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HP0-J39 - Designing and Implementation HP P4000(R) SAN Solutions - Dump Information

Vendor : HP
Exam Code : HP0-J39
Exam Name : Designing and Implementation HP P4000(R) SAN Solutions
Questions and Answers : 145 Q & A
Updated On : February 22, 2019
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HP0-J39 Questions and Answers

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HP0-J39 Designing and Implementation HP P4000(R) SAN Solutions

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HP0-J39 exam Dumps Source : Designing and Implementation HP P4000(R) SAN Solutions

Test Code : HP0-J39
Test Name : Designing and Implementation HP P4000(R) SAN Solutions
Vendor Name : HP
Q&A : 145 Real Questions

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HP Designing and Implementation HP

Randomised reviews of health programmes: from design to implementation | killexams.com Real Questions and Pass4sure dumps

This suggestions is for the 2018/19 session.

Dr Mylene Lagarde COW 3.02

This route is attainable on the MSc in global fitness policy, MSc in health policy, Planning and Financing, MSc in overseas health coverage and MSc in foreign fitness coverage (health Economics). This route is attainable with permission as an outside alternative to students on other programmes where rules allow.

Randomized trials have lengthy been used within the clinical world to examine the efficacy of medical treatments. currently, social scientists have all started using the identical approach, using random task to allocate components or put in force a coverage intervention otherwise to distinctive businesses, in an effort to investigate the causal consequences of the coverage of hobby. The recognition of randomized critiques has grown above all, however not solely, amongst researchers and policymakers in low- and center-salary settings.

Conducting a a success randomized contrast involves many inter-linked steps and a good realizing of a couple of statistical ideas. Randomized reviews also usually require to design and organise the facts collection of significant and constructive information, which comprises a number of crucial steps to evade pitfalls.  it's for this reason elementary to keep in mind these different steps to design and enforce randomised evaluations accurately, or to be capable of severely analyse them.

This path proposes a fingers-on and intuitive method to designing and conducting a randomised contrast. within the first half of the path, we are able to focus on causes for engaging in randomised evaluations; the way to design the randomise test to make sure it answers the question(s) of pastime (including considerations of statistical vigor and pattern size calculation); how to deal with threats to randomisation. in the 2d half of the direction, we can talk about useful concerns raised by using fundamental data assortment, together with a way to most useful measure results of activity; a way to design first rate equipment and how to habits and control fieldwork.

Seminars may be designed to encourage students to severely engage with the issues and observe the technical competencies taught. each and every seminar might be carefully aligned with the lecture content to supply students the chance to apply the brand new capabilities. Case stories might be chosen from numerous cultural backgrounds, to enable the presentation of a diverse latitude of settings and concerns.

15 hours of lectures and 15 hours of seminars in the LT.

A draft protocol. students will be requested to put up a short 1,500 be aware draft protocol via week eight. whereas some facets of their work can also nevertheless be work in progress (e.g. using bullet features), students might be expected to put in writing up the first half of their protocol in a more designated manner. The outlines might be graded and remarks given to students. This permits college students to get beneficial event of writing at MSc stage at LSE, and they will also be aware more notably the expectations of the summative assessment. students might be capable of use this feedback of their writing of the summative work.

research inspiration (one hundred%) in the LT.

The aim of the research protocol (four,000 words max) could be to plan the randomised evaluation of a specific fitness programme. college students might be asked to opt for one programme from a proposed checklist. they're going to also be given the option to select their own intervention (pending agreement by means of their seminar leader).


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HP's subsequent-gen home windows blended fact headset will game a brand new design and excessive-res displays | killexams.com Real Questions and Pass4sure dumps

Microsoft confirmed off the first consumer windows blended fact head-established displays (HMDs) from companions corresponding to Acer, Dell, HP, and Lenovo lower back in October 2017 at an adventure in San Francisco. The devices launched alongside the windows 10 Fall Creators update, with expenditures starting at $299. The HMDs came with different designs, however equivalent standards comparable to a 1440X1440 resolution monitor, and framerates of 60fps for PCs with integrated snap shots and 90fps for methods with discrete photos.

whereas not an awful lot in the approach of a refresh to a lot of these devices took place, Samsung launched its second-generation HMD, the Odyssey+ in October 2018, with advancements to necessities and the design of the gadget. soon, one other new headset may be on the way, as HP is also readying it subsequent-era HMD, as per the folks at RoadtoVR who acquired an unique preview of the unannounced windows blended reality headset, codenamed ‘Copper’.

The document states that HP is re-designing its HMD from the ground up, and from the looks of it, it does look like a significant update. The machine now activities an Oculus Rift-like design with the top straps going in the course of the facets and above the pinnacle, assembly at a round structure at the returned. The gadget is additionally expected to include a heathered fabric on the front where the cameras for monitoring are located. The headset is declared to be lighter, making it greater at ease to wear, and it'll additionally feature stronger mechanicals to make it easier to placed on and take away.

As for specs, the next-generation machine will present a 2160X2160 resolution screen per eye, making it the most pixel-dense display in a mixed fact Headset yet. In evaluation, Samsung’s new Odyssey+ activities a 1440X1600 resolution reveal per eye. most likely, the denser reveal makes for crisp, clear images, bringing much-essential advancements to the event. The denser screen also helps mask the screen door effect (the impact caused by means of the unlit areas between any two pixels), negating the want for additional accessories just like the diffuser on Samsung’s Odyssey+.

HP states that the improvements to the HMD came from its business valued clientele and that the consumers didn’t believe the container of view a big enviornment of concern as a great deal as the resolution and comfort. The company is planning on bringing this headset to its device as a service for VR providing as a part of the Z through HP brand.

while HP didn't show particulars concerning the launch date or pricing, the enterprise did confirm that it may be promoting the equipment to each, organisations and buyers. windows combined truth has been receiving improvements in the latest test builds for the subsequent essential home windows 10 replace, which may virtually actually be referred to as the home windows 10 April 2019 replace. The platform has additionally begun seeing multiplied relevance in gaming, so it should be enjoyable to peer how smartly ‘Copper’ will be acquired, and if the improvements inspire extra clients to trust it.

supply: RoadtoVR by the use of Thurrott


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Designing and Implementation HP P4000(R) SAN Solutions

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This chapter is from the book 

Remember, a system landscape exists for each mySAP solution—if you deploy R/3, APO, CRM, and PLM, you will in effect be creating four different SAP system landscapes, one for each product. The focus in this and the following few sections, though, is on what one of these system landscapes looks like from a design and planning perspective, for example R/3 alone or APO alone.

In the most general form, an SAP system landscape consists of SAP instances (installations of the SAP database and application software) and SAP servers. In the Microsoft world of SAP implementations, there is a one-to-one correlation between instances and servers nearly all the time. That is, the Development instance resides on a dedicated Development server, the Test instance resides on a dedicated Test server, and so on. In the world of UNIX implementations, though, multiple instances can be often found on a single "larger" server. For example, both Development and Test instances can reside on a single server. And multiple application instances can be installed on a single server as well.

