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HP0-302 - Planning and Designing HP Superdome Server Solutions - Dump Information

Vendor : HP
Exam Code : HP0-302
Exam Name : Planning and Designing HP Superdome Server Solutions
Questions and Answers : 137 Q & A
Updated On : December 13, 2018
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HP0-302 Questions and Answers

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HP0-302 Planning and Designing HP Superdome Server Solutions

Study Guide Prepared by Killexams.com HP Dumps Experts


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HP0-302 exam Dumps Source : Planning and Designing HP Superdome Server Solutions

Test Code : HP0-302
Test Name : Planning and Designing HP Superdome Server Solutions
Vendor Name : HP
Q&A : 137 Real Questions

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HP Planning and Designing HP

HP planning economical steel additive manufacturing & full-color 3D printing in 2018 | killexams.com Real Questions and Pass4sure dumps

Oct 13, 2017 | by Benedict

HP is planning to free up a metal 3D printing platform in 2018, as well as a full-color 3D printing solution. The business says it has developed a “novel” strategy to metal 3D printing, adding that its full-colour 3D printing will present “mechanically powerful” ingredients.

smartly here’s a huge juicy 3D printing story to end the week on. After entering the 3D printing market ultimate yr with its Jet Fusion 3D printer, printing colossal HP has jumped right into the middle of the additive manufacturing world.

despite the fact the expensive Jet Fusion has in general been used by way of huge organizations like Deloitte and Nike, even informal 3D printing fanatics will have an interest to look the place the inkjet extraordinaire goes next.

HP CEO Dion Weisler this week gave a large clue about his enterprise’s subsequent moves, suggesting that 2018 might see HP releasing each metal 3D printing and whole-colour 3D printing options. considering that the Jet Fusion best seemed in 2016, that’s rather an exhilarating soar for the mega-manufacturer, even considering its monetary clout.

despite the fact full particulars will most effective be launched subsequent 12 months, Weisler cautioned that HP’s coming near near color printing solution would be an extension of the Jet Fusion mannequin. The CEO has even demonstrated a couple of colorful 3D printed elements to valued clientele, displaying that the know-how is neatly on how to completion.

in one instance, HP used this colour 3D printing expertise to highlight distinctive stress areas on a multi-colored bracket. “The fashion designer can zoom in on high-stress areas and see the place they may regulate the design,” Weisler pointed out. “entertaining shapes like this in full color are only capable of be produced with 3D printing.”

however there isn’t a whole lot guidance to move on, HP’s declare that it can be in a position to 3D print full-color parts that are “routinely effective and fully useful” is something to get relatively enthusiastic about. At current, correct full-color 3D printing is often only attainable on machines like those made by using Stratasys.

infrequently, however, does Stratasys boast in regards to the useful knowledge of its colour 3D printed materials. in reality, most situations of full-colour 3D prints tend to be 3D photographs, inventive fashions, and usually non-purposeful objects.

by way of adding mechanical performance to full-colour 3D printing, HP may be carving out a probably lucrative area of interest.

involving HP’s metal 3D printing plans, Weisler became extra reserved, handiest promising that the printing company changed into establishing a “unique” and “disruptive” steel 3D printing know-how.

“Our 3D printing metals know-how is exciting and includes wide HP highbrow property,” Weisler noted.

Excitingly for organizations with a decrease profile than Deloitte and Nike, HP additionally plans to introduce its subsequent generation of 3D printing options at a lessen price aspect, permitting medium-measurement organizations to take abilities of multi-color Jet Fusion 3D printing in addition to this mysterious new metal fabrication know-how.

To prove that things are coming alongside nicely with both applied sciences, Weisler additionally had some 3D printed steel parts to exhibit to purchasers. “These are elements that are produced within the hundreds of thousands because of path the place we are taking our expertise is not only for small prototyping,” he stated. “this is for mass manufacturing to disrupt a extremely huge common industry.”

finally, HP sees 3D printing as a protracted-time period funding, and not does predict its additive manufacturing operations to be profitable in the near future.

That’s no subject for HP, because the enterprise’s economic outlook for the fiscal year 2018 turned into generally advantageous. In an announcement put out the day before today, the company pointed out an estimated fiscal 2018 free cash move of at the least $3 billion, 50 to 75 per cent of which could be again to shareholders.

