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650-756 - Advanced IP NGN Architecture Field(R) Engineer - Dump Information

Vendor : Cisco
Exam Code : 650-756
Exam Name : Advanced IP NGN Architecture Field(R) Engineer
Questions and Answers : 60 Q & A
Updated On : December 10, 2018
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650-756 Questions and Answers

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650-756 Advanced IP NGN Architecture Field(R) Engineer

Study Guide Prepared by Killexams.com Cisco Dumps Experts


Killexams.com 650-756 Dumps and Real Questions

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650-756 exam Dumps Source : Advanced IP NGN Architecture Field(R) Engineer

Test Code : 650-756
Test Name : Advanced IP NGN Architecture Field(R) Engineer
Vendor Name : Cisco
Q&A : 60 Real Questions

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Cisco Cisco Advanced IP NGN

XO Communications accelerates development and delivery of IP next-technology community capabilities With Cisco | killexams.com Real Questions and Pass4sure dumps

source: XO Communications

February 26, 2008 08:00 ET

Collaboration Strengthens XO's IP Portfolio and business services Capabilities

HERNDON, VA--(Marketwire - February 26, 2008) - XO Communications (OTCBB: XOHO), a leading issuer of 21st century communications for companies and communications carrier providers, nowadays introduced a three-year settlement with Cisco® to accelerate the development and beginning of subsequent-generation Cisco Powered IP communications capabilities for companies and big organisations through collaboration on features and options as well as joint advertising and revenue initiatives.

the two agencies will combine leading-edge networking applied sciences from Cisco with XO's nationwide transport and IP networking capabilities to focal point on the growing to be demand for IP convergence and networking functions. moreover, the contract will aid XO Communications accelerate the building of recent features beneath the XO IPfolio and strengthens the business's go-to-market capabilities as it expands its presence within the enterprise market.

NEW Cisco Powered service Designations

XO Communications has additionally obtained the Cisco Powered carrier designation for a number of services, including MPLS IP-VPN, Metro Ethernet, protection, net internet hosting and dedicated cyber web access. These designations demonstrate to companies and big agencies that XO Communications has dedicated to investing within the resources, programs, and techniques to installation, control, and help wonderful managed IP and networking capabilities.

"XO and Cisco share a vision for the proliferation of managed services to allow company purchasers to focus on their core skills instead of their IT infrastructure," referred to Jeff Spagnola, vice president provider provider advertising at Cisco. "XO is a pacesetter out there in constructing out its service portfolio, so that they can allow its current and future purchasers to boost productiveness while reducing the capex and opex associated with inside deployment of these supplies."

expanding XO's IP capabilities Portfolio

XO Communications has already developed and brought to market a couple of converged and IP networking capabilities based on the Cisco IP next-generation network (IP NGN) structure, including XO Metro Ethernet, XO IP Flex, XO SIP, XO VPN and XO MPLS IP-VPN. collectively, XO Communications and Cisco intend to collaborate on the building of latest Cisco Powered Managed services and solutions bundles that contain new utility-mindful MPLS IP-VPN, managed security and subsequent generation Unified Communications services so as to present companies improved features and functionality for his or her mission-critical networks.

"With this agreement, XO Communications is taking a leadership place in offering new and superior IP solutions that enable corporations to converge voice and facts networks for expanded network efficiency and employee productiveness," pointed out Tom Cady, president of XO business services. "by working intently with Cisco, we're more suitable located to make the most of Cisco's technology leadership and distribution channels to deliver new IP solutions to the enterprise market right away."

next-era network and multiplied capability offers Platform for brand new IP features

XO Communications will carry these new features over its advanced, nationwide IP community. XO Communications these days announced a significant enlargement within the skill of its nationwide IP network based on the Cisco IP NGN architecture. The deployment of the Cisco CRS-1 carrier Routing device will more than double latest ability and sets the stage for a four-fold increase, whereas helping XO Communications meet the turning out to be demand for prime-velocity internet entry functions and help its growth into the excessive-skill IP transit features market.

earnings Collaboration

groups will additionally benefit from collaboration between XO and Cisco revenue forces. The managed features, some of which are available now and others which can be scheduled to be deployed in 2008 and 2009, are designed to help consumers maximize returns on latest community investments by means of enabling consolidation and improve of multi-provider IP networks. These services eventually can be made attainable through direct and indirect income channels.