Until last year's release of SAP's Multiple Components, One Database (MCOD) initiative, there was a one-to-one correlation between instances and database systems, too, regardless of the Operating System platform. MCOD is beginning to change this, such that a single "larger" database can be leveraged for multiple instances. However, an important difference between MCOD and multiple instances/one server exists—MCOD ties the same type of databases within different SAP system landscapes together. With MCOD, all Development databases used by your R/3, SRM, CRM, and Workplace implementations can be one and the same. Similarly, all Test databases across R/3, SRM, CRM, and Workplace can be bundled together, too, as illustrated in Figure 3.3. Note, however, that in many cases SAP AG frowns on mixing OLTP and OLAP systems, or combining different databases within the same system landscape. In that regard, forcing an MCOD database server to host your R/3 system's Development and Test databases would therefore be unsupported and contrary to best practices.

Figure 3.3Figure 3.3 A properly architected sample MCOD deployment is displayed for a typical mySAP enterprise consisting of R/3, CRM, SRM, and Workplace.

As we move forward with our basic understanding of SAP system landscapes, and seek to understand how your SAP solution vision impacts and is impacted by your landscape decisions, my hope is to achieve the following:

  • Note the relative importance and relationship of technology perspectives to our solution vision

  • Understand why each system landscape is important to fulfilling our vision

  • Note how the presence or absence of a particular system within a landscape impacts the other systems and ultimately the overall solution vision

  • All these design and planning approaches I cover tend to come into play in one manner or another across all mySAP implementations. It's how they are weighted or addressed that makes one system landscape different from the next.

    Simplifying Your SAP System Landscape

    After spending time with hundreds of customers and SAP implementations, I think it is safe to say that when all things are equal, the desire to simplify emerges as an important driver. Simplification takes many forms, too. In the case of the SAP system landscape and how it fulfills our SAP solution vision, the desire to simplify manifests itself in any number of ways:

  • First, the pure number of instances will be reduced to the fewest necessary to get the job done "right" for a particular company. An organization focused on simplifying administrative, change management, systems management, operations, and other tasks will deploy a three-system or even a two-system landscape, whereas similar organizations without the same simplification goals can deploy more. There are trade-offs, of course. A system landscape without a dedicated test instance will, for example, be forced to perform testing in the same system used for development. Because of these kinds of limitations, simplification achieved through instance reductions is not as common as it has been in the past.

  • Instead, a more popular approach to simplification seeks to reduce the number of physical servers in a particular system landscape, by installing multiple instances on a single server. Consolidation of instances is becoming quite common in SAP customer environments today, as displayed in Figure 3.4.

  • Figure 3.4Figure 3.4 Multiple SAP instances can be installed and configured on a single physical server, oftentimes reducing both acquisition and systems management costs down the road.

  • Similarly, deploying a shared disk subsystem and tape backup/restore solution also simplifies a very complex piece of the SAP Solution Stack. This is why my colleagues and I have spent so much time in the last two years designing and implementing Storage Area Networks, or SANs—they provide outstanding performance while simultaneously reducing system landscape complexity and allowing expensive resources like enterprise tape libraries to be shared between systems.

  • Another customer of mine shared with me why they went with the WebGUI as opposed to the classic SAPGUI approach to system accessibility—to simplify desktop support and maintenance requirements.

  • Companies that value simplification will also standardize on a particular solution stack option or approach, too, as this simplifies support and maintenance, and minimizes the need for a variety of onsite/reserved spare parts, the time spent in change management activities, and more.

  • Although simplification tends to work in one direction by encouraging a "do more with less" philosophy, our next topic goes the other route in that it purposefully introduces complexity and differences between various systems within a system landscape—high availability.

    High Availability and the SAP System Landscape

    When it comes to high availability, many technology professionals automatically think about what it means to improve the availability of a particular system or hardware component—thoughts of basic HA offerings like clustering or redundancy come to mind. With regard to the broader topic of how your solution vision impacts your SAP system landscape, though, high availability equates to the following:

  • Business-driven requirements—HA offerings and approaches are normally implemented to satisfy specific business-oriented needs, and therefore form an integral part of your overall SAP solution vision.

  • Complexity—HA complicates the SAP system landscape, as HA offerings and approaches tend to only really exist or apply to the Production system and at minimum (hopefully!) another similarly configured system within the landscape.

  • Increased support needs—Because HA offerings are inherently complex, a very real need exists to prepare your SAP support organization in how to install it, update it, manage it, and troubleshoot HA issues.

  • To read more about how business requirements relate to high availability, see "Availability Planning—Documenting Requirements and Key Drivers," p. 167 in Chapter 6.

    Disaster Recovery Considerations

    All companies implement a method of addressing Disaster Recovery (DR), whether or not they actually realize it. Even companies that do not add a dedicated DR system to their system landscape address disaster recovery. That is, their de facto disaster recovery plan simply reflects the challenges and timeframes surrounding rebuilding their SAP system from scratch, restoring from their latest tape backup, and imposing upon their end users to manually rekey any new business transactions lost between the last successful tape backup and the point at which the disaster occurred. This doesn't sound like much of a "plan," of course, but it does represent a baseline against which all other disaster recovery approaches and solutions can be weighed.

    A host of DR approaches are discussed throughout Chapter 6, from those involving disk subsystem data replication solutions, to various clustering solutions, to database and mySAP-specific tactics. But when it comes to sifting the potential layout of your SAP system landscape through your solution vision, two general approaches fall out:

    Both approaches are valid, and the first is more traditional. But I believe that the time and expense related to setting up, configuring, keeping current, and managing your own DR system explains the recent increase in outsourcing I've seen over the last two years.

    To review some of the tasks and considerations inherent to addressing DR internally as opposed to outsourcing it, see "SAP General Availability and DR Best Practices," p. 207 in Chapter 6.

    Companies that outsource the DR component of their SAP system landscape help to preserve their data, and access to this data, in that the outsourcer operates a completely independent data center, typically in a very different geographic location. For smaller and mid-size companies with only a single data center, the expense relief is tremendous. On the other hand, if the DR solution is maintained "in-house," so to speak, it will need to be housed in a separate facility. This alone is sure to drive complexity, cost, and even the architecture and makeup of both the SAP system landscape and its individual systems.

    Addressing Training Requirements

    The SAP system landscape is directly impacted by the potential need to train SAP end users as well as the system's developers and technical support staff. Three different systems come into play, as illustrated in Figure 3.5:

  • A dedicated Training system is often implemented to assist in teaching users new to a particular mySAP component how to actually use the system. This amounts to business-process training as well as SAP user interface training (an excellent alternative to creating multiple training clients on the Test system, which is busy fulfilling integration responsibilities prior to Go-Live—the exact time when end users need to be trained!). To provide the most value to its students, the Training system needs to be an exact copy of Production.