“we are smartly located to lead in the core, speed up boom alternatives, like A3 and pictures in Printing and industrial transformation in own techniques, and capture the long run with 3D Printing in plastics and now metals,” Weisler pointed out of HP’s 2018 outlook.

Cathie Lesjak, Chief economic Officer, introduced that “HP has been constructing powerful enterprise momentum, demonstrating our method is working.”

So instead of use additive manufacturing as a method to generate instant money, HP is eyeing up a foothold in the so-called “fourth industrial revolution.” The business even plans to complement its new 3D printing know-how with AI, with a purpose to develop an entire new technology of additive manufacturing systems. Embedded sensors and different extra features could additionally improve the company’s inventory in the 3D printing world.

Weisler summed up HP’s lengthy-time period 3D printing plan by way of declaring that, although the Jet Fusion isn’t liable for generating a whole lot income at current, 3D printing is still “materially important to the strategic path” of the business.

Posted in 3D Printing technology

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HP Debuts comprehensive Design to Print Portfolio at Autodesk college 2018 | killexams.com Real Questions and Pass4sure dumps

Showcases innovations designed for architectural, engineering, and development organizations

LAS VEGAS, Nov. 13, 2018 (GLOBE NEWSWIRE) -- these days at Autodesk tuition, HP Inc. introduced new hardware and options to aid alternate the style architectural, engineering, and building (AEC) industries design and print. Autodesk users will now event sooner HP PageWide XL printers1, leap forward simplicity with HP options for gigantic format printers, new Z by using HP portfolio enhancements, and advances in VR.

the new know-how makes its debut in the HP showcase (#A451) of recent printing hardware and options designed to be intuitive and productive for Autodesk clients. event the brand new HP options for large layout Printing, HP PageWide XL printing expertise, the newest HP DesignJet Z9+ PostScript® Printer collection printing Z by using HP posters, the HP DesignJet T830 24-in Multifunction Printer, HP new powerful HP ZBook mobiles, and VR “snacking” device.

Reinvents technical print creation with quicker entry-level PageWide XL solutionsNow 25 % quicker on the equal price1, the upgraded HP PageWide XL 4000 sequence is the most comparatively cheap solution within the PageWide XL portfolio for commercial enterprise, public sector clients, together with architects and engineers, to achieve speedy, and straightforward printing with a consolidated printing workflow.

The HP PageWide XL 4600 Printer and MFP and HP PageWide XL 4100 Printer and MFP be a part of the quickest printer portfolio within the market2 providing hurries up to 15D/A1-dimension or 10D/A1-dimension prints per minute, for technical work groups of architects and engineers and replica retail outlets to convey technical files with short turnaround and low operating prices.3

With greater than 7,000 devices shipped and 5 billion ft² (500 million m2) printed due to the fact the HP PageWide XL printer launch in 2015, more shoppers are discovering the value the market-leading4 HP PageWide XL printers bring to companies international. HP PageWide XL printers do the job of two printers in a single gadget, providing both monochrome and color prints at step forward speeds: the vigour of one.

Frictionless large format printing experienceEight-5 percent of design creators need aid when printing in huge format5. HP is focused on supplying seamless print experiences with new solutions to enable creativity, productivity, and smarter the right way to bridge the actual print with the digital world. Designed to simplify how AEC companies print, clients have entry to 1 click solutions and might almost print each time and anyplace from all contraptions.

primary and simple print options encompass:

  • HP click: This one-click on laptop printing application offers valued clientele the self assurance to print appropriate the first time. HP click on now enhances the users batch printing journey with only one click via optimizing media usage and costs while reaching error free printing.
  • HP smart App: A cellular app designed to print, scan, and share content now allows for clients to print content from the cloud from basically anywhere with transparency and control.
  • HP Poster App: a simple online design tool to create and print skilled looking posters with the largest collection of free and premium content. Now users have entry with direct and straightforward printing with HP click.
  • "In an international with a 100 percent digital building imaginative and prescient, paper continues to be essentially the most common tool used within the container. Small businesses in the AEC industry require the right equipment to bridge physical prints with dynamic digital solutions, like CAD utility,” spoke of Guayente Sanmartín, customary manager and global Head, HP massive structure Design Printing. “HP’s imaginative and prescient is to merge the best of the physical and digital worlds to have all and sundry on the same page."

