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For now, AI techniques are often laptop researching-based mostly and “slender” – potent as they're by way of cutting-edge specifications, they may be confined to performing just a few, narrowly-defined projects. AI of the next decade will leverage the more advantageous vigor of deep discovering and develop into broader, solving a more advantageous array of extra complex issues. furthermore, the usual-aim technologies used today for AI deployments will get replaced by a technology stack that’s AI-certain and exponentially quicker – and it’s going to take a lot of money.
seeking to take center stage in AI’s unfolding, IBM – in mixture with manhattan state and a few know-how heavies – is investing $2 billion within the IBM analysis AI Hardware center, concentrated on establishing subsequent technology AI silicon, networking and manufacturing on the way to, IBM observed, bring 1,000x AI efficiency effectivity improvement over the subsequent decade.
“nowadays, AI’s ever-increasing sophistication is pushing the boundaries of the trade’s existing hardware techniques as clients discover greater how you can incorporate a considerable number of sources of records from the facet, web of things, and extra,” brought up Mukesh Khare, VP, IBM research Semiconductor and AI Hardware group, in a weblog announcing the venture. “…nowadays’s systems have achieved greater AI performance through infusing computing device-discovering capabilities with high-bandwidth CPUs and GPUs, really good AI accelerators and excessive-performance networking equipment. To preserve this trajectory, new considering is required to accelerate AI efficiency scaling to suit to ever-expanding AI workload complexities.”
IBM observed the middle could be the nucleus of a new ecosystem of analysis and commercial companions participating with IBM researchers. companions introduced today encompass Samsung for manufacturing and research, Mellanox technologies for high-performance interconnect device, Synopsys for application structures, emulation and prototyping, and IP for developing high-efficiency silicon chips, and semiconductor equipment businesses utilized materials and Tokyo Electron.
Hosted at SUNY Polytechnic Institute, Albany, big apple, in collaboration with neighboring Rensselaer Polytechnic Institute middle for Computational innovations, IBM pointed out the enterprise and its partners will “develop a range of technologies from chip level devices, substances, and architecture, to the utility aiding AI workloads.”
big Blue pointed out analysis on the core will focal point on overcoming “existing laptop-learning boundaries through procedures that include approximate computing through Digital AI Cores and in-memory computing via Analog AI Cores. These applied sciences will provide the thousand-fold increases in performance effectivity required for full cognizance of deep discovering AI, the next predominant milestone in AI evolution, in accordance with IBM.
“A key enviornment of research and development should be methods that meet the demands of deep researching inference and working towards approaches,” Khare pointed out. “Such programs offer significant accuracy advancements over greater frequent laptop getting to know for unstructured facts. these extreme processing demands will develop exponentially as algorithms turn into more advanced with a view to convey AI programs with elevated cognitive knowledge.”
Khare referred to the research middle will host R&D, emulation, prototyping, checking out and simulation actions for new AI cores principally designed for training and deploying advanced AI models, together with a test mattress during which members can show innovations in precise-world purposes. really expert wafer processing for the core can be executed in Albany with some guide at IBM’s Thomas J. Watson research core in Yorktown Heights, the big apple.
during this slidecast, Chris Porter and Jeff Kamiol from IBM describe how IBM high performance features convey versatile, utility-able clusters within the cloud for businesses that deserve to promptly and economically add computing capacity for high performance application workloads.
IBM high performance features allows quick deployment of technical computing, analytics or Hadoop workloads in the cloud. groups the usage of the service can quite simply meet extra useful resource demands without the cost of purchasing or managing in-condominium infrastructure, minimizing their administrative burden and right away addressing evolving enterprise needs. The features encompass market-leading IBM Platform LSF and IBM Platform Symphony workload administration software, IBM Spectrum Scale application defined storage, IBM excessive performance features for Hadoop and the new IBM high efficiency services for EDA. The application is integrated, provisioned and deployed as a part of comprehensive, built-in services which comprises bare-metal IBM SoftLayer infrastructure, non-compulsory InfinfiBand interconnects and help from an skilled and committed cloud operations crew. a worldwide presence with the choice of facts core region helps be sure that records regulations are met.