  • A dedicated Technical Sandbox system is extremely useful in helping the SAP Technical Support Organization (SAP TSO) get up to speed on the entire SAP Solution Stack, especially with regard to new components and complex HA offerings (rather than attempting to get time on other systems for what could amount to crash-and-burn testing).

  • A dedicated Business Sandbox or Development Sandbox system allows developers unfamiliar with a particular mySAP component, or faced with integrating multiple components and other legacy systems, the opportunity to do so in a pure testing environment (rather than the real Development system).

  • Figure 3.5Figure 3.5 These SAP training systems support the different needs of different organizations, from end users, to developers and programmers, to technical implementation specialists.

    For details as to how the SAP system landscape satisfies the training needs of both the SAP Technical Support Organization and the production system's end users, see "Training and the Role of the SAP System Landscape," p. 314 in Chapter 9.

    It can represent quite a challenge for the "customers" of one of these training systems to convince everyone that such a system is truly required. In my own experience, I have seen the lack of a Technical Sandbox really hurt an organization in terms of downtime due to botched infrastructure upgrades and changes to DR processes.

    Another colleague of mine has more than once had to strongly push for the adoption of a Training system, too. Such a system allows for extensive informal user testing and practice outside of formally delivered training. He believes that this extra level of hands-on self-directed training is critical because your end-user community is best positioned of all groups to find business-process operational errors and limitations. And of course it is desirable to correct these issues well before Go-Live. But a consultant or even a senior super user is typically not positioned to push the adoption and use of a dedicated Training system. More often than not, it takes the SAP Steering Committee, the project's experienced management team, and the prodding of a knowledgeable SAP Solution Architect to do so. I cannot stress this enough—the risk is huge, in that you do not want to find out too late that not every business scenario works as it did during integration testing (for example, all types of contracts, all types of material movements, all kinds of accounting entries, and so on).

    The Performance-Driven System Landscape

    When it comes to evaluating your solution vision against the layout of your SAP system landscape, it is important to ensure that the performance of the systems meets the needs of their different end-user communities. Most of the time, of course, the focus is on designing, installing, and configuring a well-performing Production system. Performance considerations usually relate back to what an end user will experience while on the system, including

  • Business transaction response times, or how long it takes to refresh your SAPGUI after pressing the Enter key, for example.

  • How quickly a background or "batch" job will execute, otherwise known as throughput.

  • How quickly a report or other query will make it through the system and actually be printed, sometimes called latency.

  • To read more about verifying that a Production system can meet performance expectations, see "Key SAP Stress-Testing Considerations," p. 580 in Chapter 16.

    However, these same performance considerations apply to all of the other systems within the SAP system landscape, too. The Development system, for example, needs to exhibit excellent performance even while 25 or 50 or more developers are banging away at keyboards trying to build your custom mySAP solution. Similarly, your Test system needs to provide the performance necessary to get through integration testing. Even the Training system needs to provide adequate user response times so as to make the actual training experience more than something to be avoided.

    High-performance considerations cover the gamut, touching every facet of every system within the landscape. This means that everything—from the performance of the network connecting each system, to each server's CPU, RAM, and disk configuration, to each system's OS, database, and mySAP component—must be addressed. Starting off on the right foot (with properly sized and configured hardware and software elements) is paramount, of course, but tuning all these solution stack pieces to create a cohesive well-running machine is just as important to achieving excellent performance. Like the weakest link in a chain, a single underperforming solution component will only throttle back the maximum performance otherwise obtainable from your system.

    Driving Scalability into Your System Landscape

    The need for scalability, like high availability and excellent performance, is addressed primarily through the sizing process. Scalability does not pay off up front in terms of improved system availability or better user response times, though. Rather, scalability is all about paying for "headroom" in your system, headroom that is not actually needed at present but might be required in the near future. In other words, scalability addresses future planned and unplanned growth in your system.

    This growth can manifest itself in a number of ways. In my experience in the real world, I have seen the results of unplanned growth hurt companies where scalability was never addressed, as in the following cases:

  • The number of end users increased at one of my new accounts, not due to more hiring than was anticipated when their mySAP.com solution was crafted, but because they unexpectedly acquired their competitor and doubled in size. We had six months to project the delta needed in terms of database and application server processing power and RAM requirements, followed by stress-testing the new design and finally implementing it.

  • More than one of my customers' databases grew so fast that they outstripped the results of their comprehensive three-year database sizing methodology in the first year! In most cases, the system we put in place for these customers was scalable—more disk drives could be added, smaller drives could be swapped with larger ones, and so on. In three cases in particular, though, the database growth was so explosive that a whole new disk subsystem platform needed to be brought in, and the recently acquired current platform retired (or redeployed) years earlier than expected.

  • When databases grow quickly, the tape backup/restore solution implemented often grows less effective as well. I have seen this most often in relatively small SAP implementations, where an initial investment in tape backup technology needed to be tossed in favor of tape solutions that backed up more data per tape cartridge, and did so fast enough to not exceed the customer's backup window (time allotted to perform a backup, which usually equates to planned downtime in the case of offline full backups).

  • It's been a while, but I also had a customer outgrow their network, too. Today, with switched networks and Gigabit Ethernet providing more than adequate bandwidth to every mySAP.com server component, and cheap 10- and 100-Megabit Ethernet prevalent across end-user workstations, there's no excuse for lacking network scalability.

  • Outstripping the capabilities of your current system such that a new platform is needed probably represents a worst-case scenario. Not only does the current Production component need to be replaced, but to support sound change control principles, so does the same component in your Test, Staging, and/or Technical Sandbox environments.

    This is why hardware and software vendors tout things like "highly scalable system architectures," "enterprise versions" of particular Operating Systems and Database Systems, and so on—though not necessarily needed up front, the headroom that these approaches provide helps an organization feel more comfortable if they wind up growing faster than they expected. And hardware vendors in particular can position their SAP clients for improved scalability by practicing the following:

  • Specify server platforms that allow additional CPUs and RAM to be added as needed. In other words, avoid "maxing out" the box.

  • Alternatively, design SAP solutions such that they take advantage of SAP's support for horizontal scalability. This is one of my favorite approaches when it comes to SAP Application, Web AS, J2EE middleware, and ITS servers—I prefer to max them out with regard to processors, with the understanding that an incremental number of servers can be added at any time should the environment grow to require it (interestingly, although SAP has successfully tested a system running more than 160 application servers, it is rare to find customer implementations with more than 10 or 12).

  • Architect a solution for the appropriate level of vertical scalability. In other words, if a two-tier "Central System" (where all SAP software components execute on the same physical server) approach to sizing meets today's requirements, perhaps a three-tier solution will provide for unknown scalability requirements. In a three-tiered architecture, one database server and multiple application servers are configured as a single system image.

  • Architect a highly scalable database platform. As my real-world examples earlier in this list illustrate, this tends to be where a lack of scalability causes the most problems.