    HP is taking part with purchasers all over on providing a pilot program focused on using augmented reality applied sciences to aid reduce mistakes brought about by using outdated plans.

    "The HP Augmented Print answer has gigantic talents. It bridges the hole between digital and paper. we are excited to work with HP to increase our valued clientele’ development projects,” mentioned Roberto Molinos, CEO and founder, Modelical.

    At Autodesk college, HP will additionally showcase powerful HP ZBook mobiles and a VR “snacking” tool.

    changing the style, the world DesignsThe new Z by way of HP portfolio together with HP ZBook cellular workstations, HP Z pcs like the mighty HP Z2 Mini or the effective HP Z8, and the award-winning HP DreamColor displays, convey the potent productivity, versatility and security these days’s energy clients should do their most reliable work.

    The HP ZBook Studio, HP ZBook Studio x360, HP ZBook 15 and HP ZBook 17 have been stronger with superior processing power, resourceful security aspects and brilliant displays. The efficiency boost, with six-core Intel® Core™ i9 processors, will permit clients to handle heavier workloads, equivalent to video editing and 3D rendering. The multiplied memory option as much as 32 GB of reminiscence (expandable as much as 128 GB counting on mannequin) makes it possible for users to work sooner with huge amounts of information. New protection characteristic RAID 1 gives clients mirrored SSD storage, proposing peace of intellect with the aid of always featuring back up for helpful facts.

    Story Continues

    Tackling VR in New WaysFor architects, product designers, builders and educators, HP revealed its Opera Glass proof of idea for “VR snacking.” The HP Labs innovation makes it possible for “VR snacking” clients to immediately and easily switching between fundamental reveal and VR headset while seated or standing at a desk. With HP’s creative thought, clients can without delay enter and exit their VR environment, seamlessly integrate with a normal workflow and at once share a VR journey with a gaggle.

    Furthering its commitment to supplying a complete VR solution, HP is working with Theia Interactive, a relied on developer that creates world-category VR visualizations for architecture, manufacturing and beyond. Theia has huge experience developing architectural walkthroughs, indoors design configurators, XR product demonstrations, digital reality practising simulators and advertising experiences for brands.

    Availability7

  • The HP PageWide XL 4600 and HP PageWide XL 4100 Printer series are scheduled to be purchasable with the aid of December 1 in the US, Canada, and EMEA. certain nation releases will comply with.
  • The HP ZBook Studio x360 is attainable now for a beginning expense of $1,499.
  • The HP ZBook Studio is accessible now for a starting expense of $1,349.
  • The HP ZBook 15 is obtainable now for a starting expense of $1,349.
  • The HP ZBook 17 is obtainable now for a starting price of $1,349.
  • About HPHP Inc. creates technology that makes life better for everyone, all over. through our portfolio of printers, PCs, mobile instruments, options, and capabilities, we engineer experiences that amaze. extra advice about HP Inc. is obtainable at http://www.hp.com.

  • the new HP PageWide XL 4600 Printer collection prints up to 15 D/A1 measurement pages per minute in comparison with the previous HP PageWide XL 4500 Printer supplying 10 A1/D measurement pages per minute.
  • fastest in accordance with option low-extent LED printers and MFPs (beneath 7 D/A1 pages/minute) as of November 2018.
  • Operational costs based on low-volume LED know-how under $20,000 USD available in the market as of November 2018. Operational expenses include supplies and service charges. For checking out criteria, see http://www.hp.com/go/pagewidexlclaims.
  • HP PageWide XL printers portfolio are global market leaders in high-volume and mid-extent each within the u . s . a . and in Canada representing forty% of the percentage in response to IDC market share facts outcomes from August 2018, growing +9% YoY.
  • From internal market analysis examine carried out on LF printer clients – September 2018.
  • in keeping with laptop workstations as of June 14, 2017 and power in line with processor, images, memory, and vigor give.
  • Pricing and availability subject to trade. Availability may also differ counting on location and nation.
  •       Autodesk and the Autodesk emblem are registered logos or logos of Autodesk, Inc., and/or its subsidiaries and/or associates in the usa and/or different international locations.