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newsIBM Introduces expertise to enhance memory performance
IBM plans to ultimately prolong the know-how, referred to as reminiscence expansion technology or MXT, to other servers in the xSeries, which is IBM's line of Intel-based mostly systems.
"it be a brand new chipset that IBM research developed," says Jeff Benc, director of IBM xSeries advertising and marketing. "a new reminiscence controller and an L3 cache work together to without difficulty double the amount of usable reminiscence."
The hardware controller employs an algorithm to encode information in main reminiscence, using half the house a traditional memory controller would use, Benc explains. The L3 excessive-speed cache, meanwhile, sits subsequent to the processor to feed the most often used data to the chip. "you could installation 512 MB of memory and get a GB of memory [in certain applications]," Benc says.
IBM will can charge just a few hundred greenbacks extra for xSeries 330s with the memory-enhancing know-how. On balance, purchasers will nevertheless pay a whole lot of greenbacks lower than they would for machines with more physical memory, in keeping with IBM.
The xSeries 330 is IBM's 1U rack-dense server, which additionally facets IBM's cable chaining technology that enables every server to hook up with the one above and below in a daisy-chain configuration rather than having each server in the rack hook up with a KVM switchbox.
IBM has licensed MXT to chipset manufacturer ServerWorks, but Benc estimates that IBM has about 4 months of lead time before other vendors can deliver out techniques based on a ServerWorks MXT chipset.
Scott Bekker is editor in chief of Redmond Channel companion journal.
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See the full list of top rack server vendorsBottom Line
The SR630 from Lenovo offers plenty of memory and storage capacity, along with versatile configurations. It also comes with enterprise-class RAS features. With world record benchmark scores for 1-processor rack server performance for compute-intensive applications (on two key benchmarks), it offers plenty of bang for the buck.
That makes this rack server ideal for single-threaded compute-intensive applications, such as High Frequency Trading (HFT), and other financial industry workloads. All that comes at a premium price, making it more suitable for large enterprise users, as well as SMEs with demanding applications.
This Lenovo is at a similar price range to the IBM Power S922 included in this guide. The IBM model wins on memory while the Lenovo machine provides far more storage.Product Description:
The Lenovo ThinkSystem SR630 is a 2-socket 1U rack server suitable for a wide range of workloads for small businesses and large enterprises. It offers reliability, management, security, performance, and the flexibility for future growth. The SR630 server is designed to handle databases, virtualization, cloud computing, infrastructure security, systems management, collaboration/email, streaming media, web serving, High Performance Computing (HPC), and other workloads.
Featuring the Intel Xeon Processor Scalable Family, it delivers scalable performance and storage capacity. It supports up to two processors, up to 3 TB of 2666 MHz TruDDR4 memory, up to 12x 2.5-inch or 4x 3.5-inch drive bays with an extensive choice of NVMe PCIe SSDs, SAS/SATA SSDs, and SAS/SATA HDDs. The company also provides flexible I/O expansion options with the LOM slot, the dedicated storage controller slot, and up to 3x PCIe slots.
The SR630 server features an AnyBay design that allows a choice of drive interface types in the same drive bay: SAS drives, SATA drives, or U.2 NVMe PCIe drives. Onboard NVMe PCIe ports allow direct connections to the U.2 NVMe PCIe SSDs, which frees up I/O slots and helps lower NVMe solution acquisition costs. It is designed to meet ASHRAE A4 standards in select configurations, which enable users to lower energy costs, while still maintaining reliability.Features:
Number of processors:
Intel Xeon Scalable Processors, covering Platinum, Gold, Silver and Bronze
Cores per processor:
Up to 28 cores
Maximum processor frequency/cache:
3.6GHz; Maximum cache – 38.5MB
I/O expansion slots:
Up to 3x PCIe slots + internal RAID slot + Flexible LOM slot
Maximum memory/# slots/speed:
3TB / 24x DIMM slots / 2666MHz
Maximum Persistent Memory:
Apache pass will be available with CPU refresh coming in 2019.
“I really appreciate the robust performance,” said a Senior Consultant at a tech services company.