  • Hardware and software vendors alike spend a great deal of time "proving" how scalable their offerings are. As a first step, I suggest that benchmarks, customer references/feedback, and the results of tests published through white papers and other technical documents be reviewed by prospective mySAP customers. I also suggest that you begin considering new approaches to scalability. For example, HP's iCOD offering touts "capacity on demand." When a customer buys a server, for instance, it is fully populated with CPUs. The customer pays for only what is needed in the near term, however. Later, if it is determined that more processing power is required, the customer takes advantage of the in-place processors by merely applying for a license; no intrusive field upgrade or service call is required and therefore the need for planned downtime is drastically reduced.

    The TCO-Driven System Landscape

    More than anything else, Total Cost of Ownership (TCO) drives what a solution vision actually looks like at the end of the day, when a mySAP solution is implemented and really being used. Discussions on TCO might instead be labeled Return on Investment (ROI), or might fall under the heading of investment protection. Regardless, a focus on lowering TCO seeks to find less expensive solution-stack alternatives that still meet the needs of the business.

    To read more about the relationship between TCO and your SAP solution vision, see "How the SAP Solution Vision Drives TCO," p. 127 in Chapter 5.

    When all other things are equal, the following points apply from a hardware perspective:

  • A hardware vendor's use of common components like CPUs and memory boards allows flexible sharing of resources between different SAP system landscapes and in some cases hardware platforms, too.

  • Similarly, common disk drive form factors reduce cost of ownership by increasing reusability.

  • Support for hot-pluggable and/or hot-add hardware components eliminates or worst-case minimizes downtime (can include hard drives, tape drives, power supplies, fans, and even RAM and processors).

  • Support for redundant components, like power supplies, disk drives, fans, and so on, also eliminates or minimizes downtime.

  • The ability to run mixed-speed CPUs or RAM in a particular platform protects that investment—CPUs and RAM do not have to be tossed aside when additional processing power or memory is required.

  • Outsourcing your entire SAP infrastructure/operations team is another potential method of reducing TCO. In fact, outsourcing can represent the biggest potential TCO factor that a company will consider. At this level, though, outsourcing becomes more of a strategic business solution that impacts a lot more than simply TCO. True, outsourcing can cut labor costs by 50%, and enhance flexibility of a technical support organization to easily change as business requirements change, but there are drawbacks and disadvantages as well (discussed later in this chapter).

    Another solution vision approach that impacts the SAP system landscape from both a configuration and TCO perspective is the use of an Application Service Provider (ASP). ASPs can drive lower TCO by virtue of their application-specific expertise, above and beyond that provided by in-house staff and traditional outsourcing providers. For example:

  • An ASP can offer a preconfigured solution stack for the particular mySAP solution you want to implement. This is one reason why they look so good from a TCO perspective—design, deployment, manageability, operations, and other cost factors are substantially reduced due to a high level of both standardization and core competencies in the services they provide.

  • ASPs were more or less born out of the dot-com era, and by virtue of this, their data centers enjoy the benefit of fat redundant pipes to the Internet. Thus, mySAP.com applications are well positioned to take advantage of this flexible and powerful accessibility option.

  • ASPs offer interesting financing alternatives, in that they partner with various SAP technology partners to make leasing, pay-as-you-go, and other payment methods available.

  • The ASP provider market shrank over the last few years. The mySAP-focused companies that weathered these hard times seem even better prepared and well-positioned to host SAP solutions, however.

    Security Considerations

    I know of no company that does not envision protecting its corporate computing assets. From a solution-stack security perspective, not all software vendors are created equal, however. Oracle touts its unbreakable database, UNIX vendors tout the robust security features of their operating environments, and so on. In my eyes, security features are very important, but good security is more often about managing and testing changes to a solution stack, by carefully identifying security holes and other weaknesses in new solution stack components before these components ever find themselves in Production.

    However, companies that embrace and act upon the idea of protecting computing assets will prove to be better partners in the long run. This is why I believe that Oracle's focus on security will pay big dividends in terms of slowing the adoption of competing databases. And it is why I believe that the Trusted PC joint Intel, AMD, and Microsoft vision (once labeled by Microsoft as Palladium, and now referred to as the "next-generation secure computing base for Windows") will prove fruitful as well. Its goal is to build security into servers and PCs at a microprocessor level. New initiatives coming out of the Trusted Computing Platform Alliance promise to better secure our processing platforms, ensuring that only authorized applications and program executables can ever be executed by the system, and that all data housed on the system is encrypted so that it is useless to others. To this end, Microsoft considers Trusted PC a significant part of its Trustworthy Computing strategy—we should see something commercially available in this regard by 2004 that applies to server as well as desktop and other computing platforms.

    Manageability Considerations

    No customers of mine have ever started their initial SAP implementation planning discussions with me by saying:

    "George, all that high-availability and performance stuff is fine, but what we really want is a nice manageable system. Can you do that for us?"

    By the time Go-Live looms just over the horizon, though, every single one of them—without exception—has indicated a growing concern for manageability. Sure, it's there on the project plan, and any number of products can be used to support managing your mySAP environment. But the whole field of manageability is more complex and more work than you would imagine. Consider the following:

  • Each layer in the SAP Solution Stack must be managed; the risk of not keeping an eye on a particular layer or solution component affects the uptime of the entire system.

  • Because each layer is so different from the others, it's nearly impossible to find a single management product that can actually monitor and report on more than a few layers, much less the entire stack.

  • Therefore, the next best thing becomes trying to find a product that can at least interoperate successfully with other products.

  • At the end of the day, three, four, or even more tools and utilities must ultimately be fused together to provide a holistic view of a mySAP solution stack. This is challenging, to say the least!

  • To learn exactly how challenging piecing together a management approach can be, see "Systems Management Techniques for SAP," p. 511 in Chapter 14.

    Because of the challenges inherent to managing hardware and software products from a lot of different solution stack vendors, some of my customers have purposely chosen less than "best-of-breed" products for their SAP solutions, so as to minimize the number of software partners involved. Or they have decided to reduce the number of partners and vendors altogether by selecting one of the big enterprise hardware/services vendors. The obvious partners are clear—HP, IBM, and Sun. For example, if you go with HP and choose to implement an rp8400-based server platform with an HP StorageWorks SAN, running HP-UX 11i, and managed by HP OpenView, the challenges inherent to managing four different vendors' products just dropped tremendously. Similar arguments could be made for going with an IBM or Sun solution stack, too—IBM even throws a couple of databases into the mix.

    The System Landscape and Accessibility

    The last area I want to cover with regard to solution vision and the SAP system landscape is accessibility. Many companies over the last three or four years have started with a vision of dumping all application-specific interfaces in favor of browser-enabled solutions, so as to ease the burdens and costs associated with desktop/laptop management while opening up new accessibility approaches like hand-helds and other wireless devices. SAP has supported that vision since 1996, with the advent of Internet connectivity in R/3 3.1G. But only in the last few years have I really seen this take off.