    © 2018 Hewlett-Packard development business LP. The assistance contained herein is discipline to change without notice. The most effective warranties for HP Inc. products and functions are set forth within the categorical guarantee statements accompanying such products and features. Nothing herein may still be construed as constituting an further assurance. HP Inc. shall no longer be chargeable for technical or editorial blunders or omissions contained herein.


    HP Proposes 'VR Snacking' as a solution for Engineering Workflows | killexams.com Real Questions and Pass4sure dumps

    Opera Glass, a new proof of conception from HP Labs, goals to extra seamlessly mix digital reality into design engineering workflows.

    An attendee at the 2018 Autodesk tuition convention tries a demo of HP Labs' proof of thought for Opera Glass. (image source: HP)

    Even VR lovers need to admit it will also be a cumbersome event: inserting on a head-mounted monitor (HMD), dealing with controllers, maybe constructing sensors, and extra. This experience is barely inconvenient adequate to preserve engineers working with CAD and a typical pc setup.

    One solution, as proposed with the aid of HP Labs—the exploratory R&D wing of HP—is the thought of “VR snacking”—letting users quickly and easily swap between a typical computer screen monitor and a VR headset. feel of it as having a dual-computer screen setup—best the VR headset features as the 2d video display.

    HP unveiled a proof of thought for VR snacking on the 2018 Autodesk tuition convention in Las Vegas with a headset referred to as Opera Glass. actual to its namesake, the design of Opera Glass harkens lower back to old opera glasses (or theater glasses)—virtually, a small pair of binoculars on a stick. The conception is to dispose of the need to absolutely strap on a headset and allow designers to instantly appear throughout the headset for short work assessments.

    for instance an engineer is designing a brand new part in 3D CAD. any individual that has carried out this will be normal with abilities considerations of scale and healthy. one of the crucial merits of VR-based mostly design and digital twins is that they present a glimpse of precise world fidelity with no need to supply a actual part. however, now not many engineers are yet inclined or accustomed to designing entirely in VR. moreover, switching backward and forward between VR and 3D CAD can be a time suck.

    in keeping with an announcement from HP, “HP Labs asked, 'What if...with out leaving the desk, the dressmaker grabs the VR Opera Glasses and appears throughout the VR view? The [product] is practically introduced at full scale. The fashion designer returns to 3D CAD and modifies the design. The clothier can right now—pretty much seamlessly—switch from 3D CAD to VR with out getting up or gearing up.'”

    An HP spokesperson advised Design information that the business as of yet has no reliable plans to make Opera Glass an professional product. as opposed to a working prototype of a brand new product, what was on reveal at Autodesk college looks to be HP's home windows blended reality headset with some exterior changes to allow for the stick attachment.

    What do you think of this theory? Would you decide upon VR snacking over a full-on VR setup to your workflow? let us know within the comments!

    Chris Wiltz is a Senior Editor at  Design information overlaying rising applied sciences including AI, VR/AR, and robotics.


    HP0-302 Planning and Designing HP Superdome Server Solutions

    Study Guide Prepared by Killexams.com HP Dumps Experts


    Killexams.com HP0-302 Dumps and Real Questions

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    HP0-302 exam Dumps Source : Planning and Designing HP Superdome Server Solutions

    Test Code : HP0-302
    Test Name : Planning and Designing HP Superdome Server Solutions
    Vendor Name : HP
    Q&A : 137 Real Questions

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    Planning and Designing HP Superdome Server Solutions

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    High Performance Servers built to your exact need by M&A Technology | killexams.com real questions and Pass4sure dumps

    CARROLLTON, Texas, Nov. 13, 2018 /PRNewswire/ -- M&A Technology, Inc. is nearing its 35th year in business and continues to offer customers purpose built, application specific high performance server solutions.  Servers built to the exact need and specifications our customers have for their demanding environments.

    Supercomputing 2018 ( SC18 ) which is an international conference for High Performance Computing (HPC), Networking, Storage, and Analysis solutions will be held in Dallas, Texas this week.  The largest technology companies in the ecosystem will be exhibiting their solutions from companies like Intel, Nvidia, Lenovo, Dell, HP, Google, IBM, AMD, and many others.  Having this global, high technology event continues to reinforce the business friendly approach here in Texas.

