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650-367 - Advanced Collaboration Architecture Sales Specialist - Dump Information

Vendor : Cisco
Exam Code : 650-367
Exam Name : Advanced Collaboration Architecture Sales Specialist
Questions and Answers : 56 Q & A
Updated On : December 14, 2018
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650-367 Questions and Answers

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650-367 Advanced Collaboration Architecture Sales Specialist

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Killexams.com 650-367 Dumps and Real Questions

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650-367 exam Dumps Source : Advanced Collaboration Architecture Sales Specialist

Test Code : 650-367
Test Name : Advanced Collaboration Architecture Sales Specialist
Vendor Name : Cisco
Q&A : 56 Real Questions

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Cisco Cisco Advanced Collaboration Architecture

LaSalle options once again Achieves superior Collaboration structure Specialization From Cisco within the u.s. | killexams.com Real Questions and Pass4sure dumps

ROSEMONT, IL--(Marketwired - March 03, 2015) - To help the expanding role of collaboration solutions that leverage the intelligence of the community, LaSalle solutions introduced nowadays that it has carried out the advanced Collaboration architecture Specialization from Cisco. This specialization recognizes LaSalle solutions as having fulfilled the practising necessities to promote, design and deploy comprehensive Cisco® Collaboration architecture solutions.

As a Cisco advanced Collaboration architecture really good companion, LaSalle options has invested in the working towards required to convey differentiated company value in the course of the integrated, open groundwork of the collaboration architecture. Cisco superior Collaboration architecture really expert partners work with new and latest applied sciences to align components of this architecture with their valued clientele' strategic desires, assisting seriously change business processes, enhance organizational efficiency and accelerate the time to market.

"we're proud to again obtain the Cisco advanced Collaboration architecture Specialization," says Steven Robb, President of the solutions community at LaSalle options. "This carrying on with education and partnership is a mutual ongoing commitment, as Cisco requires annual renewal for this and many different specializations. we are proud to continue our commitment, and feel this cognizance displays our dedication to featuring the team, methods and tools to bring the advanced options our valued clientele have come to rely on, and permit us to exceed expectations to fulfill ultra-modern company challenges and build their competitive side."

The Cisco Resale Channel software gives companions with the practising required to construct income, design and technical talent and then validates their capabilities via a 3rd-birthday party audit.

This recertification builds on a couple of Cisco-linked milestones LaSalle solutions has prior to now executed, together with:

  • Cisco US services partner of the yr: current
  • consumer delight Excellence Gold megastar: current, 40 Consecutive Quarters. 
  • Cisco® Gold licensed accomplice
  • Cisco grasp Unified Communications Specialization
  • Cisco grasp protection Specialization
  • international companion community accomplice
  • advanced facts core structure Specialization
  • advanced borderless community architecture Specialization 
  • ATP - Cisco TelePresence Video superior
  • ATP - records Virtualization Reseller
  • ATP - power administration Suite Integrator
  • ATP - id features Engine
  • Cisco services partner of the year, critical region: 2010 - 2013
  • About LaSalle solutions

    established in 1980, LaSalle solutions is a number one company of life-cycle administration capabilities for know-how and capital property. These capabilities include acquisition and financing, IT asset management, maintenance contract management, remarketing and disposition. LaSalle solutions' processes, amazing client service and strong, market-main cloud-primarily based toolset, LAMP, allow customers to greater economically and without problems control and plan to meet their goals.

    LaSalle options is an independently operated business and a subsidiary of MB monetary bank, a publicly traded Chicago-based mostly bank keeping business. MB monetary is traded on the NASDAQ as "MBFI".

    For more tips on LaSalle solutions, please visit www.elasalle.com and www.YouTube.com/LaSalleSolutions.

    LaSalle solutions and LAMP are registered logos of LaSalle solutions within the u.s.. Cisco and the Cisco brand are logos or registered emblems of Cisco and/or its affiliates in the U.S. and different nations.


    LaSalle options Renews Cisco advanced Collaboration architecture Specialization | killexams.com Real Questions and Pass4sure dumps

    ROSEMONT, sick., March 06, 2018 (GLOBE NEWSWIRE) -- LaSalle solutions, a number one issuer of expertise lifecycle administration features, announced these days that it has renewed its Cisco advanced Collaboration architecture Specialization. The specialization recognizes that LaSalle has once again fulfilled the training necessities and application prerequisites to sell, design and deploy finished Cisco Collaboration solutions.