    SAP AG offers quite a few accessibility options today when it comes to mySAP solutions. The classic SAPGUI and its revamped and more capable EnjoySAP SAPGUI represent one end of the spectrum. This approach is safe, very mainstream, and very easy to implement. And the SAPGUI we have today is extremely comprehensive, supporting all mySAP components through a single interface, which is unlike the approach a few years ago where each so-called "New Dimension" product like BW or APO required its own GUI. But the SAPGUI still represents a typical application-specific approach to accessibility; each end user installs the client on their desktop or laptop, or runs the SAPGUI from a network share, and off they go.

    Other accessibility approaches are available, however, as you see in Figure 3.6. The original WebGUI, for example, is based on HTML and provides connectivity via Microsoft's Internet Explorer and so on. And a more recent addition, the JavaGUI, allows native Java-based access to SAP. Both of these approaches fulfill an Internet-based approach to connectivity, and subsequently simplify the desktop (assuming Internet connectivity is a standard desktop offering at your particular company, of course).

    Figure 3.6Figure 3.6 Access to mySAP solutions is quite varied today, ranging from classic and updated SAPGUI options to newer Web-enabled versions.


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       Thursday 25 February   Wednesday 24 February   Tuesday 23 February   Monday 22 February

    The Photo Gallery highlights technical events, the Exhibition, and more.

    The Mock Trial Photo Gallery provides coverage of judges, wigs, and much more.

    SPIE Advanced Lithography Plenary

    Thursday 25 February 2010

    It’s back: Energy returns to lithographyIt was clear throughout SPIE Advanced Lithography that energy has returned to the lithography sector, agreed Symposium Chairs Christopher Progler and Donis Flagello. They praised the outstanding work on the part of conference chairs in organizing the programs, and the high-quality of content presented by the authors.

    The week was characterized by full conference rooms, busy exhibit aisles, and networking that started over breakfast and continued long past dusk. Technical conference attendance was another indicator, coming in nearly one-third higher than last year. The final count for total attendance for 2010 was 2,100.

    Standing-room-only conference rooms and high-energy networking continued through the final day, with the last sessions in five conferences, professional development courses, and award announcements topping off the week.

    Andrew Estroff,

    Rochester Institute of Technology, was given the Cymer-sponsored Best Student Paper in Optical Metrology Award for his paper on “Metamaterials for enhancement of DUV lithography.” Marshall Miller, Univ. California, Berkeley, won Honorary Mention for his paper on “Automatic numerical determination of lateral influence functions for fast CAD.”

    Technical special events concluded with a panel discussion on reference metrology in the nanotechnology process. The panel was moderated by Vladmir Ukraintsev, and included six panelists from Asia, Europe, and North America representing industry, academia, research, and manufacturing perspectives. Held in the Metrology, Inspection, and Process Control conference, the panel was also a part of the Global Collaboration in Reference Metrology working group meeting.

    Wednesday 24 February 2010

    Full rooms, busy aislesAll six conferences were in session on Wednesday, with many papers drawing packed audiences. Technical attendance is up more than 25% at this year’s SPIE Advanced Lithography, reflecting an optimistic trend throughout the industry.

    Technical special events included a panel sponsored by NIST on “Strategies for increasing the value of metrology and inspection,” and a well-attended poster session for conferences on EUV, Alternative Technologies, Optical Microlithography, and Design for Manufacturability through DPI. Moderators for the NIST panel were George Orji and Ronald Dixson.

    On Day Two in the exhibition hall, the aisles were full of shoppers and customers,

    and exhibitors reported much deal making on the floor as well as at the numerous company events. “Based on AL and other indicators, 2010 looks better,” said Sara Eideh of Synopsys. “We are delighted with how good Advanced Lithography 2010 has been.” Eideh said turnout for her company was nearly 50% better than last year.

    Tuesday 23 February 2010

    Panel Discussions Address Nano and EUVSPIE Advanced Lithography continues to be the place to find the right people, according to Day One feedback from exhibitors, with the steady traffic and strong energy on the exhibit floor providing more positive indicators of economic health. In the words of Wilma Koolen-Hermken, CEO of HamaTech,“It is obvious by the success of the meeting that the industry has begun to turn around."

    Others were enthusiastic as well. "Advanced Lithography is awesome, as always," said Ron Synowicki of J.A. Woollam, who was already pleased with the leads he had gotten only four hours into the show. "Nothing is better than face-to-face interaction with customers. We're seeing a great mix of academia and industry."

    “We were delighted that the attendees came in for afternoon coffee and stayed to talk business," said Patti Shaw of Brewer Science. "Leads are up over last year and the quality is good." Shaw said that Brewer doubled the number of staff they brought to Advanced Lithography this year, another indicator that business is on a up-swing.

    Conference rooms were busy throughout the day and at times standing-room-only, and a panel on metrology in the current economy closed the day for the Metrology, Inpsection, and Process Control conference.

    A Women in Optics luncheon presentation featured a talk by Anna Sidana of One Million Lights, an initiative to improve education, personal income, health, and environmental quality in developing countries by replacing kerosene lamps with portable solar lighting.

    It was a busy evening as well, with approximately 1,000 attendees at the first of the week's two poster sessions, and a spirited "trial" pitting EUV against DPT.

    Mock Trial Examines Rival TechnologiesOnly at SPIE Advanced Lithography in San Jose will you witness the world's top minds in the semiconductor industry donning black robes and white wigs and participating in a mock trial (heavy on the "mock") to determine the feasibility of rival technologies for the 22-nm HP node and beyond.

    Like a scene from Inherit the Wind or To Kill a Mockingbird

    seen through psychedelic lenses, an overflowing courtroom brimming with standing observers rose to honor Judges Chris Progler of Photronics and Donis Flagello of Nikon as they entered the court. Representing EUVL were Obert Wood and Bruno La Fontaine of Global Foundries, and representing double patterning ArF were Will Conley of Freescale and Mircea Dusa of ASML.

    The judges encouraged the audience, who were serving as jury, to move to the side of the room they agreed with as the trial progressed. This would prove difficult, as all seats and all standing room was well occupied with rapt observers. Judge Flagello reiterated that this court observed no legal code other than Moore's Law, and as evidence of this, the jury was asked to stand and bow allegiance to a massive, projected image of Gordon Moore.

    Opening arguments began with the case for EUVL, argued by Wood, who asserted that "it's all about k1." Comparing EUV vs DPL 193i, he showed significant degradation in DPL vs EUVL at 40-nm HP, and claimed that 22-nm HP was simply not possible with double patterning, while Zeiss had optical designs already to extend EUVL to below 22 nm.

    Conley went on the attack in his opening arguments for double patterning, showing roadmaps of ArF pitch division vs EUV.

    As a first witness, Skip Miller of ASML presented his cost analysis for patterning options at 2x-nm HP, showing that single-exposure EUV displayed the lowest cost of all options.