    The best innovation available in high performance server technologies and solutions will be highlighted with the intent of tackling the most demanding applications and data sets.   Most solutions are designed to be deployed globally and scale in very large volumes.  While this will serve some companies well, a more specific solution is often needed by others in the market.

    At M&A, our approach is to build exactly what the customer needs when there is a requirement for high performance, purpose built, and application specific servers.  Using industry standard components built on open standards platforms that allows for custom solutions taking advantage of the high volume economics the technology industry is built upon.

    M&A works closely with our customers to understand their needs and build high quality products in our Texas based manufacturing facility utilizing the ISO 9001:2015 quality management system. This standard is based on a number of quality management principles including a strong customer focus, the motivation and implication of top management, the process approach, and continual improvement.  Adhering to ISO 9001:2015 helps ensure that customers get consistent, high quality products and services, which in turn brings business benefits to our customers.

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    M&A Technology's focus is on providing complete solutions to its customers, from product selection to delivery, followed by excellent support. We work closely with our customers to understand their unique requirements and then build a support plan to provide complete customer satisfaction. To handle our customers' requirements, we manufacture our own line of Desktop PC's, Servers, and other IT and OT products in our 36,000 square foot manufacturing facility in Carrollton, Texas.

    This enables us to control the customer's configuration and product life cycle. We have refined this customer-centric approach over the past 30+ years to offer customer hardware and software management, asset tagging, customer specific configurations, quick turn product development, and extended product life cycles.

    Our mutually defined solutions are designed to reduce the total cost of ownership for OEMs, developers, school districts and government entities, increase end-user satisfaction, and enable our customers to focus on their core business.

    CONTACT: Scott Zych, szych@macomp.com

    View original content:http://www.prnewswire.com/news-releases/high-performance-servers-built-to-your-exact-need-by-ma-technology-300749279.html


    Explore World Microserver market opportunities and forecasts, 2017-2023 | killexams.com real questions and Pass4sure dumps

    A small computing appliance that works like a server appliance is a Microserver. These servers provide ease of installation and maintenance.

    Microservers use system-on chip concept due to which the size of server is reduced. This type of server is used in the datacenters where lightweight servers are in demand.

    Serving web content is an example of the type of workload that is suited for miocroservers.

    These servers are energy efficient and have high-density design and the infrastructure can be shared by hundreds of physical nodes.

    Microservers are space savers due to which they consume low power; hence, these servers are widely used. Its compact size, high density, efficiency, and low power consumption are some of the driving factors for this type of market.

    The evolution of cloud computing technology and the use of servers in various datacenters have made the market very lucrative. As the usage of cloud is expected to increase, there are enormous opportunities for the micro-server market to grow. 

    Download Sample Copy: www.alliedmarketresearch.com/reque…tm_source=whatech

    Microserver market analysis by Components

    The components used in microserver are Hardware, Software and Operating System. These servers are preinstalled and configured on the hardware.

    Microservers are the space savers, as they use all its components in a single integrated chip termed as system on chip due to which, the storage space and the processor of the server are fit into a compact space. This small chip comprises of the memory space and processors that are required in microservers.

    Hardware and operating system are the most essential components of the microserver. 

    Microserver market analysis by Processor

    The various types of processors available in the market are ARM processors, Intel processors, AMD processors and other variety of processors. The efficiency of the microserver depends on the type of processor, which is been used in the server.

    Download copy: www.alliedmarketresearch.com/reque…tm_source=whatech

    ARM and Intel core processors are very popular in the market. Intel processors are most commonly used by the vendors, which contributes by generating high revenue for the segment.

     Microserver market analysis by Application

    Microservers are most commonly used in datacenters and cloud computing technologies. As the cloud computing technologies uses microservers for storing the data on small devices, the usage of microservers is expected to increase in future.

    This would in turn increase the share of microservers market.

    Microserver market analysis by End User

    Small scale, medium scale and large-scale enterprises are using these types of servers, which provide high performance and efficiency. The benefit of the microsevers such as low power consumption leads to economical microserver; hence, increases its use in various applications.