About XO Communications

XO Communications, a subsidiary of XO Holdings, Inc. (OTCBB: XOHO), is a number one company of 21st century communications services for groups and communications capabilities providers, together with 50 p.c of the Fortune 500 and main cable agencies, carriers, content providers, and mobile operators. making use of its unique and powerful nationwide IP community and wide native metro networks and broadband wireless facilities, XO offers consumers a huge range of managed voice, information and IP features in 75 metropolitan markets across the united states. For extra guidance, discuss with www.xo.com.

forward-searching observation note

The statements contained in this free up that don't seem to be ancient records are "forward-looking statements" (as such term is described within the inner most Securities Litigation Reform Act of 1995) that contain risks and uncertainties. These statements include those describing the benefit from new initiatives and enhancements to XO Communications' enterprise and carrier markets, XO Communications' potential to continue boom in data and IP capabilities, its ability to expand market share via IP and private networking initiatives, and XO Communications' skill to advantage from elevated network skill and extra services from its long haul community. management cautions the reader that these ahead-searching statements are best predictions and are field to a number of each normal and unknown dangers and uncertainties, and exact outcomes, performance, and/or achievements of XO Communications may additionally differ materially from the future consequences, efficiency, and/or achievements expressed or implied by these forward-looking statements as a result of a couple of elements. These components include, with out drawback, our means to generate enough capital or to acquire financing. administration is unable to give assurance that XO Holdings, Inc. or its subsidiaries will sooner or later consummate option financing transactions or that such financing transactions could be consummated earlier than the lenders under our credit score Facility could accelerate compensation of the miraculous indebtedness. different factors to trust also consist of the risk factors described from time to time within the studies filed by means of XO Holdings, Inc. with the Securities and exchange fee, together with its Annual file on kind 10-okay for the year ended December 31, 2006 and its quarterly studies on form 10-Q. XO Holdings, Inc. undertakes no duty to update any ahead-searching statements.


Suraj Shetty | killexams.com Real Questions and Pass4sure dumps

Vice PresidentWorldwide service company advertising and marketing

Suraj Shetty is the vice chairman of advertising for the Cisco international provider company marketing firm and leads a number of groups liable for driving provider company success in building and deployment of advanced services in accordance with Cisco products and solutions. His most important areas of focal point include enabling provider providers to seriously change into experience providers in the course of the Cisco IP subsequent era network (IP NGN) architecture and deliver rich related life experiences. Shetty is additionally concentrated on the acceleration of superior IP applied sciences in the course of the overseas Telecommunication Union (ITU), the web Engineering project drive (IETF), and other business requisites our bodies.

Shetty is a typical speaker at trade hobbies and symposia and is a essential Cisco spokesperson to press as well as both business and monetary analysts.

Shetty has held many product administration and advertising roles in his eleven years at Cisco, including two-tier distribution channel advertising and marketing, product advertising for DSL-related items and options, and the Cisco Broadband Aggregation solution portfolio. earlier than his current place, Shetty served as director of advertising and marketing in the Cisco provider provider Routing technology neighborhood with responsibility for service company core and facet routing products.

previous to joining Cisco, Shetty became a Senior Engineering consultant at Eicon technology, focused on systems community structure (SNA) gateway and routing options. Shetty holds a M.S. diploma in electrical engineering from the university of Texas at San Antonio, and a bachelor of engineering diploma in electronics and communications from Karnatak university in India. He lives in San Jose with his spouse and two children.

Cisco launches service provider expertise specializations | killexams.com Real Questions and Pass4sure dumps

retaining its be aware to expand its internet of issues (IoT) specializations, Cisco today introduced a set of carrier provider expertise specializations for partners attracted to expanding into new company opportunities.

the brand new service issuer specializations are designed to position Cisco companions to monetize on the becoming IoT market, projected to be price $19 trillion in 10 years, in line with Steve Benvenuto, senior director of company construction for Cisco’s international accomplice firm, on the launch of the dealer’s first IoT specializations in November.

the brand new four provider issuer technology specializations are advanced service company Routing expertise Specialization, advanced carrier provider Mobility technology Specialization, superior carrier provider Optical know-how Specialization and superior service company architecture Specialization.

The superior provider provider Routing know-how Specialization focuses on router options, mainly talents in carrier company core, aspect and entry routing applied sciences; optimization options; and application-defined networking (SDN).

The superior carrier issuer Mobility technology Specialization training will enable partners to promote new generations of mobile, small-phone and repair issuer Wi-Fi.

the brand new superior carrier company Optical know-how Specialization makes a speciality of optical options and how to present packet switching, optical transport network (OTN), and Cisco Dense Wave Division Multiplexing (DWDN) and IP over optical convergence products. The specialization also teaches partners a way to work with Cisco community Convergence gadget (NCS) 2000 and 4000 collection routers.