    Tatsuhiko Higashiki of Toshiba showed the Toshiba roadmap for EUVL to extend the spacer process, declaring that a 2x-nm HP node process study will begin this year or next to address some primary challenge, such as defectively < 0.1/cm2 and throughput above 100 wph.

    Janice Golda then showed Intel's needs to ramp up manufacturing at the 22-nm node by 2015. For logic layouts, she said, one might need 4 or more masks. She also asserted that a microprocessor company like Intel is much more sensitive to mask defectively than a memory maker, so Intel was challenged to make a zero-defect EUV reticle, which they did accomplish recently.

    Paul Ackmann from Global Foundries pointed out that the biggest issue is getting a new technology in place as soon as possible, and EUV has an advantage in that it can backfill to earlier technologies , while DPL cannot.

    Nigel Ferrar of Cymer was asked whether EUVL could be powered without a nuclear power plant, a reference to Burn Lin's oft-quoted assertion that EUVL sources will have exorbitant power needs. Ferrar stated that needs will be ~3x what an ArF scanner requires today, and that a 350 W source that delivers 150 wph will be available in 2011.

    An energetic Conley then cross-examined the EUV team's witnesses on source power with a comedic figure of EUVL powered by the Hoover Dam, and plotted his estimation of EUV fab and tool costs vs the GDPs of countries like Tonga, Belize, and Latvia.

    The witnesses for DPL then took the stand, beginning with Kevin Lucas of Synopsis, who showed multiple design rule and patterning options to extend into 22 nm and below.

    Kit Ausschnitt of IBM quoted Hamlet and displayed a very graphic animation of the "overlay elephant" that must be confronted to move to smaller nodes. He stated that overlay improvements will enable 193 nm DPL extension to 22 nm and beyond, but there will be no dearth of overlay challenges in either case. Certainly, he said, EUV is inevitable, but so is the imminent collapse of our sun. Possibly, he jabbed, EUVL will be ready by then.

    Andrew Hazelton of Nikon then pointed to Nikon's S620D shown in the Plenaries to show that DP is available today, and Patrick Wong of IMEC showed that for the 22 nm node, various solutions show promise for different layers and applications.

    Wood's Perry-Masonesque cross-examination of the DPL witnesses focused on the cost issues and complexity of the many masks necessary. The DPL witnesses rebutted his math and stood their ground that overlay was not a problem for DPL.

    After closing arguments, Judge Progler noted that the sheer number of observers serving as jurists made moving to their favored side of the room impossible, so he called for applause to determine the trial's winner. With equal applause, Progler declared a hung jury and adjourned, hinting that a retrial will be needed next year.

    Many more photos are available in the Mock Trial Photo Gallery.

    Monday 22 February 2010

    Panel Discussions Address Nano and EUV

    Nanotechnology in Microlithography Panel Discussion: Self-Assembling Molecules for Semiconductor Patterning and Nanoelectronics

    Panel Moderators: Richard M. Silver, National Institute of Standards and Technology (United States) and Christopher L. Soles, NIST (United States)

    The evening panel discussion on nanotechnology in microlithography opened with comments by moderator Christopher Soles of NIST, who set the tone by contrasting "bottom-up" processes like self-assembly (SA) with traditional "top-down" lithographic processes. Between these technologies, Soles explained, we have major differences - natural shapes vs conventional circuit design, local vs long-range order, monolayers vs high aspect ratio features, CMOS vs emerging applications, intrinsic scaling limits vs nanoscale dimensions, wet, soft processes vs clean room processes, slow ordering vs 100 wph, and the current pretty research pictures of SA vs true functional devices using lithography. He invited the panelists to discuss the near- and long-term prospects of SA and discuss the materials and metrology needs.

    Dan Herr of SRC then presented some of the challenges of directed self-assembly, including the needed shapes, throughput, and defects. He asserted that SA could very well be an augmenting technology to current processes rather than a competing technology.

    Greg Waldraff of IBM followed by presenting examples of electronic component self assembly on templated DNA biogrids, describing the ability of DNA origami to create nanoscale devices.

    Lars Liebman, also of IBM, made a case for beginning research now at the NSF level so that the technology is mature by 2016-2017, the time period Herr had predicted SA could be introduced into manufacturing. However, he cautioned that the community needs to be sure it is tackling the right problem and not ignoring trimming or other issues.

    Joy Cheng of IBM joined her colleague, Dan Herr, in displaying recent work in polymer self assembly, and Katy Bosworth predicted that the work they are doing at Hitachi on hard drive media could be one of the first to introduce block copolymers into a lithographic process.

    Robert Brainard of Albany CNSE concluded the presentations by showing the relationship between chemically amplified resists, nanoimprint, and self assembly, asserting that each technology has great strengths but will not be replacing each other. The panel then opened for debate and questions from the audience.

    BACUS Technical Group Panel Discussion: EUV Source $10M. EUV Scanner $100M. Defect Free EUV Photomask, Priceless! For some there's NIL, for everyone else, there's EUV.

    Panel Moderators: Bryan S. Kasprowicz, Photronics, Inc.; Franklin D. Kalk, Toppan Photomasks, Inc. Panel members (from left): Gilroy Vandentop, Bryan Rice, Anthony Yen, Oliver Kienzle, Tatsuhiko Higashiki, Paul Ackmann, Ben Eynon.

    Advanced Lithography opens to optimism, overflowing house

    A standing-room-only audience for the opening plenary session at SPIE Advanced Lithography in San Jose served as one more sign that the lithography industry is in a growth mode. Before the speakers from Nikon, Intel, and the venture capital firm Silver Lake Partners took the stage, a prestigious optical microlithography award and five new Fellows of SPIE were announced.

    M. David Levenson, now associated with BetaSights, was named this year’s winner of the Frits Zernike Award for Advances in Optical Microlithography, for his work in developing phase shifting masks. The Frits Zernike Award is sponsored by Cymer and ASML.

    The five new Fellows from the lithography community -- Robert Allen, Jon Benschop, Clifford Henderson, Soichi Owa, and James Potzick -- are among a total of 62 new Fellows of SPIE elected this year. The new Fellows were honored with 20 other lithography Fellows at a luncheon later in the day.

    More awards followed the talks, including:

    C. Grant Willson Best Paper award for 2009, to Richard Lawson, Laren Tolbert, and Clifford Henderson of Georgia Tech and Todd Younkin of Intel Corp.

    Jeffrey Byers Award for Best Poster Paper in Resist Materials and Processing Technology for 2009, to Xinyu Gu, Adam Berro, Younjin Cho, Kane Jen, Saul Lee, Tomoki Ngai, Toshiyuki Ogata, William Durand, and Grant Willson of Univ. of Texas at Austin, Arunkumar Sundaresan, Jeffrey Lancaster, Steffen Jockusch, and Nicholas Turro of Columbia Univ., and Paul Zimmerman of Intel Corp.