    Therefore, these servers are preferred by the end users such as SMBs.

    Microserver market analysis by Geography

    The research is carried out in different regions such as North America, Europe, Asia-Pacific, and LAMEA. Among the various geographies studied, North America has adopted the microservers on large scale.

    This region is the highest revenue generating segment amongst the regions that are been analyzed.

    Competitive Landscape

    The competitors in the market are adopting product launch as their strategy to maintain their position in the competitive market. HP has launched new microserver named HP Proliant Microserver G7 N54L to maintain the business information in smaller devices.The key players in the market are ARM Ltd., Intel Corporation, Hewlett Packard Co., Advanced Micro Devices, Inc., Dell Inc., Marvel Technology, Quanta QCT, Penguin Computing, Inc., Tilera Corp. and MiTac International Corp.

    HIGH LEVEL ANALYSIS

    The market exploration provides a fair idea of the global microservers market with its key benefits, concern areas and global opportunities. Porter’s five-force model helps in analyzing the market forces, barriers, strengths,., of the global market..

    The bargaining power of buyer and supplier is analyzed based on the competitors in the market. Threat of new entrants and inter-segment rivalry is analyzed based on the current market players.

    Market dynamics are analyzed on the strategic moves of the competitors, which would in turn help the stakeholders in the global market.. The value chain analysis helps in mapping the operational activities of the various stakeholders and assessing their efficiencies

    KEY BENEFITS

  • The analysis provides information about current market situations, changing market dynamics, expected trends and market intelligence
  • Porter’s Five Forces and SWOT analysis are provided to aid in developing strategies
  • Insights on the opportunistic areas would help the stakeholders in implementing strategic business plans
  • Companies profiled in the report help to understand the strategies adopted by the key players and their strategic moves
  • The study discusses about the competitive strategies for effective planning and execution of business plans
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    Opinion: Chiplets to drive the future of Semis | killexams.com real questions and Pass4sure dumps

    In context: A classic way for engineers to solve a particularly vexing technical problem is to move things in a completely different direction—typically by “thinking outside the box.” Such is the case with challenges facing the semiconductor industry. With the laws of physics quickly closing in on them, the traditional brute force means of maintaining Moore’s Law, by shrinking the size of transistors, is quickly coming to an end. Whether things stall at the current 7nm (nanometer) size, drop down to 5nm, or at best, reach 4nm, the reality of a nearly insurmountable wall is fast approaching today’s leading vendors.

    As a result, semiconductor companies are having to develop different ways to keep the essential performance progress they need moving in a positive direction. One of the most compelling ideas, chiplets, isn’t a terribly new one, but it’s being deployed in interesting new ways. Chiplets are key IP blocks taken from a more complete chip design that are broken out on their own and then connected together with clever new packaging and interconnect technologies. Basically, it’s a new version of an SoC (system on chip), which combined various pieces of independent silicon onto a multi-chip module (MCM) to provide a complete solution.

    So, for example, a modern CPU typically includes the main compute engine, a memory controller for connecting to main system memory, an I/O hub for talking to other peripherals, and several other different elements. In the world of chiplets, some of these elements can be broken back out into separate parts (essentially reversing the integration trend that has fueled semiconductor advances for such a long time), optimized for their own best performance (and for their own best manufacturing node size), and then connected back together in Lego block-type fashion.

    While that may seem a bit counter-intuitive compared to typical semiconductor industry trends, chiplet designs help address several issues that have arisen as a result of traditional advances. First, while integration of multiple components into a single chip arguably makes things simpler, the truth is that today’s chips have become both enormously complex and quite large as a result. Ensuring high-quality, defect-free manufacturing of these large, complex chips—especially while you’re trying to reduce transistor size at the same time—has proven to be an overwhelming challenge. That’s one of the key reasons why we’ve seen delays or even cancellations of moves to current 10nm and 7nm production from many major chip foundries.

    Second, it turns out not every type of chip element actually benefits from smaller sizes. The basic argument for shrinking transistors is to reduce costs, reduce power consumption, and improve performance. With elements like the analog circuitry in I/O components, however, it turns out there’s a point of diminishing returns where smaller transistors are actually more expensive and don’t get the performance benefits you might expect from smaller production geometries. As a result, it just doesn’t make sense to try and move current monolithic chip designs to these smaller sizes.