    As a Cisco advanced Collaboration Specialization accomplice, LaSalle options has validated its capability to supply refined, value-added Cisco solutions through in-depth earnings capabilities, know-how advantage and repair choices. Cisco advanced Specialization partners work with new and present applied sciences to align accessories of these architectures with their purchasers’ strategic desires, assisting transform enterprise methods, increase organizational efficiency and speed up the time to market.

    “we're proud to once more achieve advanced Collaboration structure Specialization from Cisco,” noted Steven Robb, president of the options group at LaSalle options. “Our clients seem to us for assist enhancing collaboration across their groups. This specialization is as a result of the hard work LaSalle options puts in every year to make sure that we now have the most useful applied sciences and expertise to increase customer collaboration techniques to more sustainable, unified solutions.”

    About LaSalle options

    founded in 1980, LaSalle solutions is a leading company of know-how lifecycle asset management services. LaSalle allows for its consumers to enhance their technology operations through more advantageous techniques, management and reporting for more advantageous planning and return on investment. LaSalle solutions’ tactics, staggering consumer provider and powerful, market-main cloud-primarily based toolset, LAMP, permit valued clientele to achieve stronger enterprise outcomes through transparency and respectable effects at their fingertips.

    LaSalle options is a division of MB equipment Finance LLC, a subsidiary of MB monetary financial institution, N.A., a business bank headquartered in Chicago. MB financial Inc. is the publicly traded protecting business for MB economic financial institution, N.A. and is traded on the NASDAQ as “MBFI.”

    For greater tips on LaSalle options, please visit www.elasalle.com and www.YouTube.com/LaSalleSolutions.

    LaSalle solutions and LAMP are registered logos of LaSalle options within the united states.


    Cisco and AWS Collaborate to speed up Innovation | killexams.com Real Questions and Pass4sure dumps

    In an increasingly competitive atmosphere, organizations are under severe pressure to do greater and to do it faster, with much less. That’s why the skill to hastily deliver new experiences to valued clientele and employees via functions is a crucial differentiator in a growing number of industries. purposes are truly becoming the lifeblood of business.

    Public clouds provide developers with structures for all of a sudden developing and deploying purposes, yet most organisations have their personal facts facilities that condominium vital workloads. That’s why hybrid cloud is a requirement for many organizations.

    Containers and Kubernetes have emerged as key technologies to supply builders greater agility, portability, and velocity — each in how applications are developed and in how they are deployed. however, agencies were struggling to realize the full skills of those applied sciences because of the complexity of managing containerized purposes in a hybrid environment. companies should work throughout siloed environments, applied sciences, groups, and providers to attach all of the constituents of a hybrid infrastructure together themselves. appropriately configuring Kubernetes to deploy purposes on-premises and within the public cloud requires customized integrations that will also be an operational challenge.

    That’s why Cisco is introducing a brand new solution developed for Amazon net features (AWS) that makes working new containerized functions simple. The Cisco Hybrid answer for Kubernetes on AWS makes it possible for valued clientele to safely  install, join, and display screen containerized applications in Kubernetes clusters perpetually throughout deepest statistics facilities and the AWS cloud. consumers can now get the most excellent out each their cloud and on-premises environments with a single solution and business-classification aid. The solution could be purchasable in December 2018.

    Cisco has been working to support valued clientele manipulate this variety of complexity for a while. in the last year, we launched the Cisco Container Platform (CCP) and enabled Kubernetes aid for different leading Cisco solutions including CloudCenter and AppDynamics. Now our collaboration with AWS brings together networking, security, management, monitoring, and identification into a consistent and relaxed environment throughout on-premises records facilities and the AWS cloud.

    the center-piece of the brand new answer is the capacity to deliver AWS id and access administration (IAM) during the integration of the Cisco Container Platform with Amazon Elastic Container provider for Kubernetes (EKS). The interesting connection between Cisco Container Platform and AWS’s id and entry administration permits users to create and manage container clusters with typical identification, authorization and entry control guidelines across their on-premises and public cloud environments.

    Cisco CloudCenter, CSR 1000v, Stealthwatch Cloud, and AppDynamics give administration, networking, protection, and monitoring, whereas Cisco HyperFlex or Cisco UCS, Cisco ACI, and the Cisco Container Platform provide built-in hardware on-premises. you could be trained extra in regards to the technical particulars behind this essential integration during this blog post via Reinhardt Quelle, most important Engineer and Cloud Architect right here at Cisco and Muffadal Qwettawal, AWS accomplice options Architect at AWS.