12 Gbps SAS/6 Gbps SATA RAID:
12 Gbps SAS/6 Gbps SATA non-RAID:
NVMe PCIe SSD:
“Technical support was very good. IBM support is very helpful and the initial setup was straightforward,” said a Senior Consultant at a tech services company.Key Markets and Use Cases:
An SR630 with a pair of Xeon 6136 CPUs, 512 GB of memory, and 2 1.6TB NVMe SSDs has a list price of $39,310.
Max processor frequency
3.6GHz; Maximum cache – 38.5MB
Max persistent memory
CPU refresh in 2019
2 Intel Xeon Scalable
The largest shingled solar cell production facility in the Western Hemisphere at 220 MW, marking the first of a group of massive factories expected to go on-line this year.February 8, 2019pv magazine
Four months after acquiring the former SolarWorld Americas facility in Hillsboro, Oregon, SunPower has the plant up and running, to the tune of 220 MW of annual production capacity.
The company has begun production of its novel P-Series solar modules. The P-Series module features slices of crystalline silicon cells arranged in vertical strips, which are then shingled on top of one another, delivering an impressive 19% efficiency at the module. The P-Series modules are slightly larger than a standard 72-cell module and much cheaper than SunPower’s E-Series and X-Series products, while delivering a power rating of 390-395 watts.
The factory features a workforce of around 200, which is down from the 700 that SolarWorld Americas had working when production was at its peak.
“Today we celebrate the revival of American solar panel manufacturing as SunPower’s high-quality P19 product starts coming off the line in Oregon,” said Tom Werner, SunPower CEO and chairman of the board in a release announcing the production. “Now that we’re in full production, we look forward to meeting our strong U.S. commercial market demand with these high-performance American-assembled panels.”
Now not to downplay Werner’s excitement, but he may be getting ahead of himself dubbing this factory to be “the revival of American solar panel manufacturing.” 220 MW is nice, better than nice, really, but it doesn’t compare to the 3.7 GW across 4 factories that are underway and expected to come on-line later this year, all of which are larger plants. These include the 1.6 GW Hanwha Q Cells factory planned for Georgia, the 1.2 GW First Solar factory under construction in Ohio, LG’s 500 MW factory in Alabama and the 400 MW JinkoSolar plant in Jacksonville, Florida.
To go back to the P-Series, it’s really an interesting piece of tech. Because the cells are shingled on top of one another, the conductive adhesive between the cells does not have the same issues with thermal expansion that other modules on the market have with their as copper ribbons between cells. The P-Series are manufactured with the intent of being used in commercial and industrial installations. They also feature SunPower’s confident standard of a 25-year warranty.
One last interesting note is that the 220 MW capacity mark gives this factory the distinction of having the largest capacity of shingled solar cell production known to pv magazine, and definitely the biggest in the United States or anywhere outside of China.
author: Tim Sylvia
The roadmap for upcoming AMD products has been pretty murky lately, but the company revealed some of its key plans for the next few years at its Financial Analyst Day today.
The zen of ZenThe biggest news has to do with Zen, the new x86-compatible CPU core meant to replace the current Bulldozer family. Today's presentations didn't go deep into the technical details of the new architecture, but what we learned was largely encouraging. We know the general timeline and outlines of the first Zen-based products.
First of all, Zen is indeed a new high-performance core intended to compete against Intel's best x86 processors. AMD expects this core to deliver about 40% higher performance per clock cycle than today's Bulldozer variants, as the slide above indicates. Zen looks to be more of a "brainiac" architecture like K8 and Broadwell than a "speed demon" like the Pentium 4 and members of the Bulldozer lineage.
Also, the first Zen-based cores are just the beginning. Future "Zen+" variants of this architecture should improve per-clock performance even further.
The Zen core will feature simultaneous multithreading (SMT), or the ability to track and execute multiple threads per core. Although SMT can extend beyond this limit, Zen's version of SMT will stop at two threads per core, like today's big Intel cores. The inclusion of dual threads per core follows a proven template for success in big x86 CPUs, and it also should put AMD on more equal footing with Intel from a marketing standpoint.
The other reassuring technical detail is Zen's addition of a "high-bandwidth, low-latency cache system." Bulldozer's caches have been considered something of a pain point since the first chips arrived, and they clearly don't perform as well in directed subsystem tests as the caches on recent Intel CPUs. Thus, this little nugget also seems like good news.