With the superior provider company structure Specialization, partners will find out about carrier issuer routing technologies along with either provider issuer mobility or service company optical technologies.

in line with Cisco, the new suite of provider provider know-how specializations represents the business’s subsequent generation of the superior IP subsequent-era community (IP NGN) structure Specialization and the cellular cyber web expertise (MIT) approved technology provider (ATP) designation, which should be retired starting in March 2015.

the new provider company know-how specializations are presently attainable with further software updates anticipated in 2015.


650-756 Advanced IP NGN Architecture Field(R) Engineer

Study Guide Prepared by Killexams.com Cisco Dumps Experts


Killexams.com 650-756 Dumps and Real Questions

100% Real Questions - Exam Pass Guarantee with High Marks - Just Memorize the Answers



650-756 exam Dumps Source : Advanced IP NGN Architecture Field(R) Engineer

Test Code : 650-756
Test Name : Advanced IP NGN Architecture Field(R) Engineer
Vendor Name : Cisco
Q&A : 60 Real Questions

can i discover dumps Q & A cutting-edge 650-756 examination?
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[OPTIONAL-CONTENTS-3]

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FABU America, Developer of SoCs for Autonomous Driving, Selects Agnisys IDesignSpec to Create an Executable Design Specification | killexams.com real questions and Pass4sure dumps

Agnisys today announced that FABU America, Inc. has chosen its IDesignSpec™ software for creating executable design specification. FABU America develops intelligent System-on-Chips (SoCs) for autonomous driving. With proprietary deep learning algorithms and custom acceleration architecture, FABU America aims to revolutionize in-vehicle information processing with an enormous improvement in energy efficiency and performance.

FABU America uses IDesignSpec for designing the register specification from a single specification in MS Word format. IDesignSpec automatically generates the register RTL, UVM models, C Headers, and HTML/PDF documentation needed for the SoC project.

Bahaa Osman, FABU America’s Verification Team Leader, adds, “Our experience with IDesignSpec has been extremely positive. We were looking for a tool that could describe our registers in a user-friendly input format. This input acts as our golden reference to all our downstream consumers to include design, validation, verification, software, and modeling. IDesignSpec indeed satisfies all those requirements.”

“The combination of autonomous driving and deep learning is truly an exciting innovation, however it presents numerous design and verification challenges associated with the SoC Hardware/Software Interface (HSI) layer,” said Anupam Bakshi, Agnisys CEO/Founder. “We are happy to see that IDesignSpec has been chosen by FABU America and it is able to help solve these challenges. We look forward to further enhancing IDesignSpec to meet greater Automotive and AI challenges.”

About IDesignSpec

IDesignSpec is an award-winning product that helps IP/SoC Design architects and engineers to create executable specification for registers and automatically generate output for SW/HW teams. The specifications can be written in Microsoft® Word™ or Excel™, LibreOffice™ with IDesignSpec editor Plugin or text-based industry standard formats like SystemRDL, RALF, IP-XACT. IDesignSpec captures simple as well as special registers, signals, interrupts, and then generates synthesizable RTL code and interfaces to ARM AMBA® buses like AXI, AHB, APB, AHB3Lite and other standard and proprietary buses.

About FABU America

FABU was established in August, 2017. Supported by top international VC firms, FABU is an AI company devoted to proprietary technology of Advanced Driver Assistance System (ADAS) and Autonomous Driving (AD). The leadership team includes multiple world-renowned experts who graduated from UC Berkeley, University of Chicago, University of Wisconsin, Madison, UIUC, Georgia Tech, Zhejiang University, and Tsinghua University. Before joining FABU, the leadership team’s career development involved companies such as Intel, Qualcomm, Microchip, Yahoo, LinkedIn and Shanghai Motors. With more than 20-year experience in the AI field, the FABU America team is specialized in machine learning, computer vision, robotics, automobile engineering and the very large-scale integrated circuit design. FABU America’s groundbreaking AI technology offers a full-stack software and hardware platform in the vehicle, enabling autonomous driving from perception to fusion, to decision and control.