    Cisco Hybrid Solution for Kubernetes on AWS

    This answer makes it possible for builders to deliver new functions faster. builders now have the flexibleness to increase in the cloud and install both in the AWS cloud or on-premises. the new answer also offers a creation-grade environment for functions with business-class guide that meets the wants of IT. And it provides visibility and control across the hybrid environment with out slowing innovation.

    I’m excited about Cisco’s collaboration with AWS. collectively, we are helping consumers speed up the utility deployment cycle, making it handy to innovate sooner. The aggregate of Cisco’s networking, security, administration and monitoring software with AWS’ world-type cloud features permits consumers to focus on building and the use of functions, instead of being restrained with the aid of the place they run.

    look for extra from us in December when this answer becomes accessible.

    greater assistance:


    650-367 Advanced Collaboration Architecture Sales Specialist

    Study Guide Prepared by Killexams.com Cisco Dumps Experts


    Killexams.com 650-367 Dumps and Real Questions

    100% Real Questions - Exam Pass Guarantee with High Marks - Just Memorize the Answers



    650-367 exam Dumps Source : Advanced Collaboration Architecture Sales Specialist

    Test Code : 650-367
    Test Name : Advanced Collaboration Architecture Sales Specialist
    Vendor Name : Cisco
    Q&A : 56 Real Questions

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    Talend to Acquire Stitch, a Leader in Self-Service Cloud Data Integration | killexams.com real questions and Pass4sure dumps

    Media releases are provided as is and have not been edited or checked for accuracy. Any queries should be directed to the company issuing the release.

    Adds New Offering for New Cloud Data Warehouse Users and a Frictionless Sales Channel

    REDWOOD CITY, Calif. – November 7, 2018 – In a move designed to accelerate its cloud momentum, Talend (Nasdaq: TLND) today announced it has entered into a definitive agreement to acquire Stitch, a leader in the fast-growing, self-service data integration market. Stitch offers an easy-to-use service for moving data from popular sources to leading cloud data warehouse platforms. The acquisition gives Talend both a strong solution for the cloud data warehouse market and a frictionless sales motion to land new cloud customers efficiently.

    “Stitch is a great addition that gives us a compelling offering in the market for simple, self-service integration for cloud data warehouses,” said Mike Tuchen, CEO, Talend. “In addition, we believe Stitch will work as an efficient high-volume way to acquire new cloud customers to whom we can market our advanced cloud solutions for data integration, transformation, cleaning, preparing and cataloging.”

    As companies standardise on using the cloud for analytics, users increasingly need to load cloud data warehouses and data lakes quickly. Most departments and small businesses lack the bandwidth and sometimes the skill set to use existing solutions, causing delays that lead to missed opportunities and poor customer experiences. Stitch, which will be rebranded as Stitch Data Loader, overcomes this set of challenges by enabling a broader population of users, including data scientists, data and business analysts, and engineers, to load data without relying on data integration specialists.

    “Talend is an ideal fit for Stitch. Their products complement ours, and they share a similar culture and market vision,” said Jake Stein, co-founder and CEO, Stitch. “The move to the cloud and data-driven business is changing the integration market, bringing new users with different needs. With the combination of Talend and Stitch, we will become the only vendor that can we believe serves all levels of the market and all users of cloud analytics.”

    According to the Gartner Group, the increase in new roles such as data scientist, data engineer, data steward, and others that need access to data is expanding dramatically. In fact, Gartner Group predicts that “By 2020, the number of data and analytics experts in business units will grow at three times the rate of experts in IT departments, which will force companies to rethink their organisational models and skill sets.”

    In addition to enhancing Talend’s product portfolio, the acquisition is expected to help strengthen Talend’s value proposition for cloud ecosystem partners including data warehouse partners such as AWS, Azure, Google, and Snowflake.

    “Snowflake is pleased that two of our partners are joining forces,” Snowflake CEO, Bob Muglia said. “The combination of Talend and Stitch will provide Snowflake customers with some of the broadest data integration capabilities and help them move their workloads to Snowflake with confidence.”

    Upon closing, Jake Stein will become SVP of the Stitch business unit reporting directly to Talend, CEO, Mike Tuchen. To learn more about Stitch or try the service for free, visit Stitch: www.stitchdata.com data.com

    Under the terms of the agreement, Talend will acquire Stitch for approximately $60 million in cash, subject to certain transaction adjustments. The transaction is expected to close later in the fourth quarter subject to customary closing conditions.