AMD expects to bring the first Zen-based silicon to market in 2016, and those chips will be based on a chip fabrication process that uses FinFETs, also known as 3D transistors. The use of FinFETs is positive news in the sense that it should allow for faster switching speed and lower voltage operation than traditional planar transitors—and AMD's major competitor will be producing chips on its second or third generation of 3D transistors by 2016. AMD didn't reveal the specific foundry or process on which these chips will be made, but the obvious list of candidates is pretty small, including the 14- and 16-nm FinFET processes at Samsung, GlobalFoundries, and TSMC.
A many-core processor for high-end desktops and servers in 2016What's really intriguing about the first Zen-based silicon is the sort of systems it will target. My sense is that AMD will produce a single high-end CPU and aim it at two markets: high-end desktop PCs and servers. The roadmaps for Opteron and FX processors describe a chip based on the Zen core with a "high core count with multi-threading," ample memory bandwidth, and lots of built-in I/O.
On the desktop side of things, the Zen-based FX processors will be supported by a new AM4 platform that includes support for DDR4 memory. This same AM4 platform will also support smaller APU chips, unifying the company's desktop offerings around a single socket.
Into 2017 and beyondThe downside of the news about a big, Zen-based chip in 2016 is that AMD apparently had to prioritize this one chip over other options. The company's 2016 APU products for desktops and mobile systems will not yet incorporate the Zen core. Also, the schedule for the K12 core, the ARM-compatible sister to Zen, has been pushed back to 2017. CEO Lisu Su further revealed that Project Skybridge, the effort to make ARM- and x86-compatible CPUs share the same sockets and motherboards, has been nixed, reputedly due to lack of customer demand.
What we know of AMD's plans for 2017 looks intriguing. One chip in particular, mentioned in the datacenter roadmap, appears to be something different from anything we've seen before: a "high-performance server APU." This product may be the first from AMD to combine a best-of-breed x86 CPU with truly powerful graphics on the same chip. The major limitation preventing this sort of converged product in the past has been the bandwidth available in a CPU socket. Simply put, CPU sockets haven't had the capacity to support a data-streaming processor like a GPU.
The CPU-socket bottleneck may be alleviated by the "transformational memory architecture" mentioned on the roadmap, which is almost certainly the high-bandwidth memory (HBM) subsystem that AMD has been developing for use with its GPUs. HBM situates the memory on the package next to the chip it serves, such as a GPU or an SoC, and promises substantially higher bandwidth than traditional DRAM in combination with lower power consumption. The total physical size of the chip-plus-memory solution can be much smaller with HBM, as well. AMD's execs strongly hinted that HBM will make its way across the company's products going forward, and this server-class APU looks to be one beneficiary.
That prospect is exciting because it could give AMD a foothold in markets like HPC and supercomputing, where it hasn't really mounted a credible challenge to rivals like Intel and Nvidia in recent years. This big server-class APU could also begin to deliver on the promise of AMD's HSA programming model, which has so far been full of promise but lacking truly compelling hardware implementations.
This big APU won't just target servers, either. AMD hasn't officially extended its desktop roadmap into 2017, but a source familiar with the firm's plans has indicated to us that a beefy APU of this sort could make its way into client systems like laptops and desktops, as well. The vision here is for a single-package product with HBM to combine a high-performance CPU with a Radeon graphics solution that has real gaming chops—something well beyond the offerings we've seen from AMD's own APU lineup and Intel's Core i5/i7 processors to date. If it works out well, such a product could give AMD a product unlike anything else available: a decent gaming PC in a compact package, ready for gaming laptops, all-in-ones, and small-form-factor systems.