About Agnisys

Agnisys Inc. is a leading supplier of Electronic Design Automation (EDA) software for solving complex design and verification problems for system development. Its products provide a common specification-driven development flow to describe registers and sequences for system-on-chip (SoC) and intellectual property (IP) enabling faster design, verification, firmware, and validation. Based on patented technology and intuitive user interfaces, its products increase productivity and efficiency while eliminating system design and verification errors. Founded in 2007, Agnisys is based in Boston, Massachusetts with R&D centers in the United States and India. www.agnisys.com

IDesignSpec™ is a trademark of Agnisys, Inc. All other trademarks cited herein are the property of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20181031005240/en/

SOURCE: Agnisys Inc."> <Property FormalName="PrimaryTwitterHandle" Value="@agnisys

Media:Louie de Luna, +1 855-VERIFYYAgnisys Director of Sales and Marketingmarcom@agnisys.com

Copyright Business Wire 2018


Advanced Micro Devices (AMD) Q2 2017 Results - Earnings Call Transcript | killexams.com real questions and Pass4sure dumps

No result found, try new keyword!Advanced Micro ... customer support, field application engineering, software support, given that we're familiarizing people with our architecture. So I think it's good. We're happy that the business a...

The Semiconductor Industry Is in Transition | killexams.com real questions and Pass4sure dumps

Companies are beginning to acknowledge the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge. More specifically, with eroding ASPs (average selling prices) and increasingly prohibitive design costs at ever lower nodes, many companies are searching for fresh revenue streams across a wide range of verticals comprising the Internet of Things (IoT).

However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is currently perceived as both a major opportunity and a considerable challenge for the semiconductor industry.

In addition to services, the concept of open-source hardware (OSH) and building silicon from disaggregated, pre-verified chiplets is beginning to gain serious traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

Specific strategies to unlocking the full potential of silicon and services will undoubtedly vary, which is why it’s important for us to explore a future in which semiconductor companies, along with various industries, organizations, and government offices, play an open and collaborative role in helping to sustainably monetize both silicon and services.

Acquisitions and industry consolidation continued apace in 2016 and 2017:

  • Analog Devices acquired Linear Technology
  • Infineon acquired International Rectifier
  • ROHM acquired Powervation
  • Renesas acquired Intersil
  • Major semiconductor players positioned themselves to better compete across multiple verticals, including cloud-based computing, artificial intelligence (AI), and self-driving vehicles. According to KPMG, many companies increasingly see Mergers & Acquisitions (M&A) as the only way to drive real revenue growth, giving a new emphasis to the “make vs. buy” question, with many selecting the “buy” answer.

    Concurrently, chip development costs continued to rise and saliently affect the number of designs at advanced nodes. More specifically, the total number of Advanced Performance Multicore first-time SoC design starts has been roughly flat to only slightly up over the past five years. Although design price tags have been steadily increasing since 40 nm, analysts are most concerned with the acceleration of design costs at 7 nm and 5 nm.

    As Rich Wawrzyniak, a senior analyst at Semico Research confirms, design starts beyond 10 nm will be constrained by rising development costs. While the total number of designs that migrate to new nodes may not be appreciably different than previous process geometry upgrades, Wawrzyniak says the time frame for such transitions by the majority of companies will be more protracted.

    New models for both R&D and revenue are clearly needed, as heightened industry consolidation and eroding ASPs are unsustainable in the long term. This is precisely why the industry is looking toward the Internet of Things to create additional revenue streams, with McKinsey Global Institute (MGI) analysts estimating the IoT could have an annual economic impact of $3.9 to $11.1 trillion by 2025 across multiple verticals. However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is considered to be both a major opportunity and challenge for semiconductor companies.

    As such, MGI recommends creating security solutions that allow for semiconductor companies to expand into adjacent business areas and develop new business models. For example, companies could help create end-to-end security offerings, which are essential to the IoT’s success. Ideally, says MGI, the industry should play a leading role when developing such offerings, to ensure they obtain their fair share of the value chain.

    From our perspective, end-to-end IoT security solutions deployed as a platform as a service (PaaS) are critical in helping semiconductor companies generate renewable, downstream revenue for specific services. For customers, PaaS offers an easy way for customers to securely develop, run, and manage applications and devices without the complexity of building and maintaining elaborate infrastructure.

    Such security solutions, which could also leverage a hardware-based root-of-trust, should support device identification and mutual authentication (verification), routine attestation checks, secure over-the-air (OTA) device updates, disaster recovery and key management, as well as the decommissioning and reassignment of keys to better manage devices and mitigate various attacks, including distributed denial of service (DDoS).