    Like this story? Tweet this: .@Talend to strengthen cloud position with planned acquisition of @Stitch_Data a frictionless #Self-Service #CloudIntegration service https://bit.ly/1PAUaie

    About Talend

    Talend (Nasdaq: TLND), a leader in cloud data integration solutions, liberates data from legacy infrastructure and puts more of the right data to work for your business, faster. Talend Cloud delivers a single platform for data integration across public, private, and hybrid cloud, as well as on-premises environments, and enables greater collaboration between IT and business teams. Combined with an open, native, and extensible architecture for rapidly embracing market innovations, Talend allows you to cost-effectively meet the demands of ever-increasing data volumes, users, and use cases.

    Over 2000 global enterprise customers have chosen Talend to put their data to work including GE, HP Inc., and Domino’s. Talend has been recognised as a leader in its field by leading analyst firms and industry publications including Forbes, InfoWorld, and SD Times. For more information, please visit www.talend.com and follow us on Twitter: @Talend.


    The Semiconductor Industry Is in Transition | killexams.com real questions and Pass4sure dumps

    Companies are beginning to acknowledge the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge. More specifically, with eroding ASPs (average selling prices) and increasingly prohibitive design costs at ever lower nodes, many companies are searching for fresh revenue streams across a wide range of verticals comprising the Internet of Things (IoT).

    However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is currently perceived as both a major opportunity and a considerable challenge for the semiconductor industry.

    In addition to services, the concept of open-source hardware (OSH) and building silicon from disaggregated, pre-verified chiplets is beginning to gain serious traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the full potential of silicon and services will undoubtedly vary, which is why it’s important for us to explore a future in which semiconductor companies, along with various industries, organizations, and government offices, play an open and collaborative role in helping to sustainably monetize both silicon and services.

    Acquisitions and industry consolidation continued apace in 2016 and 2017:

  • Analog Devices acquired Linear Technology
  • Infineon acquired International Rectifier
  • ROHM acquired Powervation
  • Renesas acquired Intersil
  • Major semiconductor players positioned themselves to better compete across multiple verticals, including cloud-based computing, artificial intelligence (AI), and self-driving vehicles. According to KPMG, many companies increasingly see Mergers & Acquisitions (M&A) as the only way to drive real revenue growth, giving a new emphasis to the “make vs. buy” question, with many selecting the “buy” answer.

    Concurrently, chip development costs continued to rise and saliently affect the number of designs at advanced nodes. More specifically, the total number of Advanced Performance Multicore first-time SoC design starts has been roughly flat to only slightly up over the past five years. Although design price tags have been steadily increasing since 40 nm, analysts are most concerned with the acceleration of design costs at 7 nm and 5 nm.

    As Rich Wawrzyniak, a senior analyst at Semico Research confirms, design starts beyond 10 nm will be constrained by rising development costs. While the total number of designs that migrate to new nodes may not be appreciably different than previous process geometry upgrades, Wawrzyniak says the time frame for such transitions by the majority of companies will be more protracted.

    New models for both R&D and revenue are clearly needed, as heightened industry consolidation and eroding ASPs are unsustainable in the long term. This is precisely why the industry is looking toward the Internet of Things to create additional revenue streams, with McKinsey Global Institute (MGI) analysts estimating the IoT could have an annual economic impact of $3.9 to $11.1 trillion by 2025 across multiple verticals. However, with the IoT install base expected to increase by about 15% to 20% annually through 2020, security is considered to be both a major opportunity and challenge for semiconductor companies.

    As such, MGI recommends creating security solutions that allow for semiconductor companies to expand into adjacent business areas and develop new business models. For example, companies could help create end-to-end security offerings, which are essential to the IoT’s success. Ideally, says MGI, the industry should play a leading role when developing such offerings, to ensure they obtain their fair share of the value chain.

    From our perspective, end-to-end IoT security solutions deployed as a platform as a service (PaaS) are critical in helping semiconductor companies generate renewable, downstream revenue for specific services. For customers, PaaS offers an easy way for customers to securely develop, run, and manage applications and devices without the complexity of building and maintaining elaborate infrastructure.

    Such security solutions, which could also leverage a hardware-based root-of-trust, should support device identification and mutual authentication (verification), routine attestation checks, secure over-the-air (OTA) device updates, disaster recovery and key management, as well as the decommissioning and reassignment of keys to better manage devices and mitigate various attacks, including distributed denial of service (DDoS).