    The Willson award is sponsored by AZ Electronic Materials and Rohm Haas Electronic Materials, and the Byers award is sponsored by Tokyo Electron.

    Three conferences opened sessions Monday morning, and two of several panel discussions scheduled for the week closed the day. Richard Silver and Christopher Soles of NIST moderated a panel on Self-Assembling Molecules for Semiconductor Pattering and Nanoelectronics. Bryan Kasprowicz of Photronics Inc. and Franklin Kalk of Toppan Photomasks moderated the BACUS panel on future potential technologies, including EUV, NIL, double patterning and direct wire.

    Plenaries Explore Past and Future of Lithographic Technologies

    The plenary session for the 35th year of this symposium got underway with three presentations exploring the past successes and future prospects of lithographic technologies.

    Kazuo Ushida of Nikon presented his predictions for lithography's future, promising not to bring bad news, because as the Japanese proverb goes, "The priest who preaches foul doctrine shall be reborn as a fungus." He predicted that although the next few years look good for fab equipment, it's very unlikely that this industry will return to its former levels. Current thought, said Ushida, is that double patterning will take lithography from the 32 to the 22-nm node, and EUV will take it from the 22 to the 16 nm node. However - what, he asked, if EUV comes too late?

    While the prospects of EUV are great for advancing to the 22-nm node, Ushida declared that EUV still has a long way to go because 100x improvement is required in mask defectivity to achieve such feature reduction. Should development of the necessary mask infrastructure start today, he predicted, it would take 2 years for tools to be available and another 2 years to fully understand defects before EUV could be a reality in 2014 - long after it would be needed for the 22-nm node. Because of this, one needs to look at alternative means of achieving the 22-nm node.

    He presented three alternatives: spacer double patterning, pitch splitting double patterning, and line-cutting lithography, the last of which enables ArF extension to 16 nm. Because EUV is too far off to be practical, he said that 22 nm requires double patterning with immersion, which in turn will require high overlay accuracy, CD uniformity, excellent throughput, low cost of ownership, fast installation, and the possibility of reuse for next generations. He then presented Nikon's solution to all of these issues - the NSR-S620D - which has less than 2 nm overlay and 200 wph throughput and allows a modular approach to its construction enabling multigenerational use. Although 2010 and 2011 will be good years as the industry recovers, Ushida asserted that EUV challenges in mask infrastructure will delay its implementation until the 16-nm node.

    Eric Chen of Silver Lake Partners then gave an overview of the economics behind the lithography industry and voiced his concerns that without a change in global balances, the economy will never fully recover. However, he suggested that with a change in paradigms, there is great market potential. The root causes, he said, of the worst global economic conditions in recorded economic history (the 2009 recession) were the ease of liquidity, the US real estate market bubble, and the widespread excess leverage.

    These created a crisis that is just now seemingly stabilizing, but we aren't out of the woods yet. The last 20 years has seen an unprecedented integration of global economies that have resulted in an imbalance in the world economy. Chen asserted that this model is broken, and without normalized growth in developing economies as well as the driving down of debt and consumption in developed countries, the economy will not rebalance.

    Chen reminded the audience that a recession in the tech sector was seen most recently in 2000-2001 when the equity bubble burst (as opposed to 2009's debt bubble). Unfortunately, debt bubbles are more severe and harder to recover from. Two things drive economic growth - demographic changes and changes in productivity. Since productivity increases are driven by technology, Chen said, technology advances will likely save the day and drive new growth.

    Chen then reviewed a number of macro trends in technology. First off, he described the evolution of software into a service economy, such as the change from CDs and personal programs to iPhone apps and cloud computing driving mobile and telecom. He pointed out the increasing pace and scale of clean technology, and then summarized the growing threat of Asia, noting its rise as an innovation leader as it moves from the inexpensive commercialization of technology to encompassing low-cost R & D on the leading end as well.

    Sam Sivakumar of Intel then presented a talk that looked at the evolution of lithography as a play in four acts, starring the triumvirate of lithography, design, and process architecture.

    In Act I: The Distant Past, Sivakumar considered the .25 micron and earlier technology and found that during that time period, lithography delivered design intent, but did not influence design or architecture. In Act II: The Recent Past (down to 65 nm), lithography then delivered design intent with some difficulty, such as in rule-based serif placement and hotspot determination. In present time, Act III (45-32 nm), lithography is now interacting closely with design and process architecture, profoundly influencing methodology in both areas.

    As for the future, he predicted (1) lithography will play a central role in defining design methodology and process architecture; (2) mask technology has become and will continue to be an integral part of lithography planning for the next generation; and (3) managing the cost of patterning will be the real challenge in the near term. But lithography has become a full, equal partner with design and process integration and the quality of their interaction will determine the industry's success or failure.


    Sculpteo, FICEP S3, ZiggZagg, and Multi Jet Fusion: HP Global Innovation Summit Highlights Real-World 3D Printing Installations, Implications | killexams.com real questions and Pass4sure dumps

    Beautiful Barcelona houses a charming intersection of gothic architecture, twentieth century art, and burgeoning twenty-first century technology. Serving as the site of last week’s insightful HP Global Innovation Summit, the city welcomed journalists and analysts from around the world to share in two days of insights into the heart of disruptive technologies. 3D printing and immersive computing represent keys to the future of disruption — and to Industry 4.0. Never content to go along for the journey, global mainstay HP Inc. is working to secure a driver’s seat to this future, focusing on reinventing for this onward momentum.

    While the first day of the summit focused on HP and its approaches and offerings, the second day featured customer and partner stories highlighting real-world implementation of 3D printing and immersive computing technologies. With rising global installations of Multi Jet Fusion (MJF) 3D printing technology, partners including the newly-opened International Advanced Manufacturing 3DHUB (IAM 3DHUB) serve as viable examples of additive manufacturing in use today. During the summit, reports from France-based Sculpteo, Barcelona-based FICEP S3,  and Belgium-based ZiggZagg provided further first-hand experiences bringing MJF to the everyday of industry.

    A 3D printing panel opened the morning, as Vice President and General Manager of Multi Jet Fusion Ramon Pastor moderated a session including Sculpteo CEO and Co-Founder Clément Moreau, FICEP S3 Director Nuno Neves, and ZiggZagg CEO Stijn Paridaens.

    3D Printing Panel L-R: Paridaens, Neves, Moreau, Pastor

    “We started with 3D printing out of necessity, to design new machinery, innovative machinery; we had a lot of troubles getting optimal geometries by machining, so we adopted 3D printing,” Neves explained of his company’s approach to incorporating additive manufacturing. “Now we do R&D in additive manufacturing for other companies, helping other companies get to where we are now. We’ve been here eight years, and doing 3D printing for a year and a half — it was HP who introduced us to 3D printing.”

    ZiggZagg has been on the market now for about seven years, and started working with HP’s 3D printers about a year ago. The company went from one machine to six machines over the last twelve months, and Paridaens noted that they see “a lot more to come; we see a huge market opening up with this technology.”

