-27ubuntu1~18.04; Linux: 4.15.0-36-generic; Compiler: GCC 7.3.0 with 2x Intel(R) Xeon(R) Platinum 8180M CPU, 24x32GB at 2666 MHz. The AMD “Rome” 1P server completes the C-Ray demo in ~ XXXXX sec and the Intel 8180M completes the benchmark in ~ XXXXX sec. Benchmark testing data redacted by AMD for confidentiality purposes, full disclosure will be available after launch.

7 As of Oct 22, 2018. The results calculated on for Radeon Instinct MI60 designed with Vega 7nm FinFET process technology resulted in 29.5 TFLOPS half precision (FP16), 14.8 TFLOPS single precision (FP32) and 7.4 TFLOPS double precision (FP64) peak theoretical floating-point performance. This performance increase is achieved with an improved transistor count of 13.2 billion on a smaller die size of 331.46mm2 then previous Gen MI25 GPU products with the same 300W power envelope.

The results calculated for Radeon Instinct MI50 designed with Vega 7nm FinFET process technology resulted in 26.8 TFLOPS peak half precision (FP16), 13.4 TFLOPS peak single precision (FP32) and 6.7 TFLOPS peak double precision (FP64) floating-point performance. This performance increase is achieved with an improved transistor count of 13.2 billion on a smaller die size of 331.46mm2 than previous Gen MI25 GPU products with the same 300W power envelope.

The results calculated for Radeon Instinct MI25 GPU based on the “Vega10” architecture resulted in 24.6 TFLOPS peak half precision (FP16), 12.3 TFLOPS peak single precision (FP32) and 768 GFLOPS peak double precision (FP64) floating-point performance. This performance is achieved with a transistor count of 12.5 billion on a die size of 494.8mm2 with 300W power envelope.

AMD TFLOPS calculations conducted with the following equation for Radeon Instinct MI25, MI50, and MI60 GPUs: FLOPS calculations are performed by taking the engine clock from the highest DPM state and multiplying it by xx CUs per GPU. Then, multiplying that number by xx stream processors, which exist in each CU. Then, that number is multiplied by 2 FLOPS per clock for FP32 and 4 FLOPS per clock for FP16. To calculate FP64 TFLOPS rate for Vega 7nm products MI50 and MI60 a 1/2 rate is used and for “Vega10” architecture based MI25 a 1/16th rate is used.

GFLOPS per Watt ---------------------- MI25 MI50 MI60 ---- ----- ----- ----- FP16 0.082 0.089 0.098 ---- ----- ----- ----- FP32 0.041 0.045 0.049 ---- ----- ----- ----- FP64 0.003 0.022 0.025 ---- ----- ----- -----

AMD has not independently tested or verified external/third party results/data and bears no responsibility for any errors or omissions therein.RIV-2

8 Radeon Instinct™ MI60 contains 13.2 billion transistors on a package size of 331.46mm2, while the previous generation Radeon Instinct™ MI25 had 12.5 billion transistors on a package size of 494.8mm2 – a 58% improvement in number of transistors per mm2.


Review: Intel Hammer 24-drive SSD storage server | killexams.com real questions and Pass4sure dumps

You may remember that a short while back we took a good look at the Intel DC S3700 solid-state drive (SSD). Priced at around £1,500 for a range-topping 800GB model, immediate value isn't, and shouldn't be, the criteria it is judged against. Flat-out speed isn't the DC S3700's forte, either, leaving consumers scratching their heads as to why it's so relatively expensive when compared to regular SSDs from Corsair, Crucial, Micron, et al.

The drive's very name provides a large clue to its provenance and intended purpose. The data centre SSD, says Intel, "delivers data at a breakneck pace, with consistently low latencies and tight IOPs distribution." Consistent and tight are the key terms, as while most drives will advertise tantalising average performance figures, such numbers, especially in the data-centre space, don't tell the full story.

Consistency - the quality of producing near-identical performance over a sustained period - is arguably more important than sheer throughput in a data centre, because the overall responsiveness of a multi-drive server is defined by the slowest SSD. Allied to consistency is durability and reliability, with Intel claiming 10 fully random Drive Writes per Day (DWPD) over a typical five-year life, giving the 800GB model an endurance of 14.6 petabytes.

Yet examining the drive in isolation, as we have done, doesn't show it in the intended environment. Multiple DC S3700s are designed to be populated into multiple storage servers often found in racks. To that end, and with help from server specialists Hammer (Intel's no. 1 server specialist server distributor) and Intel, we snagged a 2U, 24-drive, Xeon-powered DC S3700 SSD server for technical evaluation - enterprise ogling, if you will.

Chassis, motherboard, memory and power

Slipping off the cover and looking at it from the back first, the storage goodies are contained inside a standard 2U (71cm x 43cm x 8.7cm) rack-mountable chassis. Primed for data centre and cloud-computing environments and outfitted with two removable, redundant 750W Platinum-certified PSUs (bottom-left), the chassis is supplied with a S2600GZ4 Socket R (LGA 2011) motherboard presented in a custom 42cmx42cm form factor. The overall look and feel is very similar to Hammer's SecuriStore range.

CPU oomph is provided by two Xeon E5 26xx-class chips that are cooled by five Nidec Ultraflow fans blowing air across the large heatsinks and, as you can see on the first picture, channelled through to the heatsinks and RAM via a large plastic air duct. Surrounded by 24 DIMM slots that accept DDR3 ECC UDIMM memory at up to 1,600MHz speeds, the board's 8-channel controller has access to, potentially, 768GB (24x32GB) of RAM.

Making good use of all eight channels, Hammer outfits this server with eight prototype Kingston 32GB DDR3-1,333MHz load-reduced modules (LRDIMMs) operating at 1.35V and at 9-9-9 latencies. 256GB spread over eight sticks is impressive density, enabling a further 512GB to be added, budget very much permitting.

There's little need for fast graphics on a server of this ilk, and the board has basic (integrated) video output via D-Sub. Four Intel gigabit LAN ports provide networking to the outside world, while three USB 2.0, out of a possible seven, are located on the rear, too.

Ostensibly a storage server but with only two SATA ports on show, you may wonder how the board accommodates up to 24 drives. The onboard SATA 6Gbps ports are there for booting the server into the operating system of your choice. Here, Hammer uses an air-duct-mounted 520 Series 120GB for the task, shown bottom-left.



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Intel ISS-003 Exam (Intel(R) Server Specialist Certification) Detailed Information



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