    Smart Cities

    Inaccessible silicon—such as chips embedded in IoT smart-city infrastructure—could offer semiconductor companies the opportunity to implement a long-term PaaS “silicon to services” model. Indeed, future smart-city infrastructure will almost certainly be designed with chips in difficult-to-reach locations, including subterranean water pipes, air-conditioning ducts, and under streets and parking lots.

    Intelligent street lighting, responsive signage, and next-gen Bluetooth beacons also require future-proofing to avoid constant physical maintenance and upgrades. Therefore, silicon powering smart-city infrastructure should be capable of supporting secure in-field feature configuration, along with various PaaS-based services like advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers.

    Smart Homes

    The global smart-home market is projected to reach at least $40 billion in value by 2020. According to Markets and Markets, the growth of the smart-home space can be attributed to multiple factors, including significant advances in the IoT sector; increasing requirements for consumer convenience, safety, and security; a more pronounced need for energy-saving, and low-carbon-emission-oriented solutions. However, as we previously discussed, it’s critical to ensure that IoT security is implemented at the product design stage to prevent malicious actors from exploiting smart-home devices and causing service interruptions.

    In addition to potentially lucrative cybersecurity opportunities for semiconductor companies, smart-home devices offer the promise of creating recurring revenue streams to support a sustainable “silicon to services” model. As an example, MarketingInsider's Christoper Dean highlights Amazon’s popular Echo devices. With at least 15 million Echoes already sold, Echo users are likely to double as active Amazon consumers, leveraging the device to monitor wishlists and discover items they’re subsequently prompted to purchase. Meanwhile, Nest is using thermostat data as a platform to offer energy-management services to utility companies across the United States, with companies paying for meaningful and actionable customer information on a subscription basis.

    Automotive

    According to IC Insights, chip sales for automotive systems and the IoT will grow 70% faster than total IC revenues between 2016 and 2021. Specifically, IC sales for automobiles and other vehicles are forecast to jump from $22.9 billion in 2016 to $42.9 billion in 2021, while revenues for IoT functionality will increase from $18.4 billion in 2016 to $34.2 billion in 2021.

    The projected increase in automotive chip sales is hardly surprising, as modern vehicles are essentially a network of networks equipped with a range of embedded communication methods and capabilities. However, this means vehicles are now more vulnerable to cyberattacks than ever before.

    Potential security vulnerabilities include unprotected vehicle-to-vehicle communication, the unauthorized collection of driver or passenger information, seizing control of critical systems such as brakes or accelerators, intercepting vehicle data, tampering with third-party dongles, and altering over-the-air (OTA) firmware updates. In terms of the latter, automotive manufacturers are now focusing on providing secure OTA updates for various systems, with the global automotive OTA update market projected to grow at a CAGR of 18.2% from 2017 to 2022 and reach $3.89 billion by 2022.

    Automotive manufacturers are also working to ensure that the vehicle supply chain is kept free of stolen and counterfeit components. Nevertheless, a wide range of gray-market devices can still be found powering high-value modules such as in-vehicle infotainment systems and headlights, as well as in critical safety systems including airbag modules, braking modules, and powertrain controls. Shielding vehicle peripherals and components against tampering by implementing a range of layered hardware and software security solutions have therefore become a priority for a number of automotive manufacturers.

    In addition to implementing layered security solutions, the semiconductor industry would clearly benefit from adopting an IoT "as-a-service" approach to the automotive sector. As an example, companies could deploy sensor-based vehicle systems that proactively detect potential issues and malfunctions. This solution, which, in its most optimal configuration, would combine silicon and services, could be sold as a hardware and software product, or deployed as a service with subscription fees generated on a monthly or annual basis.

    Medical and Healthcare

    Long-life implanted medical devices will undoubtedly require a high degree of future-proofing from the semiconductor industry to avoid frequent physical upgrades and maintenance. Srihari Yamanoor, an R&D design specialist at Stellartech Research Corp., notes that medical devices will ultimately be customized to meet the needs of individual patients, thereby increasing the application of precision medicine.

    Moreover, the health insurance industry is expected to leverage machine learning to optimize and reduce the cost of care, while digital health devices will also be used by the insurance industry to identify at-risk patients and provide assistance. Medical devices, especially implantable models, should therefore be designed to support a “silicon to services model” via in-field feature configuration and secure OTA updates, as well as PaaS-based services, including the collection and analysis of relevant data; proactive maintenance, advanced algorithms; and an intuitive UI for both patients and doctors.

    Open-Source Hardware and Disaggregated Chiplets

    Alongside services, open-source hardware offered by organizations and companies such as RISC-V and SiFive have begun to positively disrupt the semiconductor industry by encouraging innovation, reducing development costs and accelerating time-to-market.