    Smart Cities

    Inaccessible silicon—such as chips embedded in IoT smart-city infrastructure—could offer semiconductor companies the opportunity to implement a long-term PaaS “silicon to services” model. Indeed, future smart-city infrastructure will almost certainly be designed with chips in difficult-to-reach locations, including subterranean water pipes, air-conditioning ducts, and under streets and parking lots.

    Intelligent street lighting, responsive signage, and next-gen Bluetooth beacons also require future-proofing to avoid constant physical maintenance and upgrades. Therefore, silicon powering smart-city infrastructure should be capable of supporting secure in-field feature configuration, along with various PaaS-based services like advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers.

    Smart Homes

    The global smart-home market is projected to reach at least $40 billion in value by 2020. According to Markets and Markets, the growth of the smart-home space can be attributed to multiple factors, including significant advances in the IoT sector; increasing requirements for consumer convenience, safety, and security; a more pronounced need for energy-saving, and low-carbon-emission-oriented solutions. However, as we previously discussed, it’s critical to ensure that IoT security is implemented at the product design stage to prevent malicious actors from exploiting smart-home devices and causing service interruptions.

    In addition to potentially lucrative cybersecurity opportunities for semiconductor companies, smart-home devices offer the promise of creating recurring revenue streams to support a sustainable “silicon to services” model. As an example, MarketingInsider's Christoper Dean highlights Amazon’s popular Echo devices. With at least 15 million Echoes already sold, Echo users are likely to double as active Amazon consumers, leveraging the device to monitor wishlists and discover items they’re subsequently prompted to purchase. Meanwhile, Nest is using thermostat data as a platform to offer energy-management services to utility companies across the United States, with companies paying for meaningful and actionable customer information on a subscription basis.

    Automotive

    According to IC Insights, chip sales for automotive systems and the IoT will grow 70% faster than total IC revenues between 2016 and 2021. Specifically, IC sales for automobiles and other vehicles are forecast to jump from $22.9 billion in 2016 to $42.9 billion in 2021, while revenues for IoT functionality will increase from $18.4 billion in 2016 to $34.2 billion in 2021.

    The projected increase in automotive chip sales is hardly surprising, as modern vehicles are essentially a network of networks equipped with a range of embedded communication methods and capabilities. However, this means vehicles are now more vulnerable to cyberattacks than ever before.

    Potential security vulnerabilities include unprotected vehicle-to-vehicle communication, the unauthorized collection of driver or passenger information, seizing control of critical systems such as brakes or accelerators, intercepting vehicle data, tampering with third-party dongles, and altering over-the-air (OTA) firmware updates. In terms of the latter, automotive manufacturers are now focusing on providing secure OTA updates for various systems, with the global automotive OTA update market projected to grow at a CAGR of 18.2% from 2017 to 2022 and reach $3.89 billion by 2022.

    Automotive manufacturers are also working to ensure that the vehicle supply chain is kept free of stolen and counterfeit components. Nevertheless, a wide range of gray-market devices can still be found powering high-value modules such as in-vehicle infotainment systems and headlights, as well as in critical safety systems including airbag modules, braking modules, and powertrain controls. Shielding vehicle peripherals and components against tampering by implementing a range of layered hardware and software security solutions have therefore become a priority for a number of automotive manufacturers.

    In addition to implementing layered security solutions, the semiconductor industry would clearly benefit from adopting an IoT "as-a-service" approach to the automotive sector. As an example, companies could deploy sensor-based vehicle systems that proactively detect potential issues and malfunctions. This solution, which, in its most optimal configuration, would combine silicon and services, could be sold as a hardware and software product, or deployed as a service with subscription fees generated on a monthly or annual basis.

    Medical and Healthcare

    Long-life implanted medical devices will undoubtedly require a high degree of future-proofing from the semiconductor industry to avoid frequent physical upgrades and maintenance. Srihari Yamanoor, an R&D design specialist at Stellartech Research Corp., notes that medical devices will ultimately be customized to meet the needs of individual patients, thereby increasing the application of precision medicine.

    Moreover, the health insurance industry is expected to leverage machine learning to optimize and reduce the cost of care, while digital health devices will also be used by the insurance industry to identify at-risk patients and provide assistance. Medical devices, especially implantable models, should therefore be designed to support a “silicon to services model” via in-field feature configuration and secure OTA updates, as well as PaaS-based services, including the collection and analysis of relevant data; proactive maintenance, advanced algorithms; and an intuitive UI for both patients and doctors.

    Open-Source Hardware and Disaggregated Chiplets

    Alongside services, open-source hardware offered by organizations and companies such as RISC-V and SiFive have begun to positively disrupt the semiconductor industry by encouraging innovation, reducing development costs and accelerating time-to-market.

    The success of open-source software—as opposed to a closed, walled-garden approach—continues to set an important precedent for the semiconductor industry. Faced with prohibitively expensive development costs, a number of companies are opting to avoid unnecessary toll collectors while placing more of an emphasis on open-source architecture as they work to create new service-centric revenue streams.

    In addition to open-source hardware, the concept of building silicon from pre-verified chiplets is beginning to gain traction as the semiconductor industry moves to slash costs and reduce time-to-market for heterogeneous designs. According to Semiconductor Engineering's Ann Steffora Mutschler, the chiplet concept has been on the drawing board for some time, although it was historically perceived as a potential future direction rather than a tangible solution in the shadow of waning Moore’s Law. This perception is beginning to shift as design complexity increases, particularly at advanced nodes (10/7 nm), and as new markets that require semi-customized solutions coalesce.

    The concept of pre-verified chiplets has piqued the interest of the U.S. Defense Advanced Research Projects Agency (DARPA), which recently rolled out its Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. In collaboration with the semiconductor industry, the successful implementation of CHIPS would see a range of IP blocks, subsystems, and chips combined on an interposer in a 2.5D-like package.

    The CHIPS initiative took center stage in August 2017, when participants from the military, commercial, and academic sectors gathered at DARPA headquarters at the official kickoff meeting for the Agency’s Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.

    As DARPA's Dr. Daniel Green detailed during the conference, the program seeks to develop a new technological framework in which different functionalities and blocks of intellectual property—among them, data storage, computation, signal processing, and managing the form and flow of data—can be segregated into small chiplets. They then can be mixed, matched, and combined onto an interposer, somewhat like joining the pieces of a jigsaw puzzle. In fact, says Green, an entire conventional circuit board with a variety of different but full-sized chips could ultimately be shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.

    According to DARPA, specific technologies that could emerge from the CHIPS initiative include compact replacements for entire circuit boards, ultra-wideband radio frequency (RF) systems, and fast-learning systems for extracting interesting and actionable information from much larger volumes of mundane data.

    Perhaps not surprisingly, the semiconductor industry is already eyeing a disaggregated approach in the form of SerDes chiplets and specialized low-power, application-specific die-to-die interfaces. To be sure, viable silicon disaggregation can be achieved by moving high-speed interfaces like SerDes to separate die in the form of SerDes chiplets, shifting analog sensor IP to separate analog chips and implementing very low-power and low-latency die-to-die interfaces through MCM or through an interposer using 2.5D technology.

    Beyond leveraging known-good die for SerDes in more mature nodes (N-1) or vice versa, disaggregation is expected to facilitate the creation of multiple SKUs, while optimizing cost and reducing risk. More precisely, disaggregation will see SoCs broken out into higher-yielding, smaller dies and allow companies to create specific designs with multiple variants. Indeed, die-to-die interfaces can more easily accommodate diverse applications across memory, logic and analog technology. In addition, die-to-die interfaces don’t require a matching line/baud rate and number of lanes, while FEC may or may not be required depending on latency requirements.

    It should be noted that multiple companies are actively pursuing SoC/ASIC aggregation for switches and other systems. Similarly, the semiconductor industry is developing ASICs with die-to-die interfaces on leading FinFET nodes, while at least one next-generation server chip is being designed with disaggregated I/Os on a separate die.

    Conclusion

    Over the past five years, the semiconductor industry has faced numerous complex challenges. These include increased development costs, eroded ASPs, market saturation, and heightened, yet unsustainable M&A activity. Through 2018, the semiconductor industry continues to seek a return to stability and organic growth within the parameters of a new business paradigm that’s both viable and collaborative. Within this context, semiconductor companies are acknowledging the potential of new markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data center to the mobile edge.

    This includes end-to-end IoT security solutions and PaaS-based services such as in-field feature configuration, advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers. In addition to services, the concept of open-source hardware and building silicon from disaggregated, pre-verified chiplets is beginning to gain traction as companies move to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the full potential of semiconductors will undoubtedly vary, which is why it’s important for us to explore a future in which the industry, along with various research organizations and government offices, plays an open and collaborative role in helping to sustainably monetize both silicon and services.

    For more information on this topic, check out Rambus’ site.

    Shrikant Lohokare, Ph.D., is Vice President and Executive Director, North America for the Global Semiconductor Alliance.



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    Cisco 650-367 Exam (Advanced Collaboration Architecture Sales Specialist) Detailed Information



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