    Sculpteo, which started with 3D printing for rapid prototyping, now incorporates the technology throughout its operations alongside other manufacturing technologies and uses 3D printing for mass production.

    “We are a manufacturing center, not that much a design center; our customers do pretty much everything,” Moreau noted, showing a 3D printed helmet Sculpteo created using HP’s technology. “Multi Jet Fusion for this type of product is definitely the only good possibility that you have. This is a new type of product, a new type of geometry — you cannot make this by injection molding.”

    Geometries, strength, and price points were the major factors that each of the three kept returning to, as Neves noted that making one of their Da Vinci Paint Machines using MJF eliminates about 2,000 molds and that, effectively, the company’s investment into the industrial 3D printer was reutrned through the course of making just one machine.

    “I agree that price is one of the reasons to adopt MJF,” Paridaens said. “We are planning to purchase an additional five printers by the end of the year… We add some sort of a value to a part that helps the customer that can only be produced by 3D printing… Really making now the strategy of mass customization and mass production, we see a large market opening up… As of now, I believe customers are still not ready if you go right toward them, but if you have large concerns, large companies” employing the technology, adoption becomes more likely. “Also new materials coming up are one of the key factors why we decided to adopt this technology.”

    Trust, Pastor underscored, is “key to adoption” for new technologies. In many sectors, such as engineering, potential adopters are often risk-averse and prefer to stay to tried-and-true techniques in which they trained — even if that training was decades ago. Learning the intricacies of a new approach requires significant dedication, as, for example, design for additive manufacture (DfAM) represents a wholly new approach distinct from traditional design for machining or other subtractive technologies. Dedicating time, floorspace, and other resources to a new suite of technologies requires trust that the process will be worth it. Pastor asked the gathered executives about their thoughts on the key factors to unlock the market and accelerate adoption.

    “Company engineers are the key factor, they are the ones making the designs,” Paridaens said. “We see in Belgium that education is now keeping up, kids in college are introduced to the technology. When we go to the customer, they say, ‘We have done it this way for decades, let’s do it this way.’ It’s a matter of trust. It needs to be proven.”

    Building on that response, Neves added, “People keep designing parts the way they’ve always done it… With MJF, what’s hardest is getting people to actually come, to see the product, touch it with their hands. We end up giving away a lot of samples… The key word is implementation… If you keep doing things the way you’ve been doing them, if you design as you’ve been designing, you won’t design anything new.”

    Neves noted as well that truly understanding the technology and its capabilities allows for informed design that enables the right design the first time. While 3D printing famously speeds iteration and prototyping processes, understanding the control of dimensional precision — as well as how a part will cool, and so contract or expand — allows for a speedier time to market for final parts production. DfAM requires significant attention and energy, but once through the learning curve, proves itself with a fast ROI and ensuing profit, Neves added later when we sat down for a lengthier conversation.

    During the panel, Pastor asked Moreau, Neves, and Paridaens to “open your crystal balls for a look into how you see the future” and what challenges 3D technologies will have in unveiling this future.

    “3D printing, or additive manufacturing, really becomes a manufacturing technology for everyone,” Moreau began.

    “One key thing, we learn that education is key, design is key, software is also very important — the way you organize a factory software-wise is very important. An additive manufacturing factory is not just a factory with additive manufacturing; it’s something you need to handle very carefully. You cannot organize a short-run production factory in exactly the same way you would organize a mass production factory. New software tools need to be involved and imlemented. In this way, I think we can have additive manufacturing factories everywhere, in service bureaus as well as in customer hands.”

    Sculpteo, for its part, certainly understands the wide reach of 3D printing, as its global operations are up and running to serve a broad variety of customers with a variety of manufacturing technologies. Late last year, the company introduced its Fabpilot software, designed first for internal use to connect operations at its Paris and San Francisco facilities, and broadened for customer use to smooth workflows for 3D printing for production.

    Moreau discusses details a of a 3D printed helmet

    Neves underscored the importance of software, building on Moreau’s point. More accurate simulation is a specific need for the future of additive manufacturing, as current solutions “don’t always hold up.” As an example, he pointed to a part from FICEP that breaks at a 20 kilogram load; “SOLIDWORKS says it should break at 16 kg; on the one side this is good, it’s stronger than we think; on the other hand, we use more material than we need to because of this.” Understanding the exact load capabilities is necessary for designing for the requisite strength of a given part, including the amount of material. Simulation is certainly in focus for many software companies in the 3D space, and Neves’ crystal ball reading on this front aligns well here.

    Looking more deeply into his crystal ball, Neves noted embedded electronics as a next big thing for 3D printing. This development is held back not only by today’s additive manufacturing capabilities, but by industry standardization in the form of a common connector for sensors.

    “This will be a lot of work, and everyone has to work together,” he noted. “HP has to work with its customers to basically evangelize this industry. Once we make parts for a customer, they are a repeat customer. This is quite nice. It’s getting this person, this company, to take the responsibility, the ‘Yeah, I want to try this.'”

    Speaking as well to the future in a Q&A with the gathered attendees, Moreau added that another trend Sculpteo is seeing comes in the form of requested materials. Flexible and food- and skin-contact safe materials are at the top of the request list. FICEP and ZiggZagg do most of their 3D printing work in HP’s available materials, with PA 12 dominant for both at present. Future materials offerings hold great interest to both of these companies, but PA 12 is expected to remain a mainstay even as additional, particularly more flexible, materials emerge.

    “What else I would like to see is metal, but that’s a different machine,” Neves said — and indeed, HP has announced its intent to offer a metal 3D printing system.

    An interesting and important issue that Paridaens raised as well was in response to a question in which it was suggested that additive manufacturing may take the place of traditional techniques.

    “It’s funny how you use the word ‘replace.’ I don’t think additive manufacturing will replace traditional manufacturing — it will add to traditional manufacturing,” he said. “It’s not the holy grail. It’s something that can help in a prototyping stage up to the production stage.”

    3D printing is, indeed, a manufacturing technology, not a magical answer (or, going back to the days of high hype, a Replicator from the Enterprise). Recognizing the complementary nature of these technologies for industry is a key part of the adoption and education process, and Paridaens’ underscoring this messaging in a discussion of real-world applications was a well-placed reminder that disruption doesn’t necessarily mean full-on displacement.

    Following this panel discussion, immersive computing took center stage with insights in real-world applications for personalized footwear.

    I also sat down for longer conversations with Paridaens and Neves later, including a visit to FICEP’s facility outside Barcelona, for additional insights into their implementation of 3D printing into their workflow and strategic approaches — stay tuned for these interviews and more from my whirlwind time in Barcelona.

    Discuss HP, Multi Jet Fusion, the future of manufacturing, and other 3D printing topics at 3DPrintBoard.com or share your thoughts in the Facebook comments below.

    [All photos: Sarah Goehrke]


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