    The success of open-source software—as opposed to a closed, walled-garden approach—continues to set an important precedent for the semiconductor industry. Faced with prohibitively expensive development costs, a number of companies are opting to avoid unnecessary toll collectors while placing more of an emphasis on open-source architecture as they work to create new service-centric revenue streams.

    In addition to open-source hardware, the concept of building silicon from pre-verified chiplets is beginning to gain traction as the semiconductor industry moves to slash costs and reduce time-to-market for heterogeneous designs. According to Semiconductor Engineering's Ann Steffora Mutschler, the chiplet concept has been on the drawing board for some time, although it was historically perceived as a potential future direction rather than a tangible solution in the shadow of waning Moore’s Law. This perception is beginning to shift as design complexity increases, particularly at advanced nodes (10/7 nm), and as new markets that require semi-customized solutions coalesce.

    The concept of pre-verified chiplets has piqued the interest of the U.S. Defense Advanced Research Projects Agency (DARPA), which recently rolled out its Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. In collaboration with the semiconductor industry, the successful implementation of CHIPS would see a range of IP blocks, subsystems, and chips combined on an interposer in a 2.5D-like package.

    The CHIPS initiative took center stage in August 2017, when participants from the military, commercial, and academic sectors gathered at DARPA headquarters at the official kickoff meeting for the Agency’s Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.

    As DARPA's Dr. Daniel Green detailed during the conference, the program seeks to develop a new technological framework in which different functionalities and blocks of intellectual property—among them, data storage, computation, signal processing, and managing the form and flow of data—can be segregated into small chiplets. They then can be mixed, matched, and combined onto an interposer, somewhat like joining the pieces of a jigsaw puzzle. In fact, says Green, an entire conventional circuit board with a variety of different but full-sized chips could ultimately be shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.

    According to DARPA, specific technologies that could emerge from the CHIPS initiative include compact replacements for entire circuit boards, ultra-wideband radio frequency (RF) systems, and fast-learning systems for extracting interesting and actionable information from much larger volumes of mundane data.

    Perhaps not surprisingly, the semiconductor industry is already eyeing a disaggregated approach in the form of SerDes chiplets and specialized low-power, application-specific die-to-die interfaces. To be sure, viable silicon disaggregation can be achieved by moving high-speed interfaces like SerDes to separate die in the form of SerDes chiplets, shifting analog sensor IP to separate analog chips and implementing very low-power and low-latency die-to-die interfaces through MCM or through an interposer using 2.5D technology.

    Beyond leveraging known-good die for SerDes in more mature nodes (N-1) or vice versa, disaggregation is expected to facilitate the creation of multiple SKUs, while optimizing cost and reducing risk. More precisely, disaggregation will see SoCs broken out into higher-yielding, smaller dies and allow companies to create specific designs with multiple variants. Indeed, die-to-die interfaces can more easily accommodate diverse applications across memory, logic and analog technology. In addition, die-to-die interfaces don’t require a matching line/baud rate and number of lanes, while FEC may or may not be required depending on latency requirements.

    It should be noted that multiple companies are actively pursuing SoC/ASIC aggregation for switches and other systems. Similarly, the semiconductor industry is developing ASICs with die-to-die interfaces on leading FinFET nodes, while at least one next-generation server chip is being designed with disaggregated I/Os on a separate die.

    Conclusion

    Over the past five years, the semiconductor industry has faced numerous complex challenges. These include increased development costs, eroded ASPs, market saturation, and heightened, yet unsustainable M&A activity. Through 2018, the semiconductor industry continues to seek a return to stability and organic growth within the parameters of a new business paradigm that’s both viable and collaborative. Within this context, semiconductor companies are acknowledging the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge.

    This includes end-to-end IoT security solutions and PaaS-based services such as in-field feature configuration, advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers. In addition to services, the concept of open-source hardware and building silicon from disaggregated, pre-verified chiplets is beginning to gain traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the full potential of semiconductors will undoubtedly vary, which is why it’s important for us to explore a future in which the industry, along with various research organizations and government offices, plays an open and collaborative role in helping to sustainably monetize both silicon and services.

    For more information on this topic, check out Rambus’ site.

    Shrikant Lohokare, Ph.D., is Vice President and Executive Director, North America for the Global Semiconductor Alliance.



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    Cisco 650-756 Exam (Advanced IP NGN Architecture Field(R) Engineer) Detailed Information



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