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Autodesk [2 Certification Exam(s) ]
Avaya [96 Certification Exam(s) ]
AXELOS [1 Certification Exam(s) ]
Axis [1 Certification Exam(s) ]
Banking [1 Certification Exam(s) ]
BEA [5 Certification Exam(s) ]
BICSI [2 Certification Exam(s) ]
BlackBerry [17 Certification Exam(s) ]
BlueCoat [2 Certification Exam(s) ]
Brocade [4 Certification Exam(s) ]
Business-Objects [11 Certification Exam(s) ]
Business-Tests [4 Certification Exam(s) ]
CA-Technologies [21 Certification Exam(s) ]
Certification-Board [10 Certification Exam(s) ]
Certiport [3 Certification Exam(s) ]
CheckPoint [41 Certification Exam(s) ]
CIDQ [1 Certification Exam(s) ]
CIPS [4 Certification Exam(s) ]
Cisco [318 Certification Exam(s) ]
Citrix [48 Certification Exam(s) ]
CIW [18 Certification Exam(s) ]
Cloudera [10 Certification Exam(s) ]
Cognos [19 Certification Exam(s) ]
College-Board [2 Certification Exam(s) ]
CompTIA [76 Certification Exam(s) ]
ComputerAssociates [6 Certification Exam(s) ]
Consultant [2 Certification Exam(s) ]
Counselor [4 Certification Exam(s) ]
CPP-Institue [2 Certification Exam(s) ]
CPP-Institute [1 Certification Exam(s) ]
CSP [1 Certification Exam(s) ]
CWNA [1 Certification Exam(s) ]
CWNP [13 Certification Exam(s) ]
Dassault [2 Certification Exam(s) ]
DELL [9 Certification Exam(s) ]
DMI [1 Certification Exam(s) ]
DRI [1 Certification Exam(s) ]
ECCouncil [21 Certification Exam(s) ]
ECDL [1 Certification Exam(s) ]
EMC [129 Certification Exam(s) ]
Enterasys [13 Certification Exam(s) ]
Ericsson [5 Certification Exam(s) ]
ESPA [1 Certification Exam(s) ]
Esri [2 Certification Exam(s) ]
ExamExpress [15 Certification Exam(s) ]
Exin [40 Certification Exam(s) ]
ExtremeNetworks [3 Certification Exam(s) ]
F5-Networks [20 Certification Exam(s) ]
FCTC [2 Certification Exam(s) ]
Filemaker [9 Certification Exam(s) ]
Financial [36 Certification Exam(s) ]
Food [4 Certification Exam(s) ]
Fortinet [13 Certification Exam(s) ]
Foundry [6 Certification Exam(s) ]
FSMTB [1 Certification Exam(s) ]
Fujitsu [2 Certification Exam(s) ]
GAQM [9 Certification Exam(s) ]
Genesys [4 Certification Exam(s) ]
GIAC [15 Certification Exam(s) ]
Google [4 Certification Exam(s) ]
GuidanceSoftware [2 Certification Exam(s) ]
H3C [1 Certification Exam(s) ]
HDI [9 Certification Exam(s) ]
Healthcare [3 Certification Exam(s) ]
HIPAA [2 Certification Exam(s) ]
Hitachi [30 Certification Exam(s) ]
Hortonworks [4 Certification Exam(s) ]
Hospitality [2 Certification Exam(s) ]
HP [750 Certification Exam(s) ]
HR [4 Certification Exam(s) ]
HRCI [1 Certification Exam(s) ]
Huawei [21 Certification Exam(s) ]
Hyperion [10 Certification Exam(s) ]
IAAP [1 Certification Exam(s) ]
IAHCSMM [1 Certification Exam(s) ]
IBM [1532 Certification Exam(s) ]
IBQH [1 Certification Exam(s) ]
ICAI [1 Certification Exam(s) ]
ICDL [6 Certification Exam(s) ]
IEEE [1 Certification Exam(s) ]
IELTS [1 Certification Exam(s) ]
IFPUG [1 Certification Exam(s) ]
IIA [3 Certification Exam(s) ]
IIBA [2 Certification Exam(s) ]
IISFA [1 Certification Exam(s) ]
Intel [2 Certification Exam(s) ]
IQN [1 Certification Exam(s) ]
IRS [1 Certification Exam(s) ]
ISA [1 Certification Exam(s) ]
ISACA [4 Certification Exam(s) ]
ISC2 [6 Certification Exam(s) ]
ISEB [24 Certification Exam(s) ]
Isilon [4 Certification Exam(s) ]