    Finally, some of the more interesting advancements in the semiconductor world are now occurring in interconnect and packaging technologies. From the 3D stacking of components being used to increase the capacity of flash memory chips, to the high-speed interfaces being developed to enable both high-speed on-chip and chip-to-chip communications, the need to keep all the critical components of a chip design at the same process level are simply going away. Instead, companies are focusing on creating clever new ways to interconnect IP blocks/components in order to achieve the performance enhancements they used to only be able to get through traditional Moore’s Law transistor shrinks.

    "Semiconductor companies are having to develop different ways to keep the essential performance progress they need moving in a positive direction. One of the most compelling ideas is chiplets."

    AMD, for example, has made its Infinity Fabric interconnect technology a critical part of its Zen CPU designs, and at last week’s 7nm event, the company highlighted how they’ve extended it to their new data center-focused CPUs and new GPUs now as well. The next generation Epyc server CPU, codenamed “Rome,” scheduled for release in 2019, leverages up to 8 separate Zen2-based CPU chiplets interconnected over their latest generation Infinity Fabric to provide 64 cores in a single SoC. The result, they claim, is performance in a single socket server that can beat Intel’s current best two-socket server CPU configuration.

    In addition, AMD highlighted how its new 7nm data center-focused Radeon Instinct GPU designs can now also be connected over Infinity Fabric both for GPU-to-GPU connections as well as for faster CPU-to-GPU connections (similar to Nvidia’s existing NVLink protocol), which could prove to be very important for advanced workloads like AI training, supercomputing, and more.

    Interestingly, AMD and Intel worked together on a combined CPU/GPU part earlier this year that leveraged a slightly different interconnect technology but allowed them to put an Intel CPU together with a discrete AMD Radeon GPU (for high-powered PCs like the Dell XPS15 and HP 15” Spectre X360) onto a single chip.

    "Some of the more interesting advancements in the semiconductor world are now occurring in interconnect and packaging technologies."

    Semiconductor IP creator Arm has been enabling an architecture for chiplet-like mobile SoC designs with its CCI (Cache Coherent Interconnect) technology for several years now. In fact, companies like Apple and Qualcomm use that type of technology for their A-Series and Snapdragon series chips, respectively.

    Intel, for its part, is also planning to leverage chiplet technology for future designs. Though specific details are still to come, the company has discussed not just CPU-to-CPU connections, but also being able to integrate high-speed links with other chip IP blocks, such as Nervana AI accelerators, FPGAs and more.

    In fact, the whole future of semiconductor design could be revolutionized by standardized, high-speed interconnections among various different chip components (each of which may be produced with different transistor sizes). Imagine, for example, the possibility of more specialized accelerators being developed by small innovative semiconductor companies for a variety of different applications and then integrated into final system designs that incorporate the main CPUs or GPUs from larger players, like Intel, AMD, or Nvidia.

    Unfortunately, right now, a single industry standard for chiplet interconnect doesn’t exist—in the near term we may see individual companies choose to license their specific implementations to specific partners—but there’s likely to be pressure to create that standard in the future. There are several tech standards for chip-related interconnect, including CCIX (Cache Coherent Interconnect for Accelerators), which builds on the PCIe 4.0 standard, and the system-level Gen-Z standard, but nothing that all the critical players in the semiconductor ecosystem have completely embraced. In addition, standards need to be developed as to how different chiplets can be pieced together and manufactured in a consistent way.

    Exactly how the advancements in chiplets and associated technologies relate to the ability to maintain traditional Moore’s law metrics isn’t entirely clear right now, but what is clear is that the semiconductor industry isn’t letting potential roadblocks stop it from making important new advances that will keep the tech industry evolving for some time to come.

    Bob O’Donnell is the founder and chief analyst of TECHnalysis Research, LLC a technology consulting and market research firm. You can follow him on Twitter @bobodtech. This article was originally published on Tech.pinions.

    Image credit: Alexandre Debiève via Unsplash

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    HP HP0-302 Exam (Planning and Designing HP Superdome Server Solutions) Detailed Information



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