ISM [6 Certification Exam(s) ]
iSQI [7 Certification Exam(s) ]
ITEC [1 Certification Exam(s) ]
Juniper [64 Certification Exam(s) ]
LEED [1 Certification Exam(s) ]
Legato [5 Certification Exam(s) ]
Liferay [1 Certification Exam(s) ]
Logical-Operations [1 Certification Exam(s) ]
Lotus [66 Certification Exam(s) ]
LPI [24 Certification Exam(s) ]
LSI [3 Certification Exam(s) ]
Magento [3 Certification Exam(s) ]
Maintenance [2 Certification Exam(s) ]
McAfee [8 Certification Exam(s) ]
McData [3 Certification Exam(s) ]
Medical [69 Certification Exam(s) ]
Microsoft [374 Certification Exam(s) ]
Mile2 [3 Certification Exam(s) ]
Military [1 Certification Exam(s) ]
Misc [1 Certification Exam(s) ]
Motorola [7 Certification Exam(s) ]
mySQL [4 Certification Exam(s) ]
NBSTSA [1 Certification Exam(s) ]
NCEES [2 Certification Exam(s) ]
NCIDQ [1 Certification Exam(s) ]
NCLEX [2 Certification Exam(s) ]
Network-General [12 Certification Exam(s) ]
NetworkAppliance [39 Certification Exam(s) ]
NI [1 Certification Exam(s) ]
NIELIT [1 Certification Exam(s) ]
Nokia [6 Certification Exam(s) ]
Nortel [130 Certification Exam(s) ]
Novell [37 Certification Exam(s) ]
OMG [10 Certification Exam(s) ]
Oracle [279 Certification Exam(s) ]
P&C [2 Certification Exam(s) ]
Palo-Alto [4 Certification Exam(s) ]
PARCC [1 Certification Exam(s) ]
PayPal [1 Certification Exam(s) ]
Pegasystems [12 Certification Exam(s) ]
PEOPLECERT [4 Certification Exam(s) ]
PMI [15 Certification Exam(s) ]
Polycom [2 Certification Exam(s) ]
PostgreSQL-CE [1 Certification Exam(s) ]
Prince2 [6 Certification Exam(s) ]
PRMIA [1 Certification Exam(s) ]
PsychCorp [1 Certification Exam(s) ]
PTCB [2 Certification Exam(s) ]
QAI [1 Certification Exam(s) ]
QlikView [1 Certification Exam(s) ]
Quality-Assurance [7 Certification Exam(s) ]
RACC [1 Certification Exam(s) ]
Real-Estate [1 Certification Exam(s) ]
RedHat [8 Certification Exam(s) ]
RES [5 Certification Exam(s) ]
Riverbed [8 Certification Exam(s) ]
RSA [15 Certification Exam(s) ]
Sair [8 Certification Exam(s) ]
Salesforce [5 Certification Exam(s) ]
SANS [1 Certification Exam(s) ]
SAP [98 Certification Exam(s) ]
SASInstitute [15 Certification Exam(s) ]
SAT [1 Certification Exam(s) ]
SCO [10 Certification Exam(s) ]
SCP [6 Certification Exam(s) ]
SDI [3 Certification Exam(s) ]
See-Beyond [1 Certification Exam(s) ]
Siemens [1 Certification Exam(s) ]
Snia [7 Certification Exam(s) ]
SOA [15 Certification Exam(s) ]
Social-Work-Board [4 Certification Exam(s) ]
SpringSource [1 Certification Exam(s) ]
SUN [63 Certification Exam(s) ]
SUSE [1 Certification Exam(s) ]
Sybase [17 Certification Exam(s) ]
Symantec [134 Certification Exam(s) ]
Teacher-Certification [4 Certification Exam(s) ]
The-Open-Group [8 Certification Exam(s) ]
TIA [3 Certification Exam(s) ]
Tibco [18 Certification Exam(s) ]
Trainers [3 Certification Exam(s) ]
Trend [1 Certification Exam(s) ]
TruSecure [1 Certification Exam(s) ]
USMLE [1 Certification Exam(s) ]
VCE [6 Certification Exam(s) ]
Veeam [2 Certification Exam(s) ]
Veritas [33 Certification Exam(s) ]
Vmware [58 Certification Exam(s) ]
Wonderlic [2 Certification Exam(s) ]
Worldatwork [2 Certification Exam(s) ]
XML-Master [3 Certification Exam(s) ]
Zend [6 Certification Exam(s